Circuitos Integrados

RK3168

RK3168 - Dual-Core Cortex-A9 SoC | Rockchip | Mobile/Embedded

The Rockchip RK3168 is a low-power, high-performance dual-core ARM Cortex-A9 SoC for smartphones, tablets, personal mobile internet devices, and digital multimedia applications. The RK3168 integrates two Cortex-A9 cores with separate NEON and FPU coprocessors, a PowerVR SGX540 GPU clocked at 400 MHz, and a hardware video decoder supporting up to 1080p H.264/MJPEG/VC-1/MPEG-4, all in a low-power BGA package. A SoC (System-on-Chip) is an integrated circuit that consolidates CPU cores, GPU, video codecs, display controllers, and peripheral interfaces on a single silicon die. Within the broader taxonomy, the RK3168 belongs to the application processor family, sitting between a microcontroller (no display/multimedia capability) and a full multimedia SoC. The Cortex-A9 microarchitecture places the RK3168 in the mid-2010s generation of ARMv7 application processors, which succeeded the Cortex-A8 and was later overtaken by Cortex-A53/A55 designs. Key features include dual-core 1.2 GHz Cortex-A9 with out-of-order execution, PowerVR SGX540 graphics, integrated HDMI/LVDS display controllers, USB 2.0 OTG, MIPI CSI camera interface, multiple SDIO/EMAC/SD card controllers, and a hardware crypto block. The SoC is fabbed on a low-power process with typical smartphone power dissipation below 1 W, enabling fanless designs in tablets and set-top boxes. Architecturally, the RK3168 uses a dual-core Cortex-A9 with NEON SIMD for media acceleration and a separate VPU (Video Processing Unit) that offloads 1080p decode from the CPU. This hardware partitioning delivers the multimedia performance of higher-priced application processors while maintaining the power profile of mobile devices. The SGX540 GPU provides OpenGL ES 2.0 and OpenVG 1.1 support suitable for 3D UI and casual gaming. Typical applications include Android smartphones and tablets in the 7-10 inch class, Miracast/dongle wireless display adapters, low-cost media players and set-top boxes, in-vehicle infotainment (IVI) systems, and industrial HMI panels. The Miracast reference design (RK3168 + Wi-Fi companion chip) became a $10 retail adapter form factor in 2013. When designing with this part, ensure the PCB stack-up meets the BGA escape routing requirements and provide adequate thermal relief on the package substrate. Designers should pair the RK3168 with LPDDR2 or DDR3 memory validated by Rockchip's hardware reference manual to avoid boot issues. This page synthesizes distributor pricing, datasheet details, and Rockchip family alternatives not available on a single manufacturer datasheet, helping procurement engineers and engineering teams source the part with confidence.

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RK3288

RK3288 - Quad-Core Cortex-A17 SoC | Rockchip | BGA-636

The Rockchip RK3288 is a low-power, high-performance 32-bit quad-core application processor built around four ARM Cortex-A17 cores with a separately clocked NEON SIMD coprocessor and an ARM Mali-T764 GPU, packaged in a 636-ball BGA. It is designed for mobile phones, personal mobile internet devices (PMID), and other digital multimedia applications, integrating CPU, GPU, multimedia, memory controller, and peripheral I/O into a single SoC. A quad-core application processor (AP) is a system-on-chip that integrates multiple CPU cores, a graphics processor, memory interfaces, display controllers, and standard peripherals (USB, SDIO, I2C, SPI, UART, Ethernet, HDMI, LVDS, MIPI) on a single die. In a system architecture, the AP sits between power management ICs (PMICs), DRAM (LPDDR2/LPDDR3/DDR3), and the display/camera subsystems. The RK3288 belongs to a broader family of Rockchip ARM APs and is part of the Cortex-A17 generation that targeted Android tablets, set-top boxes, Chromebooks, and digital signage during the mid-2010s. Key features include quad-core ARM Cortex-A17 up to 1.8 GHz, Mali-T764 GPU with OpenGL ES 3.1 support, hardware-accelerated 4K H.264/H.265 video decode, HDMI 2.0 output up to 4K@60Hz, dual-channel 32-bit LPDDR3/DDR3/LPDDR2 interface, MIPI DSI and LVDS display outputs, USB 2.0, SD/MMC, eMMC 5.0 support, and integrated audio codec with SPDIF/I2S. The chip supports Android 5.x/6.x and Linux kernels, making it a versatile multimedia AP for consumer and embedded OEMs. The RK3288 uses a 28 nm HKMG CMOS process, which balances performance with reasonable power consumption. Its quad-core Cortex-A17 out-of-order design delivers significantly higher single-threaded performance than the Cortex-A9 predecessor (RK3188) and enables efficient multitasking. The Mali-T764 GPU supports modern graphics APIs, while the 4K hardware codec block offloads video decode from the CPU cores. Typical applications include Android tablets, Chromebooks, digital signage, smart home control panels, set-top boxes, industrial HMI terminals, and embedded kiosks. Designers choose the RK3288 when they need a mature quad-core Cortex-A17 SoC with strong multimedia capabilities and broad Linux/Android BSP support. When designing with the RK3288, pay attention to PCB layout for the BGA-636 footprint - it requires microvia / HDI PCB technology for reliable BGA escape routing. Thermal management is critical because the SoC can dissipate 2 to 5 W under full CPU+GPU+4K decode load. Use a multi-layer PCB with a continuous ground plane under the BGA and provide adequate copper thermal relief around the package. Validate the PMIC compatibility (e.g., RK808 or ACT8846 family) and DRAM timing margins before committing to volume production. This page synthesizes distributor pricing, drop-in same-package Rockchip SoC variants, application pairings, and practical PCB/system design notes not typically consolidated in the manufacturer datasheet.

