EP1S20F780C6N - 18460 LEs Stratix FPGA, 780-FBGA | Intel
N.º da peça: EP1S20F780C6N ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $295 | $295,00 |
| 10 | $265.5 | $2.655,00 |
| 100 | $235.8 | $23.580,00 |
| 500 | $210.2 | $105.100,00 |
| 1.000 | $188.75 | $188.750,00 |
EP1S20F780C6N Visão geral
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable logic device that engineers can configure after manufacturing to implement arbitrary digital logic functions. The hierarchy is: programmable logic element (LE) -> configurable logic block (CLB) -> logic array -> FPGA -> programmable logic device -> semiconductor IC. Within that taxonomy, the Stratix family sits at the high-performance end, competing with Xilinx Virtex-II Pro and later Virtex-4, and is positioned above Cyclone (cost-optimized) but below Stratix GX/Stratix II in the broader Altera/Intel portfolio.
Key features of the EP1S20F780C6N include 586 user I/O pins, 1.5 V core supply, 0 C to 85 C commercial operating temperature range, lead-free FBGA-780 packaging, and dedicated high-speed I/O support including LVDS, SSTL, and HSTL signaling standards. The TriMatrix memory architecture provides three distinct block sizes (M512, M4K, M-RAM) optimized for FIFO, lookup table, and large data buffer use. Each DSP block contains a 9-bit x 9-bit multiplier, accumulator, and adder chain for high-throughput filtering and FFT operations.
The device architecture supports 2.5 Gbps embedded transceivers on speed-grade-specific variants (note: the F780 package variant is the FPGA-only version, with transceivers only on the F672/F484 packages with the specific Stratix GX suffix). The C6 speed grade indicates a 6 ns pin-to-pin delay class with balanced timing margins, suitable for 200 MHz on-chip system clocks. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes using a dedicated EPC configuration device or download cable.
Typical applications include high-speed serial backplane bridging, digital video broadcast encoders, RAID controllers, SONET/SDH framer ICs, and prototyping of ASIC functionality in networking line cards. The 586 user I/O count enables direct connection to industry-standard memory buses (DDR, DDR2, QDR) and parallel ADC/DAC data converters in software-defined radio designs.
When designing with the EP1S20F780C6N, ensure the 1.5 V core and 3.3 V auxiliary supplies are properly decoupled near each ball using 0.1 uF and 10 uF capacitors, and follow Intel Stratix device family pin connection guidelines for unused I/O banks (tie to defined logic levels, never leave floating). Configuration schemes must be validated against the Quartus II design software version table to ensure bitstream compatibility.
Alternativas drop-in para EP1S20F780C6N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1S20F780C6N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Speed Grade, Configuration Method, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1S20F780C6
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →EP1S20F780C7N
✅ Drop-In✓ Em estoque
$158.4 / unidade
Ver ficha técnica →EP1S20F780C5N
✅ Drop-In✓ Em estoque
$92 / unidade
Ver ficha técnica →EP1S10F780C6N
✅ Drop-In✓ Em estoque
$205 / unidade
Ver ficha técnica →EP1S20F780I6N
✅ Drop-In✓ Em estoque
$660 / unidade
Ver ficha técnica →EP1S20F780C6N Classificações máximas e características elétricas
| Family | Stratix |
| Manufacturer | Intel (formerly Altera) |
| Process Technology | 130 nm CMOS |
| Logic Elements (LEs) | 18,460 |
| Configurable Logic Blocks (CLBs) | 2,132 |
| Embedded Memory Bits | 1,669,248 |
| Tipo de memória | TriMatrix (M512 / M4K / M-RAM blocks) |
| DSP Blocks | Embedded 9x9 multiplier blocks |
| Maximum User I/O Pins | 586 |
| Encapsulamento | 780-ball FC-FBGA (Fine-pitch BGA) |
| Package Dimensions | 29 x 29 mm, 1.0 mm pitch |
| Core Supply Voltage | 1.5 V |
| Temperatura de operação | 0 C to +85 C (commercial) |
| Speed Grade | C6 (6 ns pin-to-pin delay class) |
| Maximum Internal Frequency | 450.05 MHz |
| Lead-Free / RoHS | Yes (lead-free) |
| Configuration Methods | PS, PPS, PPA, JTAG via EPC configuration device |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI, PCI-X |
Guia de Configuração de Pinos do EP1S20F780C6N 29 x 29 mm, 1.0 mm pitch
Configuração de pinos para EP1S20F780C6N (pacote 29 x 29 mm, 1.0 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1S20F780C6N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1S20F780C6N é adequado para 6 aplicaçãos: Telecommunications Backplane Bridging, High-Speed Digital Signal Processing, Digital Video Broadcasting Equipment, RAID Storage Controllers, Software Defined Radio Prototyping, Network Test & Measurement Equipment.
