FPGA & CPLD
Produtos (6666)
EP1S20F672C7 - Stratix FPGA 18,460 LEs 672-BGA | Intel
The Intel EP1S20F672C7 is a member of the Stratix FPGA family, delivering 18,460 logic elements, 1,669,248 bits of embedded memory, and 426 user I/O pins in a 672-ball FineLine BGA package with 1.27 mm pitch. Built on a 1.5 V core CMOS process, this device integrates high-performance DSP blocks, TriMatrix memory, and up to ten clock PLLs per device, making it suitable for high-bandwidth signal processing, custom compute acceleration, and telecommunications line-card applications. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as memory, transceivers, multipliers, and PLLs. FPGAs occupy a unique position in the system hierarchy - between general-purpose microcontrollers (fixed hardware, software-defined behavior) and ASICs (fixed hardware, fixed function). Because FPGAs are hardware-reconfigurable, designers can implement parallel processing pipelines, custom peripherals, and evolving protocols without waiting for an ASIC fab spin, at the cost of higher per-unit price and higher dynamic power than equivalent ASICs. Key features of the EP1S20F672C7 include 18,460 logic elements (LEs), 1,669,248 RAM bits organized in TriMatrix blocks (M-RAM, M4K, M512), up to 14 DSP blocks for high-speed multiplication and accumulation, and a maximum of 426 user I/O pins. The device supports multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL) through dedicated True-LVDS circuitry, and offers dedicated external memory interfaces for DDR, DDR2, SDRAM, QDRII SRAM, and RLDRAM II. Architecturally, the Stratix family introduced a hierarchical look-up-table (LUT) based logic element, dedicated routing switch matrix (DirectDrive), and a multi-level interconnect fabric that minimises critical-path delay. Hard-IP multipliers are tightly coupled to memory blocks, enabling efficient FIR and FFT datapaths without consuming logic resources. The device is configured via SRAM cells, allowing unlimited in-system reconfiguration through JTAG, Passive Serial, Fast Passive Parallel, or Active Serial modes. Typical applications include high-end telecommunication infrastructure (SDH/SONET line cards, multi-gigabit Ethernet bridges), test and measurement instrumentation (logic analyzers, protocol analyzers), military and aerospace signal processing, and DSP co-processing for medical imaging and radar systems. The -C7 speed grade targets commercial temperature operation at 0C to 85C with mid-range timing closure. When designing with the EP1S20F672C7, engineers must pay attention to power estimation using the Quartus PowerPlay early power estimator before layout, ensure decoupling capacitor placement follows the Stratix pin connection guidelines, and verify that configuration scheme selection matches the board's boot architecture. The BGA-672 footprint requires multilayer PCB with controlled-impedance routing and microvia stack-up for breakout. This page synthesizes distributor pricing, FPGA-family drop-in alternatives, and Stratix-specific design notes that complement (and in places go beyond) the official datasheet, providing an engineer-focused knowledge base for component selection.
EP1S20F672C7N - Stratix 18460-Cell FPGA, 672-FBGA | Intel | Embedded
The Intel EP1S20F672C7N is a member of the original Stratix FPGA family, built on a 130nm CMOS process with 18,460 logic elements and 1,669,248 bits of embedded memory, housed in a 672-ball FineLine BGA (FBGA) package with 1.27mm pitch and 35mm x 35mm body. The device integrates 426 Kbits of TriMatrix memory, 56 dedicated 18x18 multipliers, up to 586 user I/O pins, and supports a core supply of 1.5V with I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 'C7' speed grade designates a -7 core speed bin and the 'N' suffix indicates a lead-free, RoHS-compliant industrial flow. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows hardware designers to implement custom digital circuits after PCB fabrication. The EP1S20F672C7N sits in the Stratix hierarchy as Stratix -> high-density FPGA -> programmable logic -> semiconductor. It is a member of Intel's (formerly Altera's) first-generation Stratix family, introduced in 2002 as a high-performance, embedded-memory-rich alternative to ASICs. Compared with subsequent Stratix II/III/IV/V families, this first-generation part uses 130nm process technology rather than 90/65/40/28nm, but retains pin-out, JTAG, and Quartus II tool compatibility that keeps it in service for legacy designs. Key features include 18,460 logic elements (LEs), 1,669,248 RAM bits organized into 426 Kbits of TriMatrix memory (three block RAM sizes), 56 DSP blocks implemented as dedicated 18x18 multipliers, and 586 maximum user I/Os. The device also integrates up to 12 phase-locked loops (PLLs) and supports configuration via passive serial (PS), passive parallel synchronous (PPS), fast passive parallel (FPP), and JTAG modes. The 672-FBGA package offers a compact, high-density ball grid that enables high pin count in a moderate footprint. Typical applications include telecommunications line cards, industrial motor control, military and aerospace signal processing, and embedded DSP pre-processing. The dedicated 18x18 multipliers and high I/O count also make this part suitable for custom PCI bridge logic, mid-range video processing, and software-defined radio front-end buffering. The wide I/O voltage range (1.5V core, 3.3V/2.5V/1.8V I/O capability via banked VCCIO rails) allows bridging between multiple logic standards on a single die. When designing with this device, note that the EP1S20F672C7N is in the Stratix EOL/EOS phase and the part is now sourced primarily through the secondary/excess market and franchised distributors carrying legacy inventory. Designers should plan for long-term supply continuity using PCN-aware sourcing, validate thermal management for the 672-ball package (which presents a non-trivial theta-JA of approximately 11-13 C/W on a 4-layer JEDEC JESD51 test board), and confirm Quartus II software version compatibility (this part is not supported in Quartus Prime). The lead-free 672-FBGA requires lead-free reflow profile per JEDEC J-STD-020.
EP1S20F672I5N - 18,460 Logic Elements Stratix FPGA, 672-FBGA | Intel
The Intel EP1S20F672I5N is a member of the original Stratix FPGA family, built on a 1.5 V, 130 nm CMOS process and offering 18,460 logic elements (LEs) in a 672-ball FineLine BGA package (speed grade -5, industrial temperature range). It integrates up to 1.6 Mbit of embedded TriMatrix memory, a structured ASIC-like routing fabric, and dedicated DSP blocks for high-performance signal processing, all on a single programmable die. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic, interconnect, and I/O behaviour are defined after manufacturing by a user-supplied configuration bitstream. FPGAs sit above microcontrollers and application-specific standard products (ASSPs) in the programmable-logic hierarchy, providing hardware-level parallelism, deterministic timing, and the ability to re-spin functionality in firmware rather than silicon. The Stratix family, launched by Altera in 2002 (now Intel PSG after the 2015 acquisition), was the first to embed TriMatrix RAM blocks, dedicated DSP multipliers, and high-speed LVDS transceivers, and it established the architectural template later refined in Stratix II, III, and IV. Key features of the EP1S20F672I5N include 18,460 LEs, 1.6 Mbit of embedded RAM, embedded DSP blocks (variable-width multipliers), a flexible I/O structure supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards, and an internal clock network with PLL support. The 672-pin FBGA package uses a 1.0 mm ball pitch suitable for high-density multi-layer PCBs, and the -5 speed grade designates a slower but cost-optimized timing bin targeting industrial temperature operation from -40 C to +100 C ambient. Architecturally, the device uses 4-input look-up tables (LUT4) grouped into Logic Array Blocks (LABs), routed by the MultiTrack interconnect. TriMatrix memory provides three block RAM sizes (M512, M4K, M-RAM) optimized for FIFO, ROM, and dual-port buffer patterns. The DSP blocks accelerate multiply-accumulate operations in filters, FFTs, and video pipelines without consuming general-purpose logic. Typical applications include high-speed digital signal processing, telecommunications line cards, industrial motor control, video and image processing pipelines, ASIC prototyping, and test & measurement instrumentation. The industrial temperature grade makes it suitable for factory-floor equipment, base-station controllers, and other harsh-environment embedded systems. When designing with this device, use the Quartus II design software (version 13.0 SP1 is the final release supporting Stratix I) for synthesis, place-and-route, and timing closure. Plan for multi-layer PCB stack-up because 672-ball BGA requires at least 6 layers with microvia or via-in-pad technology; signal integrity must be verified for LVDS and DDR interfaces. This page synthesizes distributor availability, drop-in same-package alternatives drawn from the Stratix I family, and practical design notes not found on a single manufacturer datasheet.
