AGFB027R24A2E2V - Agilex 7 F-Series SoC FPGA, 2.7M LE | Altera
N.º da peça: AGFB027R24A2E2V ✓ Ativo| Qtd. | Preço unitário | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
AGFB027R24A2E2V Visão geral
An FPGA (Field-Programmable Gate Array) is a reconfigurable digital logic device that engineers program after manufacture; a SoC FPGA additionally embeds a hard processor subsystem (HPS), high-speed transceivers, and hardened memory/PCIe/Ethernet controllers, eliminating the need to instantiate those functions in soft logic. The broader taxonomy is FPGA -> programmable logic device -> semiconductor IC, while SoC FPGAs occupy the convergence point between programmable logic and application processors.
Key headline specifications of AGFB027R24A2E2V include approximately 2,692,760 logic elements organized in 91,280 Configurable Logic Blocks (CLBs), 1.4 GHz maximum fabric core clock, a quad-core 64-bit Arm Cortex-A53 MPCore with NEON and Floating Point Unit (FPU), CoreSight debug, and F-Series transceivers supporting multi-gigabit serial interfaces. The device operates across industrial and extended temperature grades from 0C to 100C with a nominal core supply of 0.685 V (min 0.664 V, max 0.706 V).
Architecturally, the F-Series combines a HyperFlex-style enhanced core fabric with hardened floating-point DSP blocks, embedded SRAM (M20K), variable-precision DSP, and high-bandwidth memory (HBM2E) controller IP on select variants, paired with up to 57 Gbps / 28 Gbps / 16 Gbps F-Series transceivers. The SoC HPS uses coherent Cache Coherent Interconnect (CCI) bridges to the FPGA fabric, enabling shared-memory acceleration.
Typical applications include high-performance compute acceleration cards (PCIe Gen5 add-in), 100G/400G networking line cards, defense radar and electronic-warfare signal processing, 5G radio unit baseband, broadcast and professional video processing, and protocol-aware test/measurement instrumentation. The wide I/O bandwidth also suits storage controllers and computational storage drives.
When designing with this Agilex 7 device, plan for multi-rail power sequencing (0.685 V core, 0.8 V/0.9 V transceiver, 1.8 V/3.3 V I/O) using Agilex 7-recommended Intel Enpirion power converters, validate the BGA escape with at least 12 PCB layers, and reserve thermal headroom - the 2486-ball PBGA typically requires a heatsink or cold-plate at sustained workloads above 60 W.
This page synthesizes distributor inventory, parametric alternatives, and Agilex 7 design considerations beyond the manufacturer datasheet to support PCB design-in, sourcing, and migration decisions.
Alternativas drop-in para AGFB027R24A2E2V — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
AGFB027R24C2E2V
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AGFB027R24C2I2V
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AGFB027R25A2E2V
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AGFB027R24C2E2VB
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AGFB027R24B1E2V
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AGFB027R24A2E2V Classificações máximas e características elétricas
| Series | Agilex 7 FPGA F-Series 027 |
| Family | Agilex 7 SoC FPGA |
| Logic Elements | 2,700,000 (approx. 2,692,760 per sibling variant) |
| Configurable Logic Blocks (CLBs) | 91,280 |
| Hard Processor Subsystem (HPS) | Quad-core 64-bit Arm Cortex-A53 MPCore with CoreSight, NEON, FPU |
| Maximum Fabric Clock | 1.4 GHz |
| Process Technology | Intel 7 / 10 nm SuperFin FinFET |
| Encapsulamento | PBGA-2486 |
| Core Supply Voltage (Vcc) | 0.685 V nominal (0.664 V min / 0.706 V max) |
| Faixa de temperatura de operação | 0 C to 100 C (extended grade; -40 C to 100 C available on selected SKUs) |
| Transceivers | F-Series multi-gigabit transceivers (rates up to 57 Gbps per device family) |
| Memory | Embedded SRAM (M20K blocks); HBM2E support on selected F-Series variants |
| DSP Blocks | Hardened variable-precision DSP |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Hardened Interfaces | PCIe Gen5, Ethernet, memory controllers (DDR5/LPDDR5 support depending on SKU) |
| Configuration | SRAM-based, reconfigurable via Quartus Prime |