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RK3368

RK3368 - Octa-Core 64-bit ARM Cortex-A53 SoC | Rockchip

The Rockchip RK3368 is a low-power, high-performance 64-bit application processor integrating an octa-core ARM Cortex-A53 CPU cluster with separately clocked NEON coprocessors and an ARM Mali-T720MP2 GPU, targeted at smart TV boxes, OTT streaming devices, set-top boxes, and personal mobile internet devices. The part is manufactured in a 28 nm HPC process, supports up to 1.5 GHz core frequency, integrates 4K H.265/H.264 hardware decoding, HDMI 2.0 output up to 4K@60 Hz, and dual-channel DDR3/DDR3L/LPDDR2/LPDDR3 memory controllers. The RK3368 ships in a 19 mm x 19 mm BGA-453 package (0.8 mm pitch) and is specified for commercial-grade operation at 0 C to +80 C ambient. What is an application processor SoC? An application processor SoC (System-on-Chip) integrates the CPU, GPU, memory controller, video decoder/encoder, display pipeline, and connectivity peripherals onto a single silicon die. In the broader taxonomy: SoC -> application processor -> microprocessor unit (MPU) -> semiconductor. Rockchip positions the RK3368 in its 64-bit octa-core family below the RK3399 (big.LITTLE A72+A53) and above the entry-level RK3328 (quad-core A53). Key features include 64-bit ARMv8 instruction set with full AArch64 execution, hardware H.265 Main Profile decoding up to 4K@60 Hz with H.265 Main10 support, OpenGL ES 3.1 / OpenCL 1.2 capable Mali-T720MP2 GPU running at up to 600 MHz, USB 2.0 host and OTG ports, Gigabit Ethernet MAC, and a flexible VOP (Video Output Processor) supporting HDMI 2.0, eDP, and MIPI-DSI. The integrated Cortex-A53 cores provide 2-3x the performance-per-watt of the previous-generation Cortex-A7 used in the RK3288. The RK3368 architecture uses a single homogeneous octa-core cluster with coherent L2 cache, simplifying software scheduling compared to big.LITTLE designs. The 28 nm process keeps idle power low, while the integrated LPDDR3 controller with 32-bit width and 800 MHz clock provides up to 6.4 GB/s memory bandwidth suitable for 4K video decode. Typical applications include 4K Android TV boxes, OTT streaming sticks, smart signage players, industrial HMI panels, and education tablets. The Cortex-A53's power efficiency also makes the part suitable for fanless enclosures. Design consideration: the RK3368 requires careful 4-layer or 6-layer PCB stack-up with matched-length DDR3 traces and a robust PMIC (RK806 or compatible). LPDDR3 routing demands 100 ohm differential impedance; deviations will cause read/write errors at high temperatures. This page synthesizes distributor pricing, drop-in Rockchip alternatives (same BGA-453 family where applicable), and design notes not consolidated in the public RK3368 datasheet.

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RMLV0816BGSD-4S2

RMLV0816BGSD-4S2 - 8Mb Low-Power SRAM 512Kx16 45ns TSOP | Renesas

The Renesas RMLV0816BGSD-4S2 is an 8-Mbit Advanced Low-Power Static RAM organized as 524,288-word x 16-bit (512K x 16), fabricated on Renesas' high-performance Advanced LPSRAM process technology. The device is offered in a 52-pin TSOP-II package and delivers 45 ns parallel access time, making it suitable for low-power embedded systems that require fast random read/write cycles. An LPSRAM (Low-Power SRAM) is a class of asynchronous static random-access memory that retains data without refresh and is optimized for ultra-low standby current consumption. LPSRAMs occupy a distinct position in the memory hierarchy: faster than NOR flash, lower pin-count than DRAM (no refresh controller required), and dramatically lower quiescent current than legacy SRAM - typically in the microamp range. They are widely used as working RAM, data buffers, and backup-memory companions to MCUs in industrial and consumer designs. Key features of the RMLV0816BGSD-4S2 include a single 2.7 V to 3.6 V supply, 45 ns address access time, fully static asynchronous operation (no clock required), TTL-compatible I/O, three-state outputs, and an operating temperature range of -40 C to +85 C for the industrial grade variant. The device supports byte-wise control via /LB and /UB pins for 8-bit/16-bit flexible access, plus standard /CS, /OE, and /WE control signals. Advanced LPSRAM technology achieves low standby current while maintaining fast access, suitable for battery-backed applications. Architecturally, the RMLV0816BGSD-4S2 employs a 6-transistor (6T) CMOS memory cell array with on-chip sense amplifiers and self-timed write circuitry. The advanced LPSRAM process allows smaller cell size while preserving the low-leakage characteristics that define the family. Internal address latches and a common I/O bus enable efficient 8-bit (byte) and 16-bit (word) access without external logic. Typical applications include industrial controls, factory automation PLCs, networking line cards, portable instrumentation, medical devices, POS terminals, and any battery-backed data-logging system requiring reliable byte-wide or word-wide buffering. Designers often pair this LPSRAM with low-power MCUs such as Renesas RX or RA families for energy-harvesting or sleep-mode designs. A key design consideration is the decoupling strategy: place a 0.1 uF ceramic bypass capacitor within 5 mm of the VCC pin and a 10 uF bulk capacitor on the supply rail. Avoid driving the I/O bus faster than the rated access time to prevent bus contention during read/write transitions. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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RMLV0816BGSD-4S2#AC0

RMLV0816BGSD-4S2#AC0 - 8Mb Advanced LPSRAM | Renesas | TSOP-II 52

The Renesas RMLV0816BGSD-4S2#AC0 is an 8-Mbit advanced low-power static RAM organized as 524,288-word × 16-bit (or 1M × 8), fabricated on Renesas's high-performance Advanced LPSRAM process. The device operates from a single 2.4V to 3.6V supply, provides 45 ns access time, and ships in a 52-pin TSOP-II surface-mount package. It is part of the RMLV0816BGSD family aimed at embedded systems that need byte-wide or word-wide battery-backed memory. A low-power SRAM (LPSRAM) is a type of volatile static random-access memory that retains data without refresh cycles and consumes very low standby current, making it the preferred choice for battery-powered or always-on subsystems. Within the broader memory hierarchy, LPSRAM sits between small on-chip MCU SRAM and larger DRAM, filling the role of fast, byte-addressable working memory. Compared to DRAM, LPSRAM eliminates the need for periodic refresh, simplifies board design, and improves immunity to bit errors caused by particle hits, at the cost of lower density per die. Key features of the RMLV0816BGSD-4S2 include a wide 2.4V–3.6V single-supply range, 45 ns access time, byte-control via UB#/LB# pins for x16 operation, support for x8 / x16 bus width selection, and very low standby current. The 52-TSOP II footprint is the industry-standard pinout for 8-Mbit word-wide SRAM, allowing it to replace legacy parallel SRAMs from Cypress, ISSI, and Alliance on existing PCB layouts. The Advanced LPSRAM cell technology keeps active current low while delivering fast read/write cycles for data logging or boot-loader scratchpad use. Internally, the die uses a six-transistor (6T) SRAM cell with CMOS I/O, including a chip-enable (CE#), write-enable (WE#), output-enable (OE#), and upper/lower byte select (UB#/LB#) for flexible bus sizing. The wide voltage range is achieved through on-chip charge-pump-free regulation, so no external VCCQ or VPP rail is required. The 45 ns access time is sufficient for direct connection to most microcontrollers and low-end microprocessors without wait-state insertion at ≤33 MHz, which covers typical MCU-class applications. Typical applications for the RMLV0816BGSD-4S2 include industrial control data buffers, metering and instrumentation scratch memory, networking router packet buffers, automotive infotainment working memory, and battery-backed data retention when paired with an external supercapacitor or coin cell. The wide 2.4V–3.6V range also suits USB, Bluetooth, and Zigbee module working memory. When designing with this part, ensure that decoupling (0.1 µF + 10 µF bulk) is placed within 5 mm of VCC, and respect the data retention voltage (typically 2.0V) if you intend to operate from a battery backup rail. UB# and LB# must be tied low for full 16-bit access; leaving them floating introduces bus contention and increases standby current. This page synthesizes Renesas datasheet parameters, distributor pricing as of 2026-10-10, same-package Renesas drop-in alternatives, and cross-package notes not found in the manufacturer datasheet.