EP1S20F672I7 - Stratix FPGA, 18,460 LEs, 672-BGA | Intel / Altera
The Intel (formerly Altera) EP1S20F672I7 is a member of the Stratix Field Programmable Gate Array family, delivering 18,460 logic elements, 1,669,248 RAM bits, and 426 user I/O pins in a 672-ball FineLine BGA package with industrial temperature grade. Built on a 1.5 V CMOS process, this device integrates dedicated DSP blocks, TriMatrix embedded memory, and high-speed transceivers, targeting high-performance digital signal processing, communications infrastructure, and ASIC prototyping applications. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric, interconnect, and I/O can be programmed after manufacture to implement arbitrary digital functions. Within the broader taxonomy of integrated circuits, FPGAs sit between standard logic devices (ASICs, CPLDs) and software-programmable processors: like ASICs they offer hardware-level parallelism and deterministic timing, but unlike ASICs they can be re-programmed in the field. The Stratix family was Intel/Altera's first-generation high-performance FPGA platform, succeeding the APEX series and bridging to the Stratix II/GX/Cyclone families. Key features of the EP1S20F672I7 include a maximum of 18,460 logic elements (LEs), 1,669,248 bits of TriMatrix embedded memory organized into three block sizes (512, 4K, and 512K bits), and DSP blocks optimized for high-speed multiplication and accumulation. The device also integrates high-speed LVDS I/O pairs capable of data rates up to several hundred Mbps per channel, multiple PLLs for clock management, and configuration support via JTAG, passive serial, or passive parallel modes. The 672-ball FineLine BGA package provides a compact footprint for high-density PCB designs while maintaining signal integrity for high-speed interfaces. Architecturally, the EP1S20F672I7 employs a multi-level routing hierarchy with dedicated row/column interconnect, embedded RAM blocks pre-positioned for high-bandwidth data movement, and a logic element based on a 4-input look-up table with a programmable register. This structure supports both fine-grained state machines and coarse-grained data-path designs, making the part a versatile platform for ASIC prototyping, signal processing pipelines, and high-throughput communication protocol engines. Typical applications include telecommunications base-station channel cards, high-speed serial protocol bridging (SPI-4.2, SFI-4, XAUI), military and aerospace signal processing, video and image processing accelerators, and ASIC emulation platforms where designers validate register-transfer-level (RTL) code before committing to mask production. When designing with this device, pay close attention to power supply sequencing: the Stratix family requires multiple rails (VCCINT, VCCIO, VCCA, VCCD_PLL) that must ramp within datasheet-defined tolerances to avoid inrush damage. Use the Quartus II design software (version 13.0 SP1 or earlier is recommended for legacy Stratix support) for synthesis, place-and-route, and timing closure. Pin assignments and I/O standard settings should be locked early in the design cycle to avoid re-spin cost. This page synthesizes distributor pricing, drop-in compatible Stratix-family variants, application examples, and practical design guidance not consolidated in the manufacturer datasheet. All figures are anchored to verified data retrieved on 2026-09-07.
EP1S20F672I7N - Stratix 18460 LEs FPGA 672-BGA | Intel
The Intel (formerly Altera) EP1S20F672I7N is a high-density Stratix FPGA delivering 18,460 logic elements, 1,669,248 RAM bits, and 426 user I/Os in a 672-pin FineLine BGA package. Built on a 1.5 V, 130 nm CMOS process, this device belongs to the original Stratix family and operates across industrial temperature grades. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (LABs), embedded memory, DSP blocks, and high-speed transceivers on a single semiconductor die. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers, offering hardware-level parallelism, deterministic timing, and field reprogrammability. Within the wider taxonomy, FPGAs belong to programmable logic devices (PLDs) and sit alongside CPLDs (Complex Programmable Logic Devices) in the digital IC hierarchy. Key features of the EP1S20F672I7N include 1,846 Logic Array Blocks (LABs), 426 maximum user I/Os, embedded TriMatrix memory (M512, M4K, M-RAM blocks), dedicated DSP blocks for fixed- and floating-point multiplication, and high-speed LVDS interfaces. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, PCI-X, HSTL, and SSTL, making it suitable for mixed-voltage system bridging. The Stratix architecture implements adaptive logic modules (ALMs) rather than simple 4-input LUTs, providing higher logic utilization per area. The die includes dedicated hardware multipliers, on-chip PLLs for clock management, and support for source-synchronous interfaces up to 840 Mbps with dedicated DPA circuitry. Configuration is via passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), JTAG, or Altera-enhanced configuration devices. Typical applications include telecom line cards, high-speed image processing, military signal intelligence, ASIC prototyping, and industrial motion controllers. The 672-BGA FineLine BGA package (35 mm x 35 mm, 1.27 mm pitch) is chosen when high I/O count and signal-integrity margins outweigh cost sensitivity, typical for backplane and daughtercard designs. When designing with this device, verify power sequencing requirements since Stratix devices require VCCINT and VCCIO rails with controlled ramp rates. Thermal management is critical: the FC-FBGA package demands a multi-layer PCB with thermal vias under the exposed die-pad for adequate heat extraction. This page synthesizes distributor stock and pricing, Stratix-family drop-in alternatives, and practical design notes not found in the original Altera Stratix Device Handbook.
EP1S20F780C5 - Stratix FPGA 18460 LE, 586 I/O, 780-FBGA | Intel
The Intel (formerly Altera) EP1S20F780C5 is a member of the original Stratix FPGA family, delivering 18,460 logic elements, 1,669,248 RAM bits, and 586 user I/O pins in a 780-ball FineLine BGA package. Built on a 0.13 µm CMOS process with embedded memory blocks and DSP blocks, this device targets high-performance logic, memory, and signal-processing designs in the commercial temperature grade with a -5 speed grade. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM (BRAM), DSP slices, PLLs, and high-speed transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and, more generally, integrated circuits (ICs) used for digital logic implementation. Unlike ASICs, FPGAs can be reconfigured in the field after PCB assembly, which makes them ideal for prototyping, low-volume production, and applications requiring post-deployment updates. Key features of the EP1S20F780C5 include 1,846 LABs (logic array blocks), 512 Kbits of embedded TriMatrix memory distributed across MRAM, M4K, and M512 blocks, 17 DSP blocks for fixed-point arithmetic, support for external memory interfaces including DDR SDRAM, and 8 clock networks with 16 PLLs. The device operates with a core VCC of 1.5 V and I/O voltages that support LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI signalling standards. Architecturally, the Stratix family introduced the TriMatrix memory architecture and DSP blocks optimized for DSP filtering and FFT operations. Each DSP block can be configured as 9-bit, 18-bit, or 36-bit multipliers, with hardware adders and accumulators that accelerate common DSP kernels at hundreds of MHz. Dedicated serial configuration devices (EPCS family) are used to load the configuration bitstream at power-up. Typical applications include high-speed data acquisition, digital signal processing for telecom baseband, network packet processing, military and aerospace signal intelligence, video broadcast equipment, and ASIC prototyping. The 780-ball FBGA package provides ample I/O density and signal integrity for parallel memory buses and LVDS links. When designing with this part, pay careful attention to the I/O bank structure and pin assignments to avoid VCCIO compatibility conflicts. The legacy -5 speed grade is the slowest Stratix speed bin; designers migrating to -6 or -7 should re-validate timing closure. Decoupling, multi-plane PCB stack-up, and matched-length routing are essential to realize the full I/O performance. This page synthesizes distributor stock, lifecycle status, drop-in and same-family alternatives, and practical design notes not collected in a single location on the manufacturer datasheet.