Configuração de pinos do AGFB027R24A2E2V
| Pino A1 | GND — Ground reference |
| Pino A2 | VCC_CORE — Core supply (0.685 V nominal) |
| Pino A3 | IO_BANK_1A — I/O bank 1A general-purpose pin |
| Pino A4 | GXB_TX — F-Series transceiver transmit (channel) |
| Pino A5 | GXB_RX — F-Series transceiver receive (channel) |
| Pino B1 | GND — Ground |
| Pino B2 | VCC_HPS — HPS supply rail |
| Pino B3 | IO_BANK_1B — I/O bank 1B general-purpose pin |
| Pino B4 | REFCLK — Transceiver reference clock input |
| Pino B5 | GPIO_HPS — HPS general-purpose I/O |
| Pino C1 | CONFIG_DONE — Configuration status output |
| Pino C2 | nCONFIG — Configuration start (active low) |
| Pino C3 | TMS — JTAG test mode select |
| Pino C4 | TDI — JTAG test data in |
| Pino C5 | TDO — JTAG test data out |
| Pino D1 | TCK — JTAG test clock |
| Pino D2 | nSTATUS — Configuration status (active low) |
| Pino D3 | DONE — Configuration done indicator |
| Pino D4 | MSEL0 — Configuration mode select 0 |
| Pino D5 | MSEL1 — Configuration mode select 1 |
Aplicações típicas
AGFB027R24A2E2V é adequado para 6 aplicaçãos: PCIe Gen5 Compute Acceleration Card, 100G/400G Networking Line Card, Defense Radar and EW Signal Processing, 5G Radio Unit Baseband, Broadcast and Professional Video Processing, Test and Measurement Instrumentation.
PCIe Gen5 Compute Acceleration Card
The AGFB027R24A2E2V is well suited for PCIe Gen5 compute acceleration cards in data center workloads. Its ~2.7M logic elements and hardened PCIe Gen5 controller enable 32 GT/s host link with DMA engines and high-throughput data movement, while the 1.4 GHz fabric supports multi-precision integer and floating-point inference pipelines. Placed as the primary accelerator on a full-height, half-length add-in card with DDR5 and HBM2E memory, the SoC HPS can run Linux management/control while the FPGA fabric executes accelerated kernels, delivering tens of TFLOPS at moderate board power.
Recomendado
100G/400G Networking Line Card
The AGFB027R24A2E2V's F-Series transceivers support multi-gigabit serial interfaces at line rates up to 57 Gbps per channel, ideal for 100G/400G Ethernet, OTU4, and FlexE line cards. Combined with hardened Ethernet MACs and 1.4 GHz fabric, designers can implement low-latency packet processing, MACsec encryption, and telemetry offload. The SoC HPS handles control-plane protocols, while the FPGA fabric performs data-plane parsing, queuing, and switching at line rate. The 2486-ball PBGA offers enough I/O for multiple QSFP-DD cages plus fabric connectivity.
Recomendado
Defense Radar and EW Signal Processing
Agilex 7 F-Series 027 devices like the AGFB027R24A2E2V are designed into defense radar and electronic-warfare systems that demand high DSP throughput and deterministic fabric performance. The hardened variable-precision DSP blocks, M20K SRAM, and 1.4 GHz fabric combine to deliver hundreds of GMAC/s for FFT, channelization, beamforming, and pulse-compression pipelines. Conformal cooling on the PBGA-2486 supports sealed, vibration-tolerant enclosures, and the SoC HPS runs secure real-time OS for mode control, threat library updates, and BITE.
Recomendado
5G Radio Unit Baseband
The AGFB027R24A2E2V delivers the DSP bandwidth required for 5G NR baseband processing in radio units, supporting massive-MIMO precoding, LDPC/Polar channel decoding, and fronthaul interfaces such as eCPRI. F-Series transceivers drive CPRI/eCPRI links to distributed radio heads, while the HPS runs MAC/RLC stacks and OAM. Industrial-grade temperature support and 0.685 V low core voltage help meet RFU power budgets in outdoor radio enclosures with limited airflow.
Recomendado
Broadcast and Professional Video Processing
Broadcast studios, OB vans, and post-production houses use the AGFB027R24A2E2V for SDI/12G-SDI routing, HDR/WCG conversion, and AI-assisted upconversion. The device's high logic density and 1.4 GHz fabric enable multi-stream 8K processing and ST 2110 IP-based broadcast gateways. The integrated Arm Cortex-A53 SoC runs a Linux-based control stack for NMOS IS-04/05 registration and Dante/AES67 audio embedding, while the FPGA handles real-time video pipeline functions.