Telecommunications Backplane Bridging
The EP1S20F780C6N suits telecom backplane bridging because its 586 user I/O pins provide direct parallel connection to multiple SFP/SFP+ cages, and its 18,460 LEs can implement 8b/10b encoding, CRC insertion, and rate-matching FIFOs. The TriMatrix M-RAM blocks (up to 4 Mbits per device) buffer packet bursts between ingress and egress channels without external SRAM, reducing BOM and latency. At C6 speed grade the device comfortably meets the 156.25 MHz reference clock required for GbE and 2.5G CPRI links when synthesized in Quartus II. Stratix DSP blocks implement Lane PCS encoding, allowing 32 channels of GbE SerDes adaptation without a companion ASSP.
Recomendado
High-Speed Digital Signal Processing
For DSP applications such as radar pulse compression, software-defined radio, and medical imaging front-end, the EP1S20F780C6N delivers up to 224 DSP blocks each containing a 9-bit x 9-bit signed multiplier and 18-bit accumulator. At 450 MHz internal clock this provides approximately 56 GMACs of multiply-accumulate throughput, sufficient for a 1024-point FFT in under 25 microseconds. The TriMatrix memory architecture (M512 for coefficient storage, M4K for data working memory, M-RAM for sample buffer) eliminates external memory fetches in streaming pipelines, and 586 I/O pins support LVDS at 840 Mbps per pair for direct ADC/DAC interface.
Recomendado
Digital Video Broadcasting Equipment
DVB-S2 modulators and H.264 encoders use the EP1S20F780C6N for LDPC and turbo decoding thanks to its high-density logic and embedded multiplier resources. The 18,460 LEs support the H.264 high-profile CABAC engine in a single device, while the 1.6 Mbit of TriMatrix memory holds multiple reference frames. The 780-ball FBGA package is layout-compatible with the Stratix II EP2S20F484C5N in board designs that provide a footprint migration path, and the C6 speed grade delivers the 148.5 MHz clock required for HDTV 1080p60 processing at 4:2:2 chroma sampling.
Recomendado
RAID Storage Controllers
RAID 5/6 controllers benefit from the EP1S20F780C6N's parallel XOR and Galois-field computation logic. The embedded DSP blocks accelerate Reed-Solomon and parity computation across SATA-attached disks, while the 586 I/O pins support up to eight SATA host ports simultaneously (one pin per SATA data pair plus GPIO). The 1.5 V core supply and 0-85 C commercial temperature range make this FPGA a fit for use in standard server room environments, and the FBGA-780 package exposes enough balls for hot-swap SAS expander interfaces.
Recomendado
Software Defined Radio Prototyping
Software-defined radio prototypes use the EP1S20F780C6N because its 586 I/O pins provide LVDS interfaces to multiple 14-16 bit ADC/DAC pairs at sampling rates up to 200 MSPS, and its DSP blocks implement digital down-conversion (DDC), digital up-conversion (DUC), and channelization filters. The TriMatrix memory holds sample buffers for RF snapshots, and the 1.5 V core draws only 1.2-1.5 W typical at 450 MHz. Designers can prototype GSM, WCDMA, and LTE physical layers in a single device before migrating to ASIC, with the Quartus II software providing C-to-HDL tools for fast algorithm iteration.
Recomendado
Network Test & Measurement Equipment
High-end network protocol analyzers (10 GbE, OTU-2, FC-8G) leverage the EP1S20F780C6N's logic density to implement pattern generation, bit-error-rate testers, and protocol decode engines in a single chip. The 586 user I/O pins can interface to multiple XAUI lanes, and the embedded M-RAM blocks store deep capture buffers (up to 4 Mbits per device). At C6 speed grade, the FPGA comfortably drives 3.125 GHz XAUI serdes rates on the dedicated PLL outputs when paired with an external XAUI phy, and the FBGA-780 package supports BGA escape for 12+ layer PCBs required for high-speed signal integrity.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1S20F780C6N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1S20F780C6 | EP1S20F780C7N | EP1S20F780C5N | EP1S10F780C6N | EP1S20F780I6N |
|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA (29x29 mm) | 780-ball FC-FBGA (29x29 mm) | 780-ball FC-FBGA (29x29 mm) | 780-ball FC-FBGA (29x29 mm) | 780-ball FC-FBGA (29x29 mm) | 780-ball FC-FBGA (29x29 mm) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 18,460 | 18,460 | 18,460 | 18,460 | 10,570 | 18,460 |
| User I/O | 586 | 586 | 586 | 586 | 426 | 586 |
| Embedded Memory | 1,669,248 bits | 1,669,248 bits | 1,669,248 bits | 1,669,248 bits | 920,448 bits | 1,669,248 bits |
| Speed Grade | C6 (6 ns) | C6 (6 ns) | C7 (7 ns) | C5 (5 ns) | C6 (6 ns) | I6 (industrial, 6 ns) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 to +85 C (commercial) | 0 to +85 C | 0 to +85 C | 0 to +85 C | 0 to +85 C | -40 to +100 C (industrial) |
| Lead-Free | Yes | No (SnPb) | Yes | Yes | Yes | Yes |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Principais diferenciais
- Lead-free solder balls with full RoHS compliance (vs EP1S20F780C6 (without N suffix))
- Balance of timing margin and cost at C6 speed grade (vs EP1S20F780C7N (faster speed grade))
- Higher density than the EP1S10 family at same package cost (vs EP1S10F780C6N (lower density same package))
Notas de projeto
The EP1S20F780C6N requires a 1.5 V core supply with a tolerance of plus/minus 50 mV; use a low-dropout regulator such as the TI TPS75501 followed by a ferrite bead and 4 x 100 uF ceramic decoupling per the Stratix PowerPlay Power Analyzer guidelines. Estimated: at 450 MHz internal clock and 75% logic utilization, the core draws approximately 1.2-1.5 W (label as estimate - consult Intel PowerPlay tool for your specific design). The auxiliary 3.3 V rail is shared with configuration logic and should not be ramped before VCCINT; allow a 100 ms delay after VCCINT stable before the VCCIO ramp.
Design the 12-layer PCB with continuous GND plane beneath the FBGA-780 footprint and one VCCINT plane adjacent to it for decoupling inductance minimization. The 1.0 mm BGA pitch requires 8 mil laser-drilled microvias with 12 mil pads for the breakout, per Intel AN 484: Stratix Device Package Information. Trace length matching of plus/minus 50 mil must be enforced for LVDS pairs across all 8 I/O banks, and signal integrity simulation in HyperLynx or ADS is recommended for any pair operating above 600 Mbps.
At 1.5 W typical dissipation in a 780-ball FC-FBGA with theta-JA of approximately 14 C/W (still air, JEDEC EIA/JESD51 test board), the junction temperature rise above ambient is approximately 21 C - well within the 0 to 85 C commercial range. Industrial variants (EP1S20F780I6N) extending to 100 C ambient will need forced-air cooling at 200 LFM or more to maintain 110 C junction limit. Estimated thermal calculation assumes 14 C/W theta-JA and 1.5 W typical; verify with your board layout using the Stratix thermal model (.fcs) file in Quartus II.
Do not power the device without a valid configuration bitstream loaded into the EPC16UC88 configuration ROM - leaving the FPGA in user-mode-without-bitstream state can cause all I/O to drive to unknown values and potentially back-power through I/O pins. Ensure JTAG chain order in your BSDL file matches the physical board layout (TDI -> device 1 -> TDO -> device 2 -> ... -> TDO), and tie nCONFIG high through a 4.7 kohm resistor if not actively driven. Unused I/O banks should be configured as input with weak pull-up via the Quartus Device & Pin Options dialog.
Informações de conformidade
RoHS compliant per JEDEC J-STD-033 marking (N suffix). REACH compliance verified through Intel material declaration. AEC-Q100 not applicable - this is a commercial-grade FPGA. Industrial variant EP1S20F780I6N available for -40 to +100 C operation but is not AEC-Q100 qualified.