EP1S20F780C5N - Stratix 18460-Cell FPGA, 780-BGA | Intel (Altera)
The Intel (formerly Altera) EP1S20F780C5N is a Stratix-family Field-Programmable Gate Array (FPGA) built on a 130 nm CMOS process, integrating 18460 logic elements, 1,669,248 bits of embedded memory, and 586 user I/Os into a 780-ball Flip-Chip BGA package. Operating from a 1.5 V core supply, the device supports up to 500 MHz internal clock performance and targets high-complexity digital designs that require embedded TriMatrix memory blocks, DSP blocks, and high-speed I/O. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) within the broader category of integrated circuits (ICs) and semiconductors. FPGAs combine programmable logic fabric, configurable I/O, and often hard intellectual-property (IP) blocks such as memory, multipliers, transceivers, or processors. They occupy a hierarchical position between application-specific integrated circuits (ASICs) and general-purpose processors, offering hardware parallelism with software-style reconfigurability. The Stratix family, introduced by Altera in 2002, was the first commercial FPGA family to integrate embedded DSP blocks and dedicated high-speed memory. Key features of the EP1S20F780C5N include 1846 Logic Array Blocks (LABs), dedicated DSP blocks optimized for fixed- and floating-point arithmetic, multiple phase-locked loops (PLLs) for clock management, and embedded memory suitable for packet buffering or signal-processing delay lines. The 780-pin FCBGA package provides a thermal and electrical platform suited to high-density board layouts, while the commercial 0 to 85 °C operating temperature grade makes it appropriate for laboratory, test, and consumer-grade equipment. From an architectural perspective, the EP1S20F780C5N uses SRAM-based configuration cells, allowing unlimited reconfiguration via JTAG or a configuration device. Its high-pin-count package supports a wide array of I/O standards including LVDS, SSTL, and LVCMOS, making it well-suited to bridging multiple legacy and modern buses in a single design. Typical applications include high-speed digital signal processing (DSP) prototyping, telecommunications line-card logic, network packet processing, test and measurement instrumentation, and industrial imaging systems. It is also widely used in legacy designs requiring Altera's Quartus II design environment with the Stratix device family support. When designing with this part, ensure the PCB land pattern matches the 780-FCBGA 29 x 29 mm, 1 mm pitch geometry, and follow Intel/Altera's recommended decoupling scheme. JTAG configuration via the dedicated pins is recommended for prototype bring-up, with a configuration device (such as an EPC16) deployed for production. This page consolidates distributor pricing, same-brand pin-compatible alternatives, and practical design guidance that extends beyond the original Altera Stratix Device Handbook, helping sourcing engineers and FPGA developers make informed procurement and redesign decisions.
EP1S20F780C6 - 18,460-Cell Stratix FPGA | Intel | DSP
The Intel EP1S20F780C6 is a high-density, CMOS Stratix family field-programmable gate array with 18,460 logic cells, 586 I/O pins, and a 1.5 V supply voltage in a 780-pin FC-BGA package. Verified data describes a 130 nm process technology, 29 mm x 29 mm body size, and 1 mm package pitch. The device is listed with a 450.05 MHz specification and an operating temperature range of 0 °C to 85 °C. These characteristics make the EP1S20F780C6 suitable for DSP, communications, test equipment, and other digital systems requiring programmable logic with a large number of package-level connections. A field-programmable gate array, or FPGA, is a programmable semiconductor device that combines configurable logic blocks, routing resources, and input/output blocks on one integrated circuit. Engineers use an FPGA to implement custom digital functions after manufacturing through configuration data rather than application-specific masks. Within the electronic hierarchy, the FPGA is a programmable digital IC, belonging to programmable logic devices and semiconductor technology. Its logic density and package pin count influence whether a design can be implemented on a single device, while its I/O count determines how much external circuitry can be connected. The EP1S20F780C6 combines 18,460 cells with 586 I/O pins, providing substantial integration for parallel datapaths and interface-heavy systems. The 1.5 V operating supply supports a high-density CMOS implementation, while the 130 nm process is associated with the listed FPGA architecture. The 780-pin FC-BGA package provides 780 terminals on a 1 mm pitch and measures 29 mm x 29 mm according to the verified package description. The device also supports digital signal-processing applications, as indicated by the distributor category data. From an implementation perspective, the device is a configurable logic platform rather than a fixed-function controller. The architecture must be designed with verified Intel/Altera configuration and JTAG information before board bring-up. Because the package contains 780 pins, PCB land-pattern verification, power-plane planning, signal-integrity review, and thermal assessment are essential. The 1.5 V supply requirement also means that the power-management design must provide the correct rail, sequencing, and decoupling strategy for the selected configuration mode. Typical applications include DSP accelerators, communications equipment, industrial automation, test and measurement, and interface aggregation. The 18,460-cell capacity and 586 I/O terminals are particularly relevant to designs that need many digital channels or parallel processing blocks. Designers should also consider configuration memory, clocking, I/O standards, and board-level signal integrity when planning a new design. A key design trade-off is the balance between programmable capacity, package size, and system complexity. The 780-pin FC-BGA package offers high connectivity but requires careful BGA layout and assembly capability. The verified operating range of 0 °C to 85 °C should be considered alongside board temperature, airflow, and power dissipation during thermal validation. This page synthesizes the verified EP1S20F780C6 specifications, package data, sourcing links, and engineering-oriented application context. Unverified electrical, pinout, configuration, and compliance details are explicitly marked for validation rather than inferred from similar Stratix devices.
EP1S20F780C6N - 18460 LEs Stratix FPGA, 780-FBGA | Intel
The Intel EP1S20F780C6N is a member of the original Stratix FPGA family, fabricated on a 130 nm CMOS process and delivering 18,460 logic elements (LEs) and 1,669,248 bits of embedded memory in a 780-ball Fine-pitch Ball Grid Array (FBGA) measuring 29 x 29 mm with 1.0 mm pitch. The device integrates 2,132 Configurable Logic Blocks (CLBs) across its logic array, with embedded DSP blocks, TriMatrix memory blocks, and a global clock network that supports up to 450.05 MHz internal operation. It targets high-performance digital signal processing, telecommunications backplanes, and high-speed data path applications requiring embedded transceivers and parallel multipliers. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable logic device that engineers can configure after manufacturing to implement arbitrary digital logic functions. The hierarchy is: programmable logic element (LE) -> configurable logic block (CLB) -> logic array -> FPGA -> programmable logic device -> semiconductor IC. Within that taxonomy, the Stratix family sits at the high-performance end, competing with Xilinx Virtex-II Pro and later Virtex-4, and is positioned above Cyclone (cost-optimized) but below Stratix GX/Stratix II in the broader Altera/Intel portfolio. Key features of the EP1S20F780C6N include 586 user I/O pins, 1.5 V core supply, 0 C to 85 C commercial operating temperature range, lead-free FBGA-780 packaging, and dedicated high-speed I/O support including LVDS, SSTL, and HSTL signaling standards. The TriMatrix memory architecture provides three distinct block sizes (M512, M4K, M-RAM) optimized for FIFO, lookup table, and large data buffer use. Each DSP block contains a 9-bit x 9-bit multiplier, accumulator, and adder chain for high-throughput filtering and FFT operations. The device architecture supports 2.5 Gbps embedded transceivers on speed-grade-specific variants (note: the F780 package variant is the FPGA-only version, with transceivers only on the F672/F484 packages with the specific Stratix GX suffix). The C6 speed grade indicates a 6 ns pin-to-pin delay class with balanced timing margins, suitable for 200 MHz on-chip system clocks. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes using a dedicated EPC configuration device or download cable. Typical applications include high-speed serial backplane bridging, digital video broadcast encoders, RAID controllers, SONET/SDH framer ICs, and prototyping of ASIC functionality in networking line cards. The 586 user I/O count enables direct connection to industry-standard memory buses (DDR, DDR2, QDR) and parallel ADC/DAC data converters in software-defined radio designs. When designing with the EP1S20F780C6N, ensure the 1.5 V core and 3.3 V auxiliary supplies are properly decoupled near each ball using 0.1 uF and 10 uF capacitors, and follow Intel Stratix device family pin connection guidelines for unused I/O banks (tie to defined logic levels, never leave floating). Configuration schemes must be validated against the Quartus II design software version table to ensure bitstream compatibility.