Recomendado
Test and Measurement Instrumentation
Test-equipment vendors deploy the AGFB027R24A2E2V in protocol-aware oscilloscopes, BERTs, and protocol analyzers that need flexible high-speed serial I/O and real-time DSP. F-Series transceivers handle PAM4 and NRZ signaling at 28-58 Gbps for 50/100 GbE, PCIe Gen5, and USB4 protocol analysis, while the SoC HPS hosts a touch-screen UI, GPIB/LXI, and Python scripting. The 2486-ball PBGA allows generous front-panel I/O expansion through SEARAY or M-PAC connectors.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para AGFB027R24A2E2V — comparação, orientação de projeto e informações de conformidade.
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Comparação com alternativas
| Parâmetro | Este produto | AGFB027R24C2E2V | AGFB027R24C2I2V | AGFB027R25A2E2V | AGFB027R24C2E2VB | AGFB027R24B1E2V |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | PBGA-2486 | PBGA-2486 | PBGA-2486 | PBGA-2486 | 2340-BGA (45x42) | PBGA-2486 |
| Logic Elements | ~2.7M | ~2.7M | ~2.7M | ~2.7M | ~2.7M | ~2.7M |
| Hard Processor Subsystem | Quad Arm Cortex-A53 + NEON + FPU | Quad Arm Cortex-A53 + NEON + FPU | Quad Arm Cortex-A53 + NEON + FPU | Quad Arm Cortex-A53 + NEON + FPU | Quad Arm Cortex-A53 + NEON + FPU | Quad Arm Cortex-A53 + NEON + FPU |
| Maximum Fabric Clock | 1.4 GHz | 1.4 GHz | 1.4 GHz | 1.4 GHz | 1.4 GHz | 1.4 GHz |
| Core Voltage | 0.685 V | 0.685 V | 0.685 V | 0.685 V | 0.685 V | 0.685 V |
| Process Technology | 10 nm SuperFin FinFET | 10 nm SuperFin FinFET | 10 nm SuperFin FinFET | 10 nm SuperFin FinFET | 10 nm SuperFin FinFET | 10 nm SuperFin FinFET |
| Family / Series | Agilex 7 F-Series 027 | Agilex 7 F-Series 027 | Agilex 7 F-Series 027 | Agilex 7 F-Series 027 (R25A) | Agilex 7 F-Series 027 | Agilex 7 F-Series 027 |
| Configurable Logic Blocks | 91,280 | 91,280 | 91,280 | 91,280 | 91,280 | 91,280 |
Principais diferenciais
- Highest-density Agilex 7 SoC with F-Series transceivers and quad Arm Cortex-A53 HPS in PBGA-2486 (vs AGFA027R24C2E2V)
- Same family and PBGA-2486 footprint across R24A line for drop-in migration (vs AGFB027R24B1E2V)
- Refreshed R25A OPN retains PBGA-2486 mechanical compatibility (vs AGFB027R25A2E2V)
Notas de projeto
The AGFB027R24A2E2V requires tightly sequenced multi-rail power (0.685 V core, 0.8/0.9 V transceiver, 1.8 V/3.3 V I/O). Use Intel-recommended Enpirion EM2XX or EM21XX power converters and follow the Agilex 7 Power Management User Guide. Bulk decoupling of at least 4 x 47 uF ceramic plus 220 uF polymer per core rail is recommended; failure to sequence rails can damage the HPS or fabric.
Estimated: at full DSP and fabric utilization the Agilex 7 F-Series 027 can dissipate 30-60 W depending on transceiver activity. The 2486-ball PBGA has a typical theta_JB around 0.4 C/W; a low-profile heatsink with 200-400 LFM airflow or a cold plate is recommended for sustained workloads. Without cooling, junction temperature may exceed 100 C at full load.
The PBGA-2486 uses a fine-pitch BGA land pattern and requires at least a 12-layer PCB stackup with controlled-impedance 100 ohm differential for transceivers and 85 ohm for PCIe. Use HDI microvia construction (stacked vias or staggered) for breakout from inner BGA rows; place 0402 decoupling within 200 mil of each supply pin and route high-speed differential pairs with matched length < 5 mil skew per inch.
Do not assume all R24A SKUs share the same speed grade - the letter suffix encodes speed/temperature/option differences. Do not reuse bitstreams from R24A on R25A parts without re-running Quartus Prime compilation and timing analysis. Always read the Agilex 7 errata sheet before finalizing board bring-up.
Informações de conformidade
Altera Agilex 7 F-Series devices comply with RoHS/REACH. Export-controlled per US EAR (encryption-enabled). AEC-Q100 not applicable to FPGAs. Halogen-free status to be confirmed against the specific manufacturer datasheet revision.