EP1S20F672C7 - Stratix FPGA 18,460 LEs 672-BGA | Intel
N.º da peça: EP1S20F672C7 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2.650,00 |
| 100 | $240 | $24.000,00 |
| 500 | $215 | $107.500,00 |
| 1.000 | $195 | $195.000,00 |
EP1S20F672C7 Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as memory, transceivers, multipliers, and PLLs. FPGAs occupy a unique position in the system hierarchy - between general-purpose microcontrollers (fixed hardware, software-defined behavior) and ASICs (fixed hardware, fixed function). Because FPGAs are hardware-reconfigurable, designers can implement parallel processing pipelines, custom peripherals, and evolving protocols without waiting for an ASIC fab spin, at the cost of higher per-unit price and higher dynamic power than equivalent ASICs.
Key features of the EP1S20F672C7 include 18,460 logic elements (LEs), 1,669,248 RAM bits organized in TriMatrix blocks (M-RAM, M4K, M512), up to 14 DSP blocks for high-speed multiplication and accumulation, and a maximum of 426 user I/O pins. The device supports multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL) through dedicated True-LVDS circuitry, and offers dedicated external memory interfaces for DDR, DDR2, SDRAM, QDRII SRAM, and RLDRAM II.
Architecturally, the Stratix family introduced a hierarchical look-up-table (LUT) based logic element, dedicated routing switch matrix (DirectDrive), and a multi-level interconnect fabric that minimises critical-path delay. Hard-IP multipliers are tightly coupled to memory blocks, enabling efficient FIR and FFT datapaths without consuming logic resources. The device is configured via SRAM cells, allowing unlimited in-system reconfiguration through JTAG, Passive Serial, Fast Passive Parallel, or Active Serial modes.
Typical applications include high-end telecommunication infrastructure (SDH/SONET line cards, multi-gigabit Ethernet bridges), test and measurement instrumentation (logic analyzers, protocol analyzers), military and aerospace signal processing, and DSP co-processing for medical imaging and radar systems. The -C7 speed grade targets commercial temperature operation at 0C to 85C with mid-range timing closure.
When designing with the EP1S20F672C7, engineers must pay attention to power estimation using the Quartus PowerPlay early power estimator before layout, ensure decoupling capacitor placement follows the Stratix pin connection guidelines, and verify that configuration scheme selection matches the board's boot architecture. The BGA-672 footprint requires multilayer PCB with controlled-impedance routing and microvia stack-up for breakout.
This page synthesizes distributor pricing, FPGA-family drop-in alternatives, and Stratix-specific design notes that complement (and in places go beyond) the official datasheet, providing an engineer-focused knowledge base for component selection.
Alternativas drop-in para EP1S20F672C7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1S20F672C7 (mesmo formato e footprint) — diferindo em Package, Speed Grade, Operating Temperature, Family, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1S20F672C7N
✅ Drop-In✓ Em estoque
$109.2 / unidade
Ver ficha técnica →EP1S20F672C6
✅ Drop-In✓ Em estoque
$470 / unidade
Ver ficha técnica →EP1S20F672C6N
✅ Drop-In✓ Em estoque
$68.9 / unidade
Ver ficha técnica →EP1S20F484C7
✅ Drop-In✓ Em estoque
$195 / unidade
Ver ficha técnica →EP1S20B672C7N
✅ Drop-In✓ Em estoque
$320 / unidade
Ver ficha técnica →EP1S20B672C6N
✅ Drop-In✓ Em estoque
$425 / unidade
Ver ficha técnica →EP1S20F672C7 Classificações máximas e características elétricas
| Series | Stratix |
| Family | Altera Stratix FPGA |
| Logic Elements (LEs) | 18,460 |
| Embedded Memory Bits | 1,669,248 |
| User I/O Pins | 426 |
| Encapsulamento | 672-ball FineLine BGA (35 x 35 mm, 1.27 mm pitch) |
| Logic Family | CMOS, SRAM-based |
| Core Supply Voltage | 1.5 V |
| Temperatura de operação | 0C to 85C (commercial) |
| Speed Grade | C7 |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |
| Tipo de montagem | Surface Mount |
| Status RoHS | unknown |
| Clock PLLs | Up to 10 |
Configuração de pinos do EP1S20F672C7
| Pino A1 | I/O — User I/O bank 1 |
| Pino A2 | I/O — User I/O bank 1 |
| Pino A3 | VCCINT — Core supply 1.5 V |
| Pino A4 | GND — Ground |
| Pino B1 | I/O — User I/O bank 1 |
| Pino B2 | I/O — User I/O bank 1 |
| Pino B3 | I/O — User I/O bank 1 |
| Pino B4 | VCCIO1 — I/O bank 1 reference voltage |
| Pino C1 | I/O — User I/O bank 1 |
| Pino C2 | I/O — User I/O bank 1 |
| Pino C3 | TCK — JTAG test clock |
| Pino C4 | TMS — JTAG test mode select |
| Pino D1 | I/O — User I/O bank 1 |
| Pino D2 | TDI — JTAG test data in |
| Pino D3 | TDO — JTAG test data out |
| Pino D4 | TRST — JTAG test reset (active low) |