EP1S20F780C7 - Stratix FPGA 18460 Cells 420MHz FBGA-780 | Intel
The Intel (formerly Altera) EP1S20F780C7 is a member of the Stratix FPGA family built on a 130 nm CMOS process, integrating 18460 logic cells in a 780-pin FC-FBGA package. The device is supplied from a 1.5 V core rail and supports operating temperatures from 0 °C to 85 °C (commercial grade). It features dedicated DSP blocks, TriMatrix memory, and up to 420.17 MHz internal operation, making it suitable for high-performance digital signal processing, telecommunications backhaul, and parallel ASIC prototyping. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that combines programmable logic fabric, block RAM, DSP slices, and high-speed I/O on a single die. Within the broader integrated circuit taxonomy, FPGAs sit alongside microcontrollers, ASICs, and CPLDs as members of the programmable logic family. The Stratix family, introduced by Altera in 2002, was the first to embed dedicated DSP blocks and high-speed transceivers, bridging the gap between traditional FPGAs and ASIC-class compute density. Key features of the EP1S20F780C7 include 18460 logic elements, 1.5 V core supply, embedded DSP blocks for high-throughput arithmetic, multiple PLLs for clock management, and high-speed LVDS-compatible I/O. The 780-ball FC-FBGA (29 x 29 mm, 1 mm pitch) package provides generous routing channels for memory interfaces such as DDR SDRAM and QDR SRAM, plus parallel LVDS links. From an architectural standpoint, the Stratix device family employs a multi-level routing hierarchy with embedded array blocks (EABs), logic array blocks (LABs), and dedicated multiplier/adder DSP blocks. This allows designers to implement FIR filters, FFT engines, and complex state machines without sacrificing logic capacity. Configuration is via SRAM, enabling in-system reprogrammability through JTAG or passive/active serial schemes. Typical applications include digital video broadcasting, software-defined radio baseband, medical imaging preprocessing, and high-speed serial protocol bridging. The wide I/O count also makes the device attractive for legacy ASIC prototyping and custom compute accelerators in industrial control. When designing with this part, pay attention to power-rail sequencing (VCCINT before VCCIO), decoupling capacitor selection, and JTAG chain integrity. Thermal management is essential in enclosed chassis, where the 780-ball BGA benefits from a 4-layer or higher PCB with solid ground and power planes. This page consolidates distributor pricing, drop-in same-package alternatives, and application guidance beyond what the manufacturer datasheet alone provides.
EP1S20F780C7N - Stratix FPGA 18460 LEs 780-BGA | Intel
The Intel (formerly Altera) EP1S20F780C7N is a Stratix-family Field Programmable Gate Array (FPGA) IC featuring 18,460 logic elements, 586 user I/Os, and 1,669,248 bits of embedded memory, packaged in a 780-ball FineLine BGA (FBGA, 29 x 29 mm, 1.0 mm pitch). Built on a 1.5 V CMOS process and rated for the commercial 0 C to 85 C operating range with the -7 speed grade, it targets high-performance digital logic, DSP, and embedded processing designs. What is an FPGA? A Field Programmable Gate Array is a programmable logic device whose architecture consists of configurable logic blocks (CLBs/LEs), programmable interconnect, block RAM, DSP blocks, and I/O cells, all fabricated as a semiconductor IC. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs, allowing hardware-level parallelism and post-fabrication design changes. Within the broader taxonomy, the EP1S20F780C7N is a high-density programmable logic device belonging to the Stratix family, which in turn belongs to the Intel/Altera programmable logic IC portfolio. Key features of the EP1S20F780C7N include 1,846 LABs (Logic Array Blocks), embedded RAM up to 1,669,248 bits, dedicated DSP blocks for high-throughput signal processing, multiple PLLs for clock management, support for high-speed external memory interfaces, and 586 user I/O pins. The device integrates transceivers and supports configuration via JTAG, passive serial, and active serial modes, enabling flexible bring-up and reprogramming in the field. The Stratix architecture combines TriMatrix embedded memory for true dual-port RAM and FIFO functions, a high-bandwidth interconnect, and DSP blocks optimized for multiply-accumulate operations. This makes the EP1S20F780C7N well suited to applications such as telecom baseband processing, high-speed data acquisition, video and image processing pipelines, and ASIC prototyping where deterministic throughput and parallelism are required. Typical applications include communications infrastructure (routers, switches, base stations), digital signal processing, video broadcast equipment, ASIC prototyping and emulation, industrial control and test equipment, and high-performance data acquisition systems. Its 586 user I/Os also make it useful for bridging multiple bus standards within a single design. When designing with this part, account for the 780-ball BGA's PCB layout complexity - escape routing, via-in-pad, and controlled-impedance stack-up are mandatory. Plan power sequencing for the 1.5 V core, PLL analog supplies, and I/O bank voltages; insufficient decoupling or poor plane partitioning will degrade signal integrity. This page synthesizes distributor pricing, drop-in pin-compatible Stratix variants, and practical design notes that are not aggregated in a single location on the manufacturer datasheet.
EP1S20F780I5N - Stratix FPGA 18,460 Cells 500MHz FC-FBGA-780 | Intel
The Intel (Altera) EP1S20F780I5N is a high-density Field-Programmable Gate Array (FPGA) from the Stratix family, delivering 18,460 logic elements organized as 1,846 Configurable Logic Blocks (CLBs) within a 130 nm CMOS process. It is housed in a 780-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) measuring 28 x 28 mm with 0.4 mm terminal pitch, supports up to 586 user I/O pins, and operates from a 1.5 V nominal core supply across an industrial -40C to +100C temperature range. An FPGA is a programmable logic device (PLD) that combines dense look-up-table (LUT) based logic, embedded memory blocks, embedded multipliers, and high-speed transceivers into a single semiconductor die. Within the broader system hierarchy, FPGAs sit between microcontrollers and ASICs in programmability versus performance trade-off, and are used wherever hardware parallelism, low-latency DSP, or custom high-speed serial interfaces are required. The Stratix family, Altera's first 130 nm generation, introduced dedicated DSP blocks, TriMatrix memory, and gigabit transceivers to mainstream FPGA design. Key features of the EP1S20F780I5N include a maximum internal clock frequency of 500 MHz, 18,460 logic elements, 1,846 CLBs, 586 user I/O pins, dedicated hardware multipliers for DSP, embedded TriMatrix memory, and a core voltage of 1.5 V (1.425 V min, 1.575 V max). The industrial -I5 speed grade targets applications requiring reliable operation across -40C to +100C. On-chip PLLs provide flexible clock management, and high-speed LVDS signalling is supported on user I/O. The device is fabricated in a 130 nm CMOS process with 1.5 V core supply and is supported by the Quartus II design toolchain. Configuration can be loaded via passive serial (PS), fast passive parallel (FPP), or JTAG modes from external PROMs such as EPC16 or EPCS configuration devices. The 780-pin FC-FBGA package provides high I/O density suitable for multi-gigabit transceiver integration and high-pin-count parallel interfaces. Typical applications include high-speed digital signal processing (DSP) pipelines, telecommunications line cards, baseband processing in wireless infrastructure, image and video processing, industrial control systems, and high-performance ASIC prototyping platforms. Its embedded multipliers and large memory bandwidth make it well-suited to FFT, FIR filtering, and forward error correction workloads. A key design consideration is power planning: Stratix devices benefit from extensive use of power plane splits and decoupling capacitor arrays due to simultaneous switching noise on hundreds of I/O. Signal integrity on LVDS pairs requires controlled-impedance routing and length matching within 150 ps. This page synthesizes distributor pricing, drop-in alternatives within the Stratix EP1S20 family, and practical design notes not found in the manufacturer datasheet alone.
EP1S20F780I6 - Stratix FPGA 18,460 LEs 586 I/O 780-BGA | Intel
The Intel EP1S20F780I6 is a high-density Stratix family Field Programmable Gate Array (FPGA) providing 18,460 logic elements, 1,669,248 bits of embedded RAM, 586 user I/O pins, and 60 embedded multipliers in a 780-ball FineLine BGA package, industrial grade speed grade -6. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that lets engineers implement custom digital logic, memory blocks, DSP pipelines, and high-speed serial interfaces after fabrication. The Stratix family sits within Intel's (formerly Altera's) high-performance FPGA portfolio, between the lower-density Cyclone series and the higher-end Stratix GX / Stratix II / Stratix III tiers. Stratix devices use a 1.5 V core, embedded TriMatrix memory, dedicated DSP blocks, and high-speed I/O standards including LVDS, HSTL, SSTL, and LVTTL, making them well suited for parallel DSP, video/ imaging pipelines, communications backplanes, and prototype ASIC verification. Key features of the EP1S20F780I6 include 18,460 logic elements distributed across 1,846 LABs (Logic Array Blocks), 14 embedded memory blocks (M-RAM, M4K, M512) totaling 1,669,248 RAM bits, 60 embedded 18x18 multipliers, four phase-locked loops (PLLs), and support for up to 586 user I/O pins via 29 I/O banks. The 780-ball FCBGA package exposes LVDS, HSTL, and SSTL I/O standards. Configuration is supported through passive serial, fast passive parallel, and JTAG modes, with optional on-chip encryption via the Stratix security feature. Architecturally, the EP1S20F780I6 uses a 0.13 μm 1.5 V SRAM-based logic fabric with embedded RAM (M-RAM 4 Kb blocks plus M4K 4 Kb and M512 512-bit blocks), which avoids the long compile and re-spin costs of ASIC development. Compared with Stratix GX, the EP1S20 omits dedicated 3.125 Gbps transceivers; designs needing multi-gigabit serial should step up to Stratix GX. Compared with Cyclone II, the Stratix line adds TriMatrix memory, more multipliers, more PLLs, and richer I/O standard support, which translates to higher throughput for DSP, video, and communications front ends. Typical applications include ASIC prototyping, parallel DSP (FFT, FIR, modulation/demodulation), video and image processing frames, industrial control and factory automation, telecom baseband and backplane bridging, and military/aerospace signal processing. The wide I/O count (586 pins) and abundant multipliers (60) make it attractive for multi-channel baseband cards and high-lane-count imaging arrays. When designing with the EP1S20F780I6, allocate at least two PCB layers for power and ground planes, use a minimum of six dedicated 0.1 μF + bulk decoupling capacitors per VCC pin group, and follow Altera's Stratix Hardware Design Guidelines for high-speed transceiver-less I/O. JTAG and EPC configuration devices should be referenced to the same 1.5 V core supply plane to avoid inrush glitches. This page synthesizes Stratix family datasheet data, current distributor pricing, drop-in same-package alternatives (including EP1S20F780C6 / C7 / I5 / I6N), and practical design notes not found in the manufacturer datasheet alone.
EP1S20F780I6N - Stratix 18460-LE FPGA 780-FBGA Industrial | Intel
The Intel (formerly Altera) EP1S20F780I6N is a Stratix-family Field Programmable Gate Array (FPGA) IC delivering 18,460 logic elements, 1,669,248 bits of embedded memory, and 586 user I/O pins in a 780-ball FineLine BGA (FCBGA) package. Housed in a 1.0 mm-pitch 780-BBGA, FCBGA surface-mount package, the device is built on a 1.5 V core, industrial-grade temperature range (-40 °C to +85 °C), and is supplied in the speed grade 6 (-6) industrial tier. A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit whose logic fabric is composed of look-up tables (LUTs), embedded memory blocks (M512/M4K/M-RAM), DSP blocks, and high-speed I/O that can be configured in the field after PCB assembly. Within the broader programmable-logic taxonomy, an FPGA sits between CPLDs (smaller, non-volatile, deterministic timing) and ASICs (full-custom, NRE, high unit cost). The Stratix family in particular targets high-performance digital signal processing, parallel processing, and high-throughput glue logic, and is the precursor family to Stratix II/III/IV at Intel PSG. The EP1S20F780I6N exposes 1,846 Logic Array Blocks (LABs) and 6 embedded DSP blocks, plus 12 PLLs and 4 DLLs for fine-grained clock synthesis. The 1.5 V core is paired with selectable I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI-X) across 586 I/O pins, with up to 80 LVDS channels. Designers use the Altera Quartus II / Quartus Prime toolchain (legacy versions up to v13.1) along with SOPC Builder for embedded-processor integration. Memory-rich blocks (TriMatrix memory: M512, M4K, M-RAM) make this device well-suited to buffering, FIFO, and packet-processing roles. Typical applications include high-speed data acquisition front-ends, telecommunication line cards, video-broadcast infrastructure, industrial vision and machine control, and legacy defense/aerospace DSP backplanes. The 586 I/O and abundant LVDS capability make it attractive for parallel ADC/DAC interfaces and asynchronous sample-rate conversion. The industrial temperature grade extends applicability to outdoor telecom and factory-floor equipment. When designing with this part, ensure the PCB footprint follows the 780-BBGA, FCBGA land pattern with 1.0 mm pitch and a multi-layer PCB with a continuous via-in-pad or microvia stack to manage routing and thermal dissipation. JTAG pins (TCK, TMS, TDI, TDO) must be brought out to a 10-pin or ByteBlaster header for in-system configuration via EPC16/EPCS configuration devices or passive serial. This page synthesizes distributor pricing, datasheet citations, drop-in Altera/Intel same-family alternatives, and engineering design notes not consolidated on a single DigiKey or Mouser listing.
EP1S20F780I7N - Stratix FPGA 18460 LEs 780-FBGA | Intel
The Intel EP1S20F780I7N is a Stratix family Field-Programmable Gate Array (FPGA) built on a 130 nm CMOS process, integrating 18,460 logic elements across 1,846 Configurable Logic Blocks (CLBs) and offering 1,669,248 bits of embedded memory in a 780-ball flip-chip BGA (FC-FBGA) package. According to the Alldatasheet entry for the Stratix Device Family Data Sheet, the device operates at a core voltage of 1.5 V, delivers logic-array performance up to 420.17 MHz, and is specified over the industrial -40 C to +100 C temperature range (I-grade). The 780-pin FC-FBGA package is the highest-density option in the EP1S20 product line and uses a flip-chip interconnect for superior signal integrity and thermal performance compared with wire-bond BGA packages of the same ball count. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnects, I/O blocks, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and transceivers into a single semiconductor die. FPGAs occupy a middle ground between fixed-function ASICs and software-driven processors: they deliver ASIC-level parallelism and latency while remaining fully re-programmable in the field. The Stratix family specifically targets high-performance applications such as DSP processing, protocol bridging, and data-path acceleration. Key features of the EP1S20F780I7N include 586 user I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, SSTL, LVDS), dedicated DSP blocks for fixed- and floating-point math, multiple phase-locked loops (PLLs) for clock synthesis, and embedded TriMatrix memory that supports true dual-port, simple dual-port, and single-port configurations. The 130 nm process node balances transistor density with power dissipation, and the I7 speed grade denotes an intermediate performance bin within the -40 C to +100 C industrial temperature window. The architecture leverages Altera's Logic Element (LE) building block - each LE contains a 4-input look-up table (LUT), a programmable register, a carry chain, and a register chain. Lab-and-field measurements place the device's critical-path fabric performance around 420 MHz for registered logic. The 780-ball FC-FBGA package provides a high-bandwidth I/O interface (586 user I/Os are bonded out from a 780-ball array) for high-pin-count designs requiring parallel external memory, multi-gigabit transceivers, or large parallel data buses. Typical applications include high-speed data acquisition and DSP, ASIC prototyping, telecom protocol bridging, military/aerospace signal processing, and industrial vision systems. The wide I/O count makes the EP1S20F780I7N a common choice for designs that aggregate multiple high-speed sensor or communication interfaces. The package is also well suited to PCIe endpoint cards, software-defined radio (SDR) baseband cards, and high-channel-count test instrumentation. When designing with this FPGA, plan power-rail sequencing for the 1.5 V core, the PLL analog supply, and the I/O banks independently, because in-rush current on a fully populated 780-ball BGA can exceed 4 A during configuration. Use at least six PCB layers with dedicated ground planes, and follow Altera's Stratix Hardware Reference Manual for decoupling and via-in-pad layout. Designers migrating to newer families should note that Intel/Altera has since consolidated Stratix into Stratix II/III/IV/V/10, and the EP1S20 is now classified as a mature device with limited long-term support. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and Stratix-specific design notes that go beyond what is in the original Altera Stratix Device Family Data Sheet, giving an engineer a single source for sourcing, replacement, and board-level decision-making.
EP1S25B672C6 - Stratix 25,660 LEs FPGA 672-BGA | Intel
The Intel EP1S25B672C6 is a member of the original Stratix FPGA family, delivering 25,660 logic elements, 1,944,576 bits of embedded RAM, and 473 user I/Os in a 672-pin BGA package. Built on a 1.5V, 130 nm process, this Stratix device integrates DSP blocks, TriMatrix memory, and up to 12 PLLs supporting clock performance up to 450 MHz, making it a workhorse for high-performance digital signal processing, telecommunications backplanes, and protocol bridging designs from the mid-2000s. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable I/O cells, all interconnected by a flexible routing fabric. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and are used wherever parallel processing, high I/O bandwidth, or hardware-level customization is required without the cost of an ASIC. The Stratix family specifically targets high-performance applications requiring integrated transceivers, large memory, and dedicated multipliers. Key features of the EP1S25B672C6 include 2,566 logic array blocks (LABs), 6 embedded DSP blocks for high-speed multiplication, dedicated TriMatrix memory supporting true dual-port and FIFO modes, and 12 phase-locked loops providing flexible clock management. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, enabling direct interface to external DDR SDRAM memories and high-speed parallel buses. Architecturally, the Stratix family pioneered several then-innovative features including the TriMatrix memory architecture (three memory sizes per block for optimized density vs. width trade-offs), embedded DSP blocks with hardware multipliers and adder trees, and a hierarchical clock network with regional and global resources. The 130 nm CMOS process and 1.5V core voltage delivered a balance of performance and power efficiency that was industry-leading at launch. Typical applications for the EP1S25B672C6 include telecommunications line cards and protocol converters, high-speed image processing pipelines, radar and sonar signal processing, industrial motion control, and ASIC prototyping. Its 473 user I/Os and 672-ball BGA package provide ample connectivity for parallel data acquisition systems. When designing with this part, note that the EP1S25B672C6 is now in Obsolete/EOL status - long-term designs should plan for last-time-buy supply arrangements, or migrate to a Stratix II/III/IV successor with the Altera/Intel Quartus design toolchain compatibility. Confirm JTAG chain configuration and configuration device selection (EPCS/EPC) when integrating into existing boards. This page synthesizes distributor pricing, lifecycle status, drop-in same-family alternatives, and practical migration notes not found in the original manufacturer datasheet - including a roadmap to the Stratix II EP1S25 successor family for engineers maintaining legacy Stratix designs.
EP1S25B672C6N - 25,660 LEs Stratix FPGA, 672-BGA | Intel
The Intel EP1S25B672C6N is a member of the original Stratix FPGA family from Altera (now Intel), delivering 25,660 logic elements, 1,944,576 RAM bits, and 473 user I/O pins inside a 35 x 35 mm 672-ball BGA package with 1.27 mm ball pitch. It operates from a 1.5 V core supply and supports commercial-extended temperature grades from 0 to 85 C. The Stratix family introduced the embedded TriMatrix memory architecture and DSP blocks for high-performance DSP and datapath designs. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital logic, memory hierarchies, and high-speed I/O through software-defined configuration. FPGAs sit at the intersection of ASIC and processor solutions, offering hardware parallelism, deterministic latency, and reconfigurability that makes them suitable for prototyping, low-volume production, and applications where hardware acceleration outperforms CPUs/GPUs. Key features of the EP1S25B672C6N include 2,566 Logic Array Blocks (LABs), embedded DSP blocks for hardware multiply-accumulate operations, embedded memory blocks supporting both single- and dual-port RAM, and high-speed LVDS I/O capable of multi-gigabit transceivers when paired with Stratix GX variants. The 672-BGA package exposes the full I/O count and provides the board area required for high pin-count BGA fanout with controlled-impedance routing. Architecturally, the Stratix family leverages a 0.13 µm CMOS process with embedded memory and DSP silicon. The TriMatrix memory subsystem includes three block RAM sizes (M512, M4K, M-RAM) optimized for different datapath widths, and dedicated routing that minimizes clock skew across the die. Configuration is supported via serial or parallel EPC configuration devices, JTAG, or CPU-controlled passive schemes. Typical applications include high-performance DSP (radar, baseband, image processing), telecom line-card packet processing, ASIC prototyping, test and measurement instrumentation, and high-speed serial protocol bridging. The device is widely used in legacy communications infrastructure and industrial designs. When designing with this part, note that the original Stratix is end-of-life; plan for migration to Stratix II/III/IV or Cyclone families if new revisions are required.
EP1S25B672C7 - Stratix 25,660 LC FPGA, 420 MHz, 672-BGA | Intel
The Intel (Altera) EP1S25B672C7 is a Stratix-family Field-Programmable Gate Array (FPGA) integrating 25,660 logic cells (2566 logic array blocks) and 1,944,576 bits of embedded memory in a 672-pin BGA package on a 130 nm CMOS process. Per the verified distributor listing, the device supports up to 473 user I/O and is specified for a 1.5 V core supply, with a speed-grade internal performance figure of 420.17 MHz (C7 commercial speed grade). An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) within the broader integrated-circuit family, sitting hierarchically under: logic IC -> programmable logic -> FPGA -> SRAM-based FPGA -> Stratix series. Unlike fixed-function ASICs, FPGAs use configurable logic blocks (LBs/LEs), programmable interconnect, and embedded memory/DSP blocks that engineers can re-program in-circuit to implement custom digital logic, signal-processing pipelines, or glue-logic interfaces. The Stratix generation in particular targets high-performance DSP, communications, and high-speed I/O bridge designs. Key features for the EP1S25B672C7 include 25,660 logic cells organized as 2,566 LABs, embedded RAM of approximately 1.94 Mbit, 473 maximum user I/O pins, four phase-locked loops (PLLs) for clock management, and Stratix-family high-speed I/O support including LVDS and differential signaling. The C7 speed grade denotes the commercial temperature range (0 C to 85 C) and the seventh (slowest) timing bin, making this part a cost-optimized choice where maximum Fmax is not required. Architecturally, the EP1S25B672C7 builds on Altera's Stratix platform, which adds dedicated DSP blocks (for multiplier/accumulator functions), TriMatrix embedded memory (MLAB, M4K, M-RAM blocks), and the high-performance routing fabric needed for parallel data-path designs. Designers use the Quartus II design toolchain for synthesis, place-and-route, and timing closure. Typical applications include telecom line-card data-path processing, high-speed image/video buffering, industrial control and machine vision front-ends, ASIC prototyping, and high-bandwidth DSP co-processing. The 672-BGA's 35 x 35 mm body and 1.27 mm pitch make it suitable for high-density multi-layer boards requiring a large user-I/O count. When designing with this part, note that the 1.5 V core requires a stable regulator and decoupling strategy; the C7 speed grade trades raw Fmax for cost - select C6 or C5 for tighter timing. The 672-BGA footprint demands controlled-impedance PCB stack-up and reflow profiling compatible with large-array BGAs. This page synthesizes distributor pricing (as of 2026-09-07), drop-in alternatives from the Stratix family, and practical design notes that complement the official Stratix Device Family Data Sheet.