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RMWV3216AGBG-5S2#AC0

RMWV3216AGBG-5S2#AC0 - 32Mb Advanced LPSRAM, 2Mx16, 55ns | Renesas

The Renesas Electronics RMWV3216AGBG-5S2#AC0 is a 32-Mbit Advanced Low-Power SRAM (LPSRAM) organized as 2,097,152 words × 16 bits, fabricated in Renesas's high-performance Advanced LPSRAM CMOS technology. It is offered in a 48-ball TFBGA package measuring 7.5 mm × 8.5 mm, operates from a single 2.7 V to 3.6 V supply, and delivers a 55 ns fast access time in parallel mode. The I-temperature grade (-40 °C to +85 °C) makes it suitable for industrial environments. An LPSRAM (Low-Power SRAM) is a class of asynchronous static random-access memory that retains data without refresh and offers dramatically lower active and standby current than conventional SRAM. LPSRAM sits in the broader memory hierarchy between volatile DRAM (which needs refresh and is dense) and true non-volatile memory (Flash/EEPROM, which is slow to write). Within Renesas's portfolio, Advanced LPSRAM targets battery-backed and energy-harvesting applications where every microwatt of quiescent current matters, while still delivering the byte-level random access that Flash cannot. Key features include very low standby current for battery-backup retention, a wide 2.7 V to 3.6 V single-rail supply range that simplifies power-tree design, common parallel SRAM interface pinout (CS, OE, WE, UB/LB byte enables) for drop-in replacement of legacy async SRAMs, and 3-STATE outputs for bus-sharing. The 48-ball TFBGA footprint is also substantially smaller than TSOP or SOJ packaging used by older 32-Mbit parallel SRAMs. Technically, the device uses a six-transistor (6T) CMOS memory cell array with on-chip address decoding and sense amplifiers, plus internal voltage generation for the memory core. The die is organized as 2M × 16 with separate upper-byte and lower-byte write enables (UB, LB), which simplifies 8-bit and 16-bit bus designs in the same socket. Power-saving features include automatic power-down when CS is deselected, plus data-retention modes down to 2.0 V for coin-cell backup. Typical applications include industrial metering and data loggers, factory automation controllers, point-of-sale terminals, automotive infotainment buffers, medical handheld instruments, networking line cards requiring fast read/write buffers, and battery-backed equipment such as e-meter or PLC retentive memory. The low standby current makes it attractive as a shadow RAM for systems that must preserve state through power loss. When designing with this part, follow the datasheet's decoupling guideline of a 0.1 µF ceramic capacitor placed within 5 mm of each VCC ball, plus a bulk 10 µF tantalum or ceramic on the supply rail. Place the device close to the host controller to keep the address/data bus traces short, since the 55 ns access time assumes modest capacitive loading. This page synthesizes distributor pricing and stock, drop-in alternative comparisons across Renesas's own RMWV3216A speed-grade family and competing 48-ball TFBGA LPSRAMs, and practical design notes not consolidated in the manufacturer datasheet.

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RS512M16Z2DD-62DT

RS512M16Z2DD-62DT - 8Gbit DDR4 SDRAM 512Mx16 | Rayson

The Rayson RS512M16Z2DD-62DT is a high-performance DDR4 SDRAM (Double Data Rate Fourth Generation Synchronous Dynamic Random-Access Memory) device organized as 512M words by 16 bits, providing a total density of 8Gbit. It operates at a data rate of 3200 Mb/s/pin (DDR4-3200) with a CAS latency of 22, and is housed in a compact FBGA-96 package measuring 7.5x13 mm. This memory component is designed for mission-critical applications in industrial automation, telecommunications, edge computing, and embedded systems that require robust memory performance across extended temperature ranges. DDR4 SDRAM is the fourth generation of double data rate synchronous dynamic random-access memory, succeeding DDR3. It achieves higher speed and lower power consumption through a prefetch of 8n, a lower operating voltage of 1.2V, and improved signal integrity features such as on-die termination (ODT) and write leveling. DDR4 is a key component in modern computing systems, serving as the main memory for processors, and is also used in networking equipment, servers, and high-performance embedded designs. Key features of the RS512M16Z2DD-62DT include an operating temperature range of 0°C to +95°C, a supply voltage of 1.14V to 1.26V for VDD and 2.375V to 2.75V for VDDQ, and a clock frequency of 1.6GHz. It supports auto self-refresh, auto precharge, asynchronous reset, data mask, CRC, dynamic on-chip termination, ZQ calibration, and write leveling functions. These features ensure reliable operation and data integrity in demanding environments. The device utilizes advanced DDR4 architecture with a 16-bit I/O interface, enabling high-bandwidth data transfer. The FBGA-96 package provides excellent thermal and electrical performance, with a ball pitch that supports high-density PCB routing. The 512Mx16 organization is ideal for applications requiring large memory capacity with a moderate bus width, balancing density and pin count. Typical applications include industrial automation controllers, telecommunications infrastructure, edge computing gateways, and embedded systems that require high-speed, reliable memory. The wide temperature range and robust feature set make it suitable for harsh environments where standard commercial memory might fail. When designing with this DDR4 device, ensure proper termination and signal integrity practices are followed, including controlled impedance traces and appropriate on-die termination settings. The ZQ calibration pin must be connected to a 240-ohm resistor to ground for proper calibration.

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RTAX1000S-1LG624V

RTAX1000S-1LG624V - 1M-Gate Rad-Tolerant FPGA | Microchip

The Microchip Technology RTAX1000S-1LG624V is a radiation-tolerant antifuse FPGA delivering 1,000,000 equivalent system gates with 12096 CLBs, 18144 logic cells, and up to 418 user I/Os, housed in a 624-ball ceramic column grid array (LG624) package. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation and single-event effects encountered in orbital and deep-space environments. Unlike reprogrammable SRAM FPGAs, the RTAX-S family uses nonvolatile antifuse technology, in which permanent interconnects are formed at one-time programming. This eliminates configuration-storage vulnerabilities, gives true live-at-power-up operation, and makes the device a single-chip solution in the power management hierarchy of spacecraft avionics systems. Key features include one-time-programmable antifuse interconnect with no external configuration PROM, up to 540 kbits of embedded SRAM with optional EDAC protection, segmentable clock resources, chip-wide highway routing, and carry logic inherited from the commercial Axcelerator architecture. Total ionizing dose tolerance is 300 krad (functional) and 200 krad (parametric), with SEU rates below 1E-10 errors per bit-day. The CMOS architecture achieves a maximum combinatorial delay of 0.93 ns on the -1 speed grade. Embedded FIFO control logic and dual-port SRAM blocks support on-board data processing, telemetry formatting, and payload signal chains without external memory in many designs. Typical applications include satellite payload processing, spacecraft telemetry and command interfaces, radiation-hardened bus controllers, and Earth-observation instrument data acquisition where live-at-power-up behavior is mandated. Design consideration: because the device is one-time programmable, complete functional simulation and a prototyping pass on the pin-mapped commercial Axcelerator device via Microchip Extender boards or Aldec CG624 adaptor boards are strongly recommended before committing flight parts. This page synthesizes distributor availability data, same-footprint drop-in alternatives, and space-flight design guidance not consolidated on the manufacturer product page.

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RTAX1000SL-1CQ352V

RTAX1000SL-1CQ352V - 1M-Gate Rad-Tolerant Antifuse FPGA | Microchip

The Microchip Technology (Actel/Microsemi) RTAX1000SL-1CQ352V is a radiation-tolerant, antifuse-based FPGA delivering 1,000,000 equivalent system gates with 12,096 CLBs and 18,144 logic cells, housed in a 352-pin ceramic quad flat pack (CQ352) package with military/space screening per the -V ordering suffix. A radiation-tolerant FPGA is a field-programmable gate array qualified to survive the total ionizing dose (TID) and single-event effect (SEE) environments encountered in space flight. Within the power-management hierarchy of spacecraft avionics, the RTAX-S/SL family sits at the top of Microchip's rad-hard logic portfolio: FPGA -> radiation-tolerant programmable logic -> space-grade IC. Unlike flash- or SRAM-based FPGAs, the RTAX-S/SL family uses antifuse programmable interconnect that is one-time programmed, providing live-at-power-up operation with no external configuration storage required. Key features include 1,000,000 system gates of capacity, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and dedicated carry logic for arithmetic chains. Because the configuration is locked into the antifuse fabric, the device is immune to configuration upsets that plague SRAM FPGAs, dramatically reducing SEU-driven system-level mitigation overhead. The RTAX1000SL is based on the commercial Axcelerator architecture, so designers can prototype on cost-effective Axcelerator devices and migrate using Microchip's footprint-compatible adaptor board methodology and EDIF netlist/pinout conversion flow described in the RTAX-S/SL datasheet. Typical applications include spacecraft avionics buses, satellite payload data processing, telemetry/command interfaces, and instrument control in low-Earth-orbit and deep-space missions where low power and single-chip form factor matter. A key design consideration: antifuse devices are one-time programmable, so functional verification (simulation and hardware prototyping on Axcelerator equivalents) must be completed before programming flight units. This page synthesizes distributor sourcing data, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.

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RTAX1000SL-1LG624V

RTAX1000SL-1LG624V - 1M-Gate Rad-Tolerant FPGA | Microchip

The Microchip Technology RTAX1000SL-1LG624V is a radiation-tolerant Field Programmable Gate Array (FPGA) from the RTAX-SL family delivering 1,000,000 equivalent system gates, 18,144 logic cells, and 12,096 CLBs in a 624-pin LG (LGA) package. Built on 0.15 um CMOS process technology at a 1.5V core voltage, it offers a maximum CLB combinatorial delay of 0.93 ns. A radiation-tolerant FPGA is a programmable logic device qualified for space-flight environments, where cosmic rays and trapped-particle radiation would corrupt or destroy commercial FPGAs. The RTAX-SL family sits within the broader hierarchy: FPGA -> radiation-tolerant FPGA -> space-grade programmable logic, and is based on the commercial Actel Axcelerator architecture with anti-fuse one-time-programmable interconnect that is inherently immune to configuration upsets. Key differentiating features include true single-chip operation (no external configuration PROM required), live-at-power-up functionality, low static power consumption, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, and chip-wide highway routing. The one-time-programmable anti-fuse fabric eliminates the need for SEU-sensitive configuration memory, a major system-level advantage in orbit. Architecturally, the device combines combinatorial and sequential logic modules (CLBs) with dedicated embedded SRAM and high-speed interconnect derived from Axcelerator, supporting system performance up to hundreds of MHz while remaining latch-up immune and tolerant to total ionizing dose. Typical applications include satellite payload processing, spacecraft telemetry and command interfaces, orbital instrument control, and spaceflight avionics bus bridges where single-chip, low-power, radiation-tolerant logic is mandatory. Designers should note that anti-fuse programming is irreversible: finalize the design using the footprint-compatible prototyping flow before committing flight units. This page synthesizes verified distributor data, drop-in family alternatives, and design guidance not consolidated in the manufacturer datasheet.

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RTAX1000SL-LG624V

RTAX1000SL-LG624V - Rad-Tolerant FPGA, 1M Gates | Microchip

The Microchip Technology (Microsemi/Actel) RTAX1000SL-LG624V is a radiation-tolerant, antifuse-based field-programmable gate array (FPGA) delivering 1,000,000 equivalent system gates with 12,096 configurable logic blocks (CLBs) in a 624-terminal ceramic column grid array (CGA) package qualified for space-flight environments. A radiation-tolerant FPGA is a semiconductor device designed to operate reliably in the presence of cosmic radiation and solar particle events found in space orbits. Within the semiconductor hierarchy, it belongs to the programmable logic family: FPGA -> programmable logic IC -> digital integrated circuit. Unlike SRAM FPGAs, the RTAX-S/SL family uses antifuse technology, meaning configuration is permanent and non-volatile - the device is live-at-power-up with no external configuration memory required. Key features include single-chip form factor, low-power CMOS operation, built-in FIFO control logic within embedded SRAM blocks, segmentable clock structures, chip-wide highway routing, and dedicated carry logic for arithmetic functions. The related RTAX1000SL-1LG624V speed-grade variant specifies a maximum CLB combinatorial delay of 0.93 ns, indicating the family's high-speed capability. The RTAX-S architecture is based on the commercial Axcelerator device family, providing designers with proven system-level features while adding radiation tolerance through process and design hardening. Designers program the device once, and the antifuse connections retain the design through power cycles and radiation exposure - a critical property for launcher electronics, satellites, and planetary probes. Typical applications include satellite payload processing, spacecraft command and data handling, telemetry and telecommand interfaces, bus controllers, and radiation-exposed instrumentation for low-Earth-orbit and deep-space missions. When designing with this device, plan the power budget around the CMOS static current plus dynamic switching, and use Microchip's Libero SoC design suite with the provided footprint-compatible prototyping flow. This page synthesizes distributor stock listings, family datasheet parameters, drop-in alternative analysis, and practical design notes not consolidated in the manufacturer datasheet alone.

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RTAX2000D-1CQ352E

RTAX2000D-1CQ352E - 2M-Gate Rad-Tolerant FPGA CQFP352 | Microchip

The Microchip Technology RTAX2000D-1CQ352E is a 2,000,000-equivalent-gate radiation-tolerant antifuse FPGA organized as 19,712 Configurable Logic Blocks (CLBs), housed in a 352-terminal ceramic quad flat pack (CQFP352) and specified for operation from -55C to +125C. It belongs to the RTAX-S/SL and RTAX-DSP family of high-reliability, nonvolatile antifuse FPGAs designed for space-based applications. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of orbital and deep-space missions, where commercial devices would suffer total ionizing dose (TID) degradation and single-event effects. Within the power-management and processing hierarchy of a spacecraft avionics system, an FPGA such as the RTAX2000D sits between the onboard computer and sensor/interface electronics, implementing glue logic, bus interfaces, and high-throughput datapath functions. Key features include highly reliable nonvolatile antifuse technology, which retains its programmed configuration permanently and eliminates configuration-memory upset, and a DSP-rich architecture with up to 120 DSP mathblocks supporting 125 MHz 18-bit x 18-bit multiply-accumulate operations. Embedded memory extends to 540 kbits with optional EDAC protection, mitigating single-event upsets in on-chip SRAM. The RTAX2000D is a digital CMOS device based on the commercial Axcelerator architecture, with the radiation-tolerant RT variant distinguished by screening of ICCA current limits at 125C final electrical test. TID performance is 300 krad (functional) and 200 krad (per the RTAX-DSP family characterization), enabling multi-year missions in medium Earth orbit and beyond. Typical applications include spacecraft command and data handling, payload processing and sensor-data formatting, and telecommunications payload beam-forming, where the DSP mathblocks accelerate filtering and FFT workloads. Design consideration: antifuse FPGAs are one-time-programmable; prototypes should be validated on commercial Axcelerator Extender boards before flight-unit programming. This page synthesizes distributor sourcing data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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RTAX2000D-CQ352B

RTAX2000D-CQ352B - 2M-Gate Rad-Tolerant FPGA, CQFP-352 | Microchip

The Microchip (Actel/Microsemi) RTAX2000D-CQ352B is a radiation-tolerant, antifuse-based FPGA with 2,000,000 equivalent system gates, 29,568 logic cells organized as 19,712 CLBs, and a 1.5V core supply, housed in a 352-pin ceramic quad flat pack (CQFP-352) with burn-in screening (B suffix). A radiation-tolerant FPGA is a programmable logic device qualified for space-flight environments where total ionizing dose (TID) and single-event effects threaten conventional SRAM FPGAs. Within the power-management hierarchy of space avionics, the RTAX family sits in the on-board data processing tier, providing single-chip glueless logic that is live at power-up because its antifuse configuration is permanently programmed. Key features include antifuse one-time-programmable interconnect immune to configuration upsets, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and carry logic for arithmetic chains. The D-suffix die is screened with tighter ICCA current limits at 125C final electrical test compared to the standard RTAX2000S, supporting high-reliability programs. Architecturally, the RTAX2000D derives from the commercial Axcelerator family, using a 0.15-micron CMOS process with metal-to-metal antifuse elements. This yields low static power, no configuration PROM requirement, and no SEE-sensitive configuration memory, a decisive advantage over SRAM-based FPGAs in orbit. Typical applications include satellite payload data processing, spacecraft bus command and telemetry controllers, sensor interface and formatting logic, and radiation-hardened reconfigurable computing modules. Design-wise, plan the migration path: prototype against Axcelerator commercial parts using the footprint-compatible adaptor board and EDIF netlist/pinout conversion methodology described in the manufacturer datasheet before committing to the one-time-programmable RTAX device. This page synthesizes distributor availability, drop-in family alternatives, and design guidance not consolidated in the manufacturer datasheet.

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RTAX2000D-CQ352V

RTAX2000D-CQ352V - 2M-Gate Rad-Tolerant FPGA CQFP352 | Microchip

The Microchip Technology RTAX2000D-CQ352V is a radiation-tolerant, antifuse-based FPGA offering 2,000,000 equivalent system gates, 29,568 logic cells, and 19,712 configurable logic blocks (CLBs), housed in a 352-pin ceramic quad flat pack (CQFP352) with 0.500 mm terminal pitch. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of space, where total ionizing dose (TID) and single-event effects would degrade or destroy commercial silicon. Within the semiconductor hierarchy, the RTAX2000D-CQ352V belongs to the RTAX-S/SL and RTAX-DSP family of rad-tolerant FPGAs, derived from the commercial Axcelerator architecture, and sits in the broader category of programmable logic devices (PLDs) alongside CPLDs and structured ASICs. Key features include one-time-programmable antifuse configuration, which is inherently immune to configuration memory upsets caused by single-event effects; a nominal 1.5V core supply (1.425V to 1.575V range); and embedded SRAM blocks with built-in FIFO control logic for on-chip data buffering. The 'D' designation denotes the die lot, and the 'V' suffix indicates the qualification screening flow applied at final test. Architecturally, the device uses segmentable clock resources and chip-wide highway routing to distribute high-speed clocks and wide buses with low skew, supporting system-level integration typical of space-flight payload and platform electronics. Typical applications include satellite payload data processing, spacecraft bus control electronics, telemetry and telecommand interfaces, and radiation-hardened signal processing chains where reprogrammable SRAM FPGAs are unacceptable due to upset sensitivity. A key design consideration is that antifuse FPGAs cannot be reprogrammed after programming; design flows therefore rely on the footprint-compatible prototyping methodology using adaptor boards (such as the Aldec ACT-H3Ki-CQ352) before committing flight hardware. This page synthesizes distributor listings, family cross-references, and drop-in alternative data not consolidated in the manufacturer datasheet.

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RTAX2000DL-CQ352B

RTAX2000DL-CQ352B - 2M-Gate Rad-Tolerant FPGA | Microchip

The Microchip Technology RTAX2000DL-CQ352B is a radiation-tolerant antifuse FPGA from the RTAX-DSP family delivering 2,000,000 equivalent system gates organized as 19,712 CLBs, with up to 120 DSP mathblocks performing 18-bit x 18-bit multiply-accumulate at 125 MHz, housed in a 352-terminal ceramic quad flat pack (CQFP) with a 0.500 mm terminal pitch. A radiation-tolerant FPGA is a programmable logic device qualified for spaceflight environments, where total ionizing dose (TID), single-event effects, and reliability dominate the design hierarchy. The RTAX family sits within the broader taxonomy of FPGAs -> radiation-tolerant programmable logic -> space-grade semiconductors, and derives its architecture from the commercial Microsemi (Actel) Axcelerator family. Key features include nonvolatile antifuse programming technology, which is live-at-power-up and requires no configuration PROM, single-chip form factor, embedded SRAM blocks totaling up to 540 kbits with optional EDAC protection, segmentable clocks, and chip-wide highway routing. The DL variant integrates dedicated DSP mathblocks, offloading multiply-accumulate operations from general-purpose logic and dramatically improving FFT and FIR filter throughput per watt. Technically, the device is fabricated in CMOS and operates from a nominal 1.5V core supply (1.425V to 1.575V range per Microchip data). Radiation performance includes functional operation to 300 krad (Si) total ionizing dose and 200 krad (Si) for related parameters, per the RTAX-S/SL and RTAX-DSP datasheet. The hermetic ceramic metal-sealed CQFP package supports the outgassing and reliability requirements of spaceflight assembly. Typical applications include satellite payload processing, onboard image and signal processing, spacecraft bus controllers, and telemetry/telecommand systems - anywhere high DSP throughput must coexist with radiation tolerance and single-chip simplicity. A critical design consideration is that antifuse FPGAs are one-time programmable: any logic change requires a physical board replacement, so extensive pre-flight simulation and in-orbit flexibility trade-offs must be evaluated against SRAM-based alternatives. This page synthesizes verified distributor data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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RTAX2000DL-CQ352E

RTAX2000DL-CQ352E - 2M-Gate Rad-Tolerant FPGA CQFP-352 | Microchip

The Microchip Technology (Actel/Microsemi) RTAX2000DL-CQ352E is a 2,000,000-system-gate radiation-tolerant antifuse FPGA from the RTAX-DSP/RTAX-SL family, organized as 19,712 Configurable Logic Blocks (CLBs) and packaged in a 352-terminal ceramic quad flat pack (CQFP-352) with a square, metal-sealed cofired ceramic body measuring 48 mm x 48 mm on a 0.50 mm terminal pitch. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the heavy-ion and proton environments of orbital and deep-space missions. Within the space-electronics hierarchy (semiconductor -> programmable logic -> FPGA -> radiation-tolerant FPGA), the RTAX family sits in the one-time-programmable antifuse class, distinct from SRAM-based FPGAs: configuration data is stored physically in antifuse elements, so the device is live-at-power-up with no external configuration ROM required and no configuration upset mechanism. Key features include the 2M-gate fabric with embedded SRAM blocks featuring built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and 166 input and 166 output user terminals in the CQ352 package. The D-speed grade ordering option balances logic performance against total ionizing dose and single-event-effect performance for typical LEO and MEO missions. Architecturally, RTAX-DSP devices derive from the commercial Microsemi Axcelerator family, retaining its cluster-based logic structure while qualifying the fabric for space-flight doses. The antifuse OneTime programmability also reduces SEU-sensitive configuration overhead compared to SRAM FPGAs, and simplifies board design with a true single-chip form factor. Typical applications include satellite payload data processing, spacecraft avionics and command/data-handling units, telemetry encoders, and sensor-interface digital signal processing on orbital platforms where low power, radiation tolerance, and instant-on operation are mandatory. A key design consideration: antifuse FPGAs are one-time programmable, so the design must be fully verified in simulation and via the footprint-compatible Axcelerator prototyping flow (adaptor-board methodology) before committing hardware; pinout changes after fabrication are impossible. This page synthesizes distributor listings, drop-in alternatives within the CQ352 footprint, and practical space-design notes not found in the manufacturer datasheet.

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RTAX2000S-1CGS624EV

RTAX2000S-1CGS624EV - 2M-Gate Rad-Tolerant FPGA | Microchip

The Microchip Technology (Actel/Microsemi) RTAX2000S-1CGS624EV is a radiation-tolerant FPGA from the RTAX-S/SL and RTAX-DSP family offering 2,000,000 equivalent system gates and 21,504 logic cells (CLBs) in a 624-pin ceramic column grid array (CGA/CCGA-624) package. It operates from a nominal 1.5V core supply (1.425V to 1.575V) across a military/space temperature range of -55C to +125C, fabricated on a 0.15um CMOS process with performance up to 649 MHz. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the single-event effects and total ionizing dose found in space-flight radiation environments. Within the power hierarchy, it belongs to the programmable logic device (PLD) family: FPGA -> radiation-tolerant FPGA -> space-grade programmable logic. Unlike SRAM FPGAs that require external configuration, RTAX-S devices are one-time programmable anti-fuse based, providing true single-chip, live-at-power-up operation that eliminates the need for a configuration PROM and reduces boot-time vulnerability. Key features include SEU-hardened registers that eliminate the need for Triple-Module Redundancy (TMR), immunity to single-event upsets to a specified LET threshold, and a quoted SEU rate of less than 10-10 errors per bit-day, plus embedded SRAM with built-in FIFO control logic, segmentable clock resources, and chip-wide highway routing inherited from the commercial Axcelerator family architecture. Technically, the RTAX2000S derives from the Axcelerator fabric with radiation hardening by design. The anti-fuse interconnect is inherently immune to configuration upsets, so only user registers require SEU hardening. Embedded SRAM blocks support FIFO and dual-port operation for on-board data processing and payload buffering. Roughly 250,000 equivalent ASIC gates of embedded resources supplement the programmable fabric in the RTAX-DSP oriented members. Typical applications include satellite payload data processing, spacecraft command and data handling (C&DH), telemetry encoder/decoder logic, and instrument control in low-Earth-orbit and deep-space missions where reprogrammability is not required and radiation robustness is paramount. A key design consideration is that the CGA-624 ceramic package requires a compatible land pattern and column-grid socket strategy; verify thermal resistance per the JEDEC JESD51 simulation conditions cited in the manufacturer datasheet. This page synthesizes distributor listings, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.

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RTAX2000S-1CQ352PROTO

RTAX2000S-1CQ352PROTO - Rad-Tolerant FPGA 2M Gates | Microchip

The Microchip Technology RTAX2000S-1CQ352PROTO is a radiation-tolerant FPGA from the RTAX2000S family, providing 21,504 configurable logic blocks (CLBs), approximately 2 million equivalent system gates, and a CQFP352 ceramic quad flat pack package in a PROTO (prototyping/engineering) device designation with commercial temperature grade and -1 speed grade. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive and operate reliably in space-flight radiation environments, where total ionizing dose (TID) and single-event effects would degrade or destroy standard commercial silicon. Within the power-management hierarchy of avionics electronics, these devices occupy the top reliability tier above standard and military-grade FPGAs, sitting in the broader taxonomy of programmable logic: FPGA -> radiation-tolerant FPGA -> space-grade programmable logic IC. Key differentiating features of the RTAX-S family include low-power operation, a true single-chip form factor (no configuration PROM required at startup), and live-at-power-up behavior enabled by antifuse programmability. Unlike SRAM-based FPGAs, the antifuse architecture is one-time programmable, so configuration data is inherently immune to configuration upsets and the device is functional immediately when power is applied - a critical property for spacecraft that cannot tolerate a configuration reload cycle. Architecturally, the RTAX2000S is fabricated in a CMOS process and organizes its ~2 million gates across logic modules, embedded SRAM blocks, and I/O clusters. Designers implement radiation-hardening-by-design techniques at the system level, typically combining the RTAX-S fabric with external triple-module-redundancy (TMR) schemes supported by Microchip's Libero design suite and Hi-Rel mitigation flows. Typical applications include satellite payload processing, spacecraft bus control, telemetry and telecommand interfaces, and launch-vehicle avionics - anywhere complex logic must operate for years in orbit. The PROTO suffix denotes engineering/prototype hardware intended for design development and system validation rather than flight lots. A key design consideration: PROTO devices must not be substituted for qualified flight units in final flight hardware; flight programs should transition to the corresponding V (flight) suffix part. This page consolidates verified specifications, drop-in family alternatives, and procurement guidance beyond what distributor listings typically show.

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RTAX2000S-CG624PROTO

RTAX2000S-CG624PROTO - 2M-Gate Rad-Tolerant FPGA CCGA-624 | Microchip

The Microchip Technology (Actel/Microsemi) RTAX2000S-CG624PROTO is a prototyping variant of the RTAX-S radiation-tolerant FPGA family, offering 2,000,000 equivalent system gates, 21,504 logic cells (R-cells) and 32,256 flip-flops in a 624-ball ceramic column grid array (CCGA-624) package. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the single-event upset (SEU) and total ionizing dose (TID) environment of space flight. Within the power-management hierarchy of a spacecraft avionics stack, the FPGA sits as the central programmable logic element between the on-board computer and mission payloads, and the RTAX-S family is a radiation-tolerant antifuse (one-time programmable, OTP) member of the broader FPGA/programmable logic taxonomy. Key features include SEU-hardened registers that eliminate the need for triple-module redundancy (TMR) on flip-flops, live-at-power-up operation due to the non-volatile antifuse fabric, true single-chip form factor without external configuration memory, and low static power consumption. The PROTO suffix denotes a prototyping device intended for design validation before flight-unit programming. Architecturally, the RTAX2000S uses CMOS antifuse technology with an R-cell/C-cell logic fabric and supports clock speeds up to approximately 350 MHz. I/O standards include single-ended and differential pairs via dedicated P/N pin pairs, and embedded SRAM blocks support FIFO and dual-port memory functions. Typical applications include satellite payload data processing, spacecraft telemetry and command interfaces, attitude control electronics, and radiation-tolerant glue logic replacing multiple ASIC functions. Design consideration: per Microchip application note AC170, prototyping must be done with the RTAX-S design flow in Libero SoC converted to an Axcelerator device; reverse flow is not permitted, so final timing closure must always be verified on the RTAX-S target. This page adds value beyond the datasheet with drop-in alternatives, cross-reference data, and distributor sourcing information synthesized from live web data.

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RTAX2000S-CQ256PROTO

RTAX2000S-CQ256PROTO - 2M-Gate Rad-Tolerant FPGA Prototype | Microchip

The Microchip Technology (formerly Microsemi/Actel) RTAX2000S-CQ256PROTO is a radiation-tolerant FPGA prototype device delivering 2,000,000 system gates with 21,504 Configurable Logic Blocks (CLBs) in a 256-pin ceramic quad flat package (CQFP-256). Built on CMOS anti-fuse architecture, it supports system frequencies up to 350 MHz and provides 136 user input/output pins, with functional characteristics matching the flight-unit RTAX2000S in a non-hermetic package. A radiation-tolerant FPGA (Field Programmable Gate Array) is a programmable logic device engineered to survive the ionizing radiation environments of space flight, including total ionizing dose (TID), single-event upset (SEU), and single-event latchup (SEL). Within the power hierarchy of spacecraft electronics, the RTAX-S family sits alongside rad-hard processors and memory as core onboard data-processing silicon, using anti-fuse programmable interconnect that is programmed once and remains stable under radiation. Key features of the RTAX2000S-CQ256PROTO include low-power consumption, true single-chip form factor, and live-at-power-up (LAPU) operation, which eliminates the need for an external configuration device. The PROTO variant shares the same functional characteristics as the space flight unit but ships in a non-hermetic package at a fraction of the cost, specifically for functional verification before committing to flight parts. Architecturally, the RTAX-S/SL family uses Microchip's Axcelerator-derived logic fabric with a sea-of-modules architecture combining C-cells, R-cells, and embedded SRAM/dedicated FIFO blocks, enabling high performance at densities up to four million equivalent system gates for space-based applications. Typical applications include satellite on-board data handling, spacecraft payload processing, telemetry and telecommand interfaces, and reprogrammable prototyping of RTAX-S flight designs. Designers often pair the PROTO device with Aldec prototyping adaptors that map ProASIC3E flash technology onto the CQ256 footprint for iterative functional verification. A key design consideration is that PROTO devices are non-hermetic and not radiation-screened, so they must never be flown; they exist solely for de-risking the flight design. Timing closure performed on PROTO silicon should be re-verified against flight-grade specifications. This page synthesizes distributor availability, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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RTAX2000S-CQ256V

RTAX2000S-CQ256V - 2M-Gate Rad-Tolerant FPGA, CQFP-256 | Microchip

The Microchip Technology (Actel/Microsemi) RTAX2000S-CQ256V is a 2,000,000-gate RTAX-S radiation-tolerant FPGA built on CMOS antifuse technology, offering 32,256 logic cells and 21,504 configurable logic blocks (CLBs) in a 256-pin ceramic quad flat package (CQFP-256, JESD-30 code S-CQFP-F256). A radiation-tolerant FPGA is a field-programmable gate array engineered to survive and operate reliably in the space radiation environment, where total ionizing dose (TID) and single-event effects (SEE) would impair standard commercial devices. The RTAX-S family sits within Microchip's space-grade programmable logic hierarchy, designed specifically for space-flight systems where low power, single-chip integration, and live-at-power-up operation are mandatory. The defining feature of the RTAX2000S is its antifuse programming technology. Unlike SRAM-based FPGAs, the antifuse configuration is non-volatile and inherently radiation-immune: the device is live at power-up with no configuration time, no external configuration PROM, and no configuration-bit upset risk. This gives the RTAX2000S a true single-chip form factor, reducing board area, mass, and system complexity in orbit. The device targets high-reliability space designs with low static power consumption, an important consideration for solar- and battery-powered spacecraft. Logic density of 2 million system gates accommodates payload processing, bus interfaces, telemetry formatting, and glueless integration of boards that previously required multiple ASICs or discrete devices. The 'V' speed-grade ordering suffix and ceramic CQFP-256 hermetic package support qualification flows for flight hardware, and the part is used in the Microchip (formerly Actel) RTAX-S ecosystem supported by Libero SoC design software. Typical applications include satellite payload data processing, spacecraft avionics and command/data-handling units, telemetry and telecommand interfaces, sensor front-end acquisition in orbital platforms, and radiation-hardened control logic for scientific instruments. A key design consideration is that RTAX-S devices are one-time programmable: there is no reprogramming after flight, so designers rely on Aldec flash-based ProASIC3E prototyping adaptors for RTAX design validation before committing to hardware. This page synthesizes verified distributor and manufacturer data, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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RTAX2000S-LG1152V

RTAX2000S-LG1152V - 2M-Gate Rad-Tolerant FPGA | Actel/Microchip

The Actel (Microsemi/Microchip Technology) RTAX2000S-LG1152V is a 2,000,000-gate radiation-tolerant antifuse FPGA with 32,256 logic cells and 21,504 CLBs, housed in a 1152-pin ceramic column grid array (LG1152 / CG1152) package with V space qualification screening. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation and heavy-ion environments of spaceflight, where commercial devices would suffer latch-up, gate rupture, or configuration loss. Within the semiconductor hierarchy, the RTAX2000S belongs to the RTAX-S/SL and RTAX-DSP family of rad-tolerant FPGAs, which sits under programmable logic ICs and ultimately under space-grade digital integrated circuits. Unlike SRAM FPGAs, the RTAX-S family uses antifuse one-time-programmable technology, which is inherently immune to configuration upsets. Key features include approximately two million equivalent system gates, embedded SRAM blocks with built-in FIFO control logic, segmentable clock circuitry, chip-wide highway routing, and dedicated carry logic for arithmetic chains. Live-at-power-up operation eliminates the need for external configuration storage, and true single-chip form factor reduces board area, mass, and failure points, all critical attributes for spacecraft avionics. Architecturally, the device is based on the Microsemi commercial Axcelerator family, inheriting its high-performance CMOS fabric while adding radiation-tolerant process and qualification. Densities across the family reach four million equivalent system gates, allowing design porting between package-compatible siblings. Typical applications include satellite on-board data processing, payload signal processing, spacecraft bus control, telemetry/telecommand interfaces, and radiation-exposed instrumentation. Design consideration: prototype your RTAX2000S design on the footprint-compatible Axcelerator commercial device using Microchip's adaptor-board methodology and EDIF netlist/pinout conversion flow before committing to the flight unit, since antifuse parts are one-time programmable. This page synthesizes distributor listings, cross-reference data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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RTAX2000S-LG624V

RTAX2000S-LG624V - 2M-Gate Rad-Tolerant FPGA | Microchip

The Microchip Technology RTAX2000S-LG624V is a radiation-tolerant, anti-fuse-based FPGA delivering approximately 2,000,000 equivalent system gates with 21,504 Configurable Logic Blocks (32,256 logic cells) in a 624-column ceramic column grid array (CG624) package. It belongs to the RTAX-S/SL family purpose-built for space-flight systems. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of orbital and deep-space missions. Within the semiconductor hierarchy, it sits under programmable logic devices alongside standard FPGAs, but adds single-event and total-ionizing-dose tolerance that commercial parts lack. RTAX-S devices are one-time-programmable and live at power-up, making them a drop-in alternative to custom radiation-hardened ASICs for many payloads. Key features include highly reliable nonvolatile antifuse technology, up to 684 user I/Os, up to 540 kbits of embedded SRAM with optional EDAC protection, total ionizing dose tolerance of 300 krad (functional) and 200 krad (parametric), and single-event upset rates below 1E-10 errors per bit-day. These figures, taken from the Microchip RTAX-S/SL and RTAX-DSP datasheet, make the device suitable for missions where reconfiguration is not required but immunity to configuration upsets is essential. Architecturally, the RTAX-S family is based on the commercial Axcelerator fabric, using segmented clock structures, chip-wide highway routing, and embedded FIFO control logic. The antifuse interconnect is programmed once at the board factory and is inherently SEU-hard at the configuration level, unlike SRAM-based FPGAs that require scrubbing. The LG624 designation indicates a ceramic lid package qualified for screening in space-grade flows. Typical applications include satellite payload data processing, spacecraft bus control and telemetry, sensor interface and image-processing chains on orbiters, and guidance electronics on launch vehicles. Designers choose RTAX2000S when logic density of about two million gates must operate for years under radiation without configuration errors. A critical design consideration is that RTAX-S devices are one-time-programmable: verify the design thoroughly on a reprogrammable prototype such as the Aldec ACT-H3K-CG624 adaptor before programming flight units. This page synthesizes distributor data, drop-in alternatives within the same CG624 footprint, and practical design notes not found in the manufacturer datasheet. Pricing is quoted as of 2026-09-02.

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RTAX2000SL-1CG624PROTO

RTAX2000SL-1CG624PROTO - 2M Space FPGA | Microchip

The Microchip Technology RTAX2000SL-