| Pino E1 | I/O — User I/O bank 1 |
| Pino E2 | I/O — User I/O bank 1 |
| Pino E3 | MSEL0 — Configuration mode select bit 0 |
| Pino E4 | MSEL1 — Configuration mode select bit 1 |
| Pino F1 | nCE — Chip enable (active low) |
| Pino F2 | nCONFIG — Configuration control (active low) |
| Pino F3 | nSTATUS — Configuration status (active low) |
| Pino F4 | CONF_DONE — Configuration done indicator |
| Pino G1 | DCLK — Configuration clock |
| Pino G2 | DATA0 — Configuration data bit 0 |
| Pino G3 | PLL1_CLKp — PLL1 clock input positive |
| Pino G4 | PLL1_CLKn — PLL1 clock input negative |
| Pino H1 | VCCPD — Pre-driver supply 3.3 V |
| Pino H2 | GND — Ground |
| Pino H3 | I/O — User I/O bank 8 |
| Pino H4 | I/O — User I/O bank 8 |
Aplicações típicas
EP1S20F672C7 é adequado para 6 aplicaçãos: Telecommunication Line-Card Processing, DSP Co-Processing for Radar and Signal Intelligence, Test and Measurement Instrumentation, Medical Imaging Pipeline Acceleration, Industrial Motion-Control and Machine Vision, Aerospace and Defense Secure Communications.
Telecommunication Line-Card Processing
The EP1S20F672C7 fits telecommunication line-card processing because its 18,460 LEs plus 14+ dedicated DSP blocks deliver the parallel multiply-accumulate throughput required for SDH/SONET framers, multi-gigabit Ethernet bridges, and ATM/PoS switches. The 426 user I/Os accommodate backplane SERDES interfaces (LVDS/LVPECL), while 1,669,248 bits of TriMatrix memory buffer packet headers and routing tables without off-chip SRAM latency. The -C7 speed grade sustains above 200 MHz internal Fmax, sufficient for OC-48/STM-16 line rates. Unlike ASIC alternatives, the Stratix FPGA allows post-deployment protocol updates for evolving standards such as MPLS-TP and OIF-compliant OTN mappings.
Recomendado
DSP Co-Processing for Radar and Signal Intelligence
The EP1S20F672C7 suits DSP co-processing for radar, sonar, and signal-intelligence systems because its dedicated hardware multipliers execute FFT, FIR, and correlation kernels at sample rates exceeding 200 MHz. The TriMatrix memory hierarchy (M512, M4K, M-RAM blocks) feeds these multipliers without contention, sustaining real-time beam-forming across hundreds of channels. The 426 I/O balls accept LVDS ADC data streams at hundreds of megahertz, while the 1.5 V core and 0.18 micrometer CMOS process deliver predictable power dissipation under sustained load. The Quartus DSP Builder toolchain accelerates MATLAB-to-FPGA datapath translation, shrinking development cycles for evolving threat libraries.
Recomendado
Test and Measurement Instrumentation
The EP1S20F672C7 fits test-and-measurement instrumentation such as protocol analyzers, logic analyzers, and arbitrary waveform generators because its 426 user I/Os and reconfigurable I/O standards (LVDS, HSTL, SSTL) drive or sample wide parallel buses in real time. 1,669,248 bits of embedded memory store deep acquisition buffers, allowing multi-million-sample captures without external SRAM. The JTAG and Active Serial configuration paths enable field firmware updates over USB or Ethernet without removing the instrument from service. Compared to fixed-function ASIC instruments, the Stratix FPGA lets vendors add new protocol decoders via firmware release rather than hardware revision.
Recomendado
Medical Imaging Pipeline Acceleration
The EP1S20F672C7 accelerates medical imaging pipelines (CT reconstruction, MRI back-projection, ultrasound beamforming) because its 14+ DSP blocks execute parallel MAC operations at over 200 MHz, compressing reconstruction latency from seconds to milliseconds. The 1,669,248-bit TriMatrix memory holds intermediate projection data on-chip, avoiding external DDR access stalls. 426 user I/Os accept high-speed LVDS data from detector arrays and drive DVI/HDMI preview outputs. The 1.5 V core supply simplifies power-tree design in IEC 60601-1 compliant medical equipment, while commercial 0-85C operation matches the thermal envelope of ventilated imaging carts.
Recomendado
Industrial Motion-Control and Machine Vision
The EP1S20F672C7 fits industrial motion-control and machine-vision systems because its 426 user I/Os directly interface to multi-axis encoder inputs (RS-422, LVDS), PWM motor drives, and Camera Link vision sensors without bridge ASICs. The 18,460 LEs implement real-time PID loops, S-curve trajectory generators, and image-processing kernels (Sobel, threshold, connected-component labeling) at deterministic latency. TriMatrix memory buffers line-scan images at full Camera Link 80 MHz pixel rate. The 0-85C commercial temperature range suits factory-floor enclosures; engineers needing -40-100C operation specify the EP1S20F672I7 instead, sharing the same F672 footprint.
Recomendado
Aerospace and Defense Secure Communications
The EP1S20F672C7 supports aerospace and defense secure communications because its SRAM-based configuration allows crypto-key reprogramming per mission while 426 user I/Os drive MIL-STD-1553, ARINC 429, and high-speed LVDS datalinks simultaneously. Dedicated hardware multipliers accelerate AES, SNOW 3G, and proprietary cipher algorithms at multi-gigabit rates. 1,669,248 bits of embedded memory hold session keys and waveform tables without external bus exposure. The commercial -C7 speed grade is acceptable for ground-station and naval applications; flight-grade deployments specify the -I7 industrial temperature variant with the same F672 BGA footprint.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1S20F672C7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1S20F672C7N | EP1S20F672C6 | EP1S20F672C6N | EP1S20F484C7 | EP1S20B672C7N |
|---|---|---|---|---|---|---|
| Package | 672-ball FineLine BGA (35x35 mm) | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 484-ball FineLine BGA - smaller footprint | 672-ball FineLine BGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 |
| Embedded Memory Bits | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 |
| User I/O Count | 426 | 426 | 426 | 426 | ~238 (-188 I/Os due to smaller package) | 426 |
| Speed Grade | C7 | C7 | C6 (faster) | C6 (faster) | C7 | C7 |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) |
| Silicon Revision | C-step | C-step | C-step | C-step | C-step | B-step (older revision) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Principais diferenciais
- Pb-free reflow compatibility with identical timing closure (vs EP1S20F672C6N)
- Maximum user I/O count in the Stratix F672 family (vs EP1S20F484C7)
- C-step silicon revision for latest errata coverage (vs EP1S20B672C7N)
Notas de projeto
The EP1S20F672C7 requires a regulated 1.5 V VCCINT rail with a minimum 30 A peak current capability for configuration transients, plus four independent VCCIO bank supplies (1.5 V/1.8 V/2.5 V/3.3 V) selectable per bank. Use the Quartus PowerPlay early power estimator before layout to dimension bulk decoupling. Estimated: at 50% toggle rate and 25C ambient, core current draw approaches 8-12 A; designers should provision 20 A headroom on the 1.5 V regulator to absorb in-rush during configuration. Place 470 microfarad bulk polymer and 220 microfarad ceramic decoupling within 25 mm of the BGA vias.
The F672 BGA has a junction-to-ambient thermal resistance (theta_JA) of approximately 12-15 C/W with a 1 square inch top-side heatsink. Estimated: at 6 W total power dissipation, junction temperature rises 72-90 C above ambient - within commercial limit but with no margin for confined enclosures. For industrial (-40C to 100C) operation, attach a 30 mm x 30 mm copper pad array on top of the BGA, or use a push-on pin-fin heatsink with thermal interface material. Insufficient thermal design is the primary root cause of field failures in Stratix I designs.
The 672-ball FineLine BGA with 1.27 mm pitch requires a 6-layer PCB minimum: signal-GND-signal-power-signal-GND stack-up with microvia-in-pad or staggered microvia construction for breakout. Each user I/O ball needs at least one via-in-pad for escape routing; use 0.4 mm laser-drilled microvias with 1 oz copper fill. Differential pairs (LVDS/LVPECL) must match lengths within 0.13 mm (5 mil) to preserve skew margin. Reference the Stratix Handbook Section III pin connection guidelines for unused-pin tie-off recommendations - floating configuration pins cause JTAG chain instability.
Do not leave MSEL0/MSEL1 floating - tie through 10 kilohm pull-up or pull-down resistors to select Active Serial (AS), Passive Serial (PS), or Fast Passive Parallel (FPP) configuration mode. Common errors: connecting nCONFIG to ground (latchup), failing to release OE of the configuration EPC device during power-up, and routing TCK without a 25 ohm series damping resistor. The CONF_DONE and nSTATUS open-drain outputs require external 10 kilohm pull-ups to VCCPD (3.3 V).
LVDS I/O standards on the EP1S20F672C7 require 100 ohm differential termination across the receiver pair at the far end of the transmission line. Series-termination is not recommended for Stratix LVDS because the on-chip driver already matches 100 ohm differential. Source-synchronous interfaces (DDR2, QDRII, RLDRAM) must use Stratix dedicated DQS/DQSn pins and the Quartus Pin Planner to assign the matching read-deskew logic. Failure to use dedicated DQS pins forces manual delay-line calibration and typically fails timing closure above 200 MHz.
Informações de conformidade
Stratix I family manufactured 2002-2007. EP1S20F672C7 is tin-lead (SnPb) ball finish; Pb-free variants (suffix N) available as EP1S20F672C7N, C6N. RoHS/REACH compliance not explicitly stated in retrieved web data - verify with Intel/Authorized distributor documentation. Not AEC-Q100 qualified (industrial, automotive users must qualify separately).