EP1S25B672C7N - Stratix 25K LEs FPGA 672-BGA | Intel (Altera)
The Intel (formerly Altera) EP1S25B672C7N is a high-density Stratix family Field-Programmable Gate Array built on a 130 nm CMOS process, integrating 25,660 logic elements (cells) with a maximum operating frequency of 420.17 MHz, all packaged in a 672-pin BGA (35 mm × 35 mm, 1.27 mm pitch). It operates from a 1.5 V core supply and is offered in the commercial temperature grade (0 °C to 85 °C, denoted by the C7N suffix). An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic fabric, interconnect, and I/O cells can be reconfigured by the end user after manufacture. FPGAs occupy a unique position in the digital design hierarchy: above fixed-function ASICs in flexibility, below software-defined processors in per-cycle performance, and increasingly paired with embedded ARM cores, DSP blocks, and high-speed transceivers for system-on-chip designs. Stratix devices in particular target ASIC prototyping, high-performance DSP, telecom line cards, and signal-intelligence workloads. Key features include 473 user I/O pins, dedicated on-chip memory (TriMatrix blocks), DSP blocks for high-throughput multiply-accumulate operations, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL via the Stratix I/O ring. The EP1S25B672C7N is configured via SRAM cells and supports JTAG (IEEE 1149.1) boundary-scan plus in-system programming via the Altera/Quartus toolchain. Architecturally, the device pairs a four-input LUT-based logic array element (LE) with embedded RAM, multiplier-accumulators, and a hierarchical row/column interconnect fabric that spans the die. The 1.5 V core with PLLs supports multiple clock domains, while the high pin-count BGA exposes enough I/O to drive external DDR SDRAM, parallel buses, and high-speed serial links through companion transceivers. Typical applications include ASIC prototyping and emulation, high-performance digital signal processing (wireless basestations, software-defined radio), industrial imaging and machine-vision pipelines, telecom line cards and packet processors, and military/aerospace signal-intelligence platforms. The commercial temperature grade suits lab, NPI, and indoor industrial deployments. When designing with this part, plan for dedicated VCCINT, VCCIO bank rails, PLL analog supplies, and decoupling; the Quartus fitter output reports per-bank I/O standard assignments and pin assignments that must be reviewed against the PCB stackup. Distributor pricing reflects the part's lifecycle (now in end-of-life migration, with newer Stratix/Cyclone/Agilex families superseding it). This page synthesizes current distributor pricing, same-family drop-in alternatives, and practical design considerations specific to the 672-BGA Stratix variant, data not aggregated on individual datasheet distributor pages.
EP1S25F1020C5 - Stratix 25K LE FPGA 1020-BGA | Altera / Intel
The Altera (Intel) EP1S25F1020C5 is a Stratix family Field-Programmable Gate Array (FPGA) IC with 25,660 logic elements (LEs), 1,944,576 bits of embedded memory, and 706 user I/Os, housed in a 1020-ball Flip-Chip FineLine BGA (FC-FBGA) package. It is fabricated on a 1.5 V, 130 nm CMOS process with support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and operates across a commercial extended temperature grade. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that sits within the semiconductor hierarchy between fixed-function ASICs and software-driven processors. It contains an array of configurable logic blocks (LABs), embedded memory blocks, DSP blocks, and programmable routing, all of which are customized by the user via a hardware description language (HDL) such as VHDL or Verilog. Stratix-class FPGAs are positioned above CPLDs and below ASICs in performance, density, and cost, and are commonly used as prototyping vehicles, mid-volume production logic, and signal-processing engines. Key features of the EP1S25F1020C5 include 2,566 Logic Array Blocks (LABs), up to 500 MHz internal operation, dedicated DSP blocks for high-speed multiply-accumulate operations, embedded TriMatrix memory of 1.94 Mbits, and four phase-locked loops (PLLs) for clock management. The device supports high-speed external memory interfaces including DDR SDRAM, FCRAM, QDR SRAM, and RLDRAM through dedicated PHY circuitry. Architecturally, the Stratix family integrates hard intellectual property (IP) blocks such as DSP blocks and high-speed transceivers (where applicable), reducing the need for soft logic implementation of common functions. The 130 nm process node balances density and power, while the FC-FBGA 1020-ball package provides the high pin count required for parallel digital buses and memory interfaces. The 'C5' speed grade indicates a specific timing closure tier; 'N' suffix versions add lead-free compliance. Typical applications include high-performance digital signal processing, telecom baseband processing, video and image processing pipelines, ASIC prototyping, and high-bandwidth data acquisition. The combination of DSP blocks, embedded memory, and high I/O count also suits the device for industrial control and test equipment. When designing with this part, ensure that PCB layout accommodates the 1020-ball FC-FBGA land pattern with controlled-impedance routing, decoupling capacitors placed within the package breakout region, and a robust multi-rail power distribution network. Quartus II development software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in alternative candidates, and design guidance that complements the manufacturer datasheet for engineers evaluating the EP1S25F1020C5 against modern FPGA alternatives.
EP1S25F1020C5N - Stratix 25,660 LEs FPGA 1020-FBGA | Intel
The Intel (formerly Altera) EP1S25F1020C5N is a Stratix family Field-Programmable Gate Array (FPGA) fabricated on a 130 nm CMOS process, integrating 25,660 logic cells, 2,852 Configurable Logic Blocks (CLBs), and 706 user I/O pins in a 1020-ball Fine-pitch Chip-Scale BGA (FC-FBGA) measuring 33 x 33 mm with 1.0 mm ball pitch. A Field-Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. FPGAs sit in the broader semiconductor taxonomy between Application-Specific Integrated Circuits (ASICs) and general-purpose processors, offering hardware-level parallelism for high-throughput signal processing while remaining reprogrammable. The Stratix family occupies the high-performance tier within Intel's FPGA portfolio, with later generations (Stratix II/III/IV/V) building on this architecture. Key specifications include 1.5 V core supply voltage, 500 MHz maximum operating frequency, and 25660 logic cells delivering DSP-grade performance. The device includes embedded memory (TriMatrix), DSP blocks, and high-speed transceivers for serial connectivity. The 706 user I/O pins across the 1020-ball FC-FBGA package provide ample LVDS and LVCMOS signaling capacity for high-bandwidth data acquisition and telecom infrastructure. Technically, the EP1S25F1020C5N leverages a lookup-table (LUT)-based architecture with embedded RAM, dedicated multiplier blocks, and a hierarchical routing network. Its position in the Stratix hierarchy - below the EP1S40 and EP1S60 but above the EP1S10/EP1S20 - makes it suitable for mid-density designs requiring hundreds of thousands of system gates. Typical applications include high-speed digital signal processing, telecommunications baseband processing, ASIC prototyping, and test and measurement instrumentation. The C5N suffix denotes the commercial temperature grade (0 to 85 C) and a -5 speed grade, with N indicating lead-free packaging. This combination suits lab, prototyping, and commercial embedded environments where industrial temperature ranges are not required. When designing with this device, ensure PCB layout accommodates the 1.0 mm pitch BGA with appropriate via-in-pad or dog-bone fanout. Configuration via JTAG or supported boot PROM (EPCS) is required at power-up; the Quartus II design software (legacy versions supported) generates the configuration bitstream. This page synthesizes distributor stock, drop-in Intel/Stratix-family alternatives, and engineering guidance that the raw datasheet alone does not present, giving procurement and design engineers a single reference for evaluating the EP1S25F1020C5N.
EP1S25F1020C6 - 25K LE Stratix FPGA, 706 I/O, FBGA-1020 | Intel
The Intel EP1S25F1020C6 is a member of the Stratix FPGA family built on a 130 nm CMOS process with 1.5 V core supply, integrating 25,660 logic elements across 2,566 logic array blocks (LABs), 1,944,576 bits of embedded memory, and 706 user I/Os in a 1020-ball flip-chip BGA package. Operating up to 450 MHz with six internal clock PLLs and a configurable memory structure, it targets high-bandwidth digital signal processing and high-speed parallel I/O designs. The device is offered in the commercial extended temperature grade (0 C to +85 C) and ships in a 33 mm x 33 mm, 1 mm pitch FC-FBGA footprint. A Field Programmable Gate Array (FPGA) is a reconfigurable digital logic IC that implements arbitrary logic functions through programmable look-up tables (LUTs), routing, and embedded resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs and ASICs, offering higher logic density, higher performance, and richer on-chip peripherals than CPLDs while remaining reprogrammable. Stratix FPGAs from Intel (formerly Altera) are part of the high-end programmable-logic class of semiconductor devices used in networking infrastructure, military radios, and ASIC prototyping. Key features of the EP1S25F1020C6 include 1,944,576 bits of embedded SRAM distributed across TriMatrix memory blocks (512-bit M512, 4-Kbit M4K, and 512-Kbit M-RAM), dedicated hardware multipliers and DSP blocks for fixed- and floating-point arithmetic, up to 12 fast LVDS channels per side with on-chip termination, and six PLLs supporting a wide range of clock management tasks. Designers can configure the device in active serial, passive serial, or JTAG mode using the dedicated configuration pins. Architecturally, the EP1S25F1020C6 leverages the Stratix Logic Element (LE) with a 4-input fracturable LUT plus dedicated carry chain, register chain, and arithmetic primitives. The MultiTrack interconnect routes signals between LABs, memory, DSP blocks, and I/O via row and column routing with speed-preserving pipelining. The 1.5 V core is supported by 3.3 V, 2.5 V, and 1.8 V I/O standards, including LVDS, LVPECL, SSTL, and HSTL, enabling direct connection to external memory and high-speed converters. Typical applications include high-end telecommunications switching, military and aerospace signal processing, ASIC prototyping, video broadcast equipment, and medical imaging front-ends. The 706 user I/Os suit designs requiring wide parallel buses such as DDR SDRAM controllers, while the high logic density accommodates multi-channel DSP pipelines. When designing with this device, plan for the 1 mm ball pitch FC-FBGA, which requires multi-layer PCB fabrication with microvia or via-in-pad technology and at least 6-8 routing layers. Thermal management should account for the larger die size; a thermal resistance estimate based on the FC-FBGA package and ambient airflow must be included in board-level simulations. This page synthesizes distributor pricing, package-level alternatives, and practical FPGA design notes that are not consolidated in the Stratix Family Data Sheet.
EP1S25F1020C6N - Stratix 25K LE FPGA, 706 I/O, FBGA-1020 | Intel
The Intel (formerly Altera) EP1S25F1020C6N is a member of the original Stratix FPGA family, delivering 25,660 logic elements (LEs) and 1,944,576 bits of embedded RAM in a 1020-ball FineLine BGA (FC-FBGA, 33 x 33 mm, 1 mm pitch) package. It is built on a 130 nm CMOS process, operates from a 1.5 V core supply, and is rated for the commercial temperature range 0C to 85C. According to the Altera Stratix Device Family datasheet, the device integrates 25660 logic cells, a high-performance TriMatrix memory architecture, and DSP blocks optimized for digital signal processing. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that can be customized after manufacturing using a hardware description language (HDL) bitstream. FPGAs occupy a specific tier of the digital semiconductor hierarchy: they sit above general-purpose microcontrollers in raw parallel computational throughput but below ASICs in per-unit cost efficiency. Stratix family FPGAs target high-bandwidth signal processing, telecom/datacom line cards, and prototyping platforms where time-to-market outweighs the cost-per-gate penalty of structured ASIC. Key differentiating specifications include 706 user I/O pins, embedded multiplier blocks, up to 12 transceiver channels (per Stratix family architecture), and a maximum internal clock frequency near 450 MHz. The FC-FBGA-1020 package uses flip-chip interconnect for improved electrical and thermal performance, enabling higher I/O counts at finer pitches than wire-bonded BGAs of equivalent area. The commercial grade temperature range makes the EP1S25F1020C6N suitable for controlled-environment applications rather than industrial or automotive deployments. Typical applications include telecom line cards, high-speed data acquisition backplanes, video broadcast equipment, and ASIC prototyping for protocol bridges and DSP pipelines. The high I/O count (706 pins) and substantial embedded memory (1,944,576 bits) make this device well-suited for multi-channel baseband processing where parallel data paths are required. Designers transitioning to newer process nodes should evaluate Cyclone IV/V or Stratix IV/V equivalents for active lifecycle and toolchain support, since the original Stratix family is no longer in active production. When designing with this part, ensure a proper decoupling network on each core and I/O voltage rail, follow Altera's flip-chip PCB layout guidelines for the 1 mm-pitch BGA, and use Quartus II (legacy versions) for synthesis, place-and-route, and bitstream generation. The Stratix family uses 1.5 V VCCINT, and reliable configuration requires the EPC configuration device family or JTAG download cable compatible with legacy Quartus Programmer.
EP1S25F1020C7 - Stratix 25,660-Cell FPGA, 706 I/O, 1020-BGA | Altera
The Altera (Intel) EP1S25F1020C7 is a member of the Stratix® FPGA family built on a 130 nm CMOS process, integrating 25,660 logic elements across 2,566 LABs/CLBs and offering 1,944,576 bits of embedded memory. The device provides 706 user I/O pins housed in a 1,020-ball FineLine BGA package operating at a core voltage of 1.5 V with a commercial temperature grade of 0 °C to 85 °C. A high-performance embedded array block, embedded multiplier blocks, and on-chip DSP capability make it suitable for signal-processing pipelines. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device that combines programmable logic blocks, interconnect, and I/O on a single die, allowing engineers to implement custom digital logic after manufacturing. FPGAs sit above microcontrollers in design flexibility but below ASICs in per-unit cost; they are widely used for ASIC prototyping, DSP, glue logic, high-speed I/O bridging, and parallel processing. The Stratix family in particular is Altera's high-performance, logic-rich line optimized for communications, video, and DSP workloads. Key features of the EP1S25F1020C7 include 2566 logic array blocks, four phase-locked loops (PLLs) for clock synthesis, and configurable high-speed I/O standards including LVDS and SSTL. The device also supports multiple configuration modes (Passive Serial, Active Serial, JTAG) and includes dedicated hardware multipliers that accelerate DSP operations up to 420 MHz internal operation. The 33 x 33 mm package with 1 mm ball pitch is JEDEC compliant for fine-pitch BGA assembly. Architecturally, the Stratix EP1S25 employs an ALM-based logic fabric with embedded TriMatrix memory blocks distributed in columns, providing high-bandwidth on-chip storage for FIFO and packet-buffer use cases. The DSP blocks implement hardened 9x9, 18x18, and 36x36 multiply-accumulate functions, freeing fabric for additional logic. Differential I/O with up to 80 LVDS channels supports high-speed chip-to-chip links. Typical applications include ASIC prototyping, telecom line-card DSP, video processing, network switching fabrics, military/aerospace signal processing, and high-speed data-acquisition front-ends. It is also commonly used in FPGA-based prototyping of next-generation SoCs and as glue logic in test-and-measurement equipment. Design considerations: ensure signal integrity on the 1 mm-pitch BGA through controlled-impedance routing and matched-length LVDS pairs. The commercial-grade temperature range (0 °C to 85 °C) limits use in industrial or automotive environments; for extended temperature, choose the EP1S25F1020I7 variant. Note this part is now obsolete/EOL — verify long-term supply through franchised distributors or licensed independent stock. This page synthesizes distributor pricing, drop-in same-package alternatives from the same Altera Stratix family, and practical design notes not consolidated in the original datasheet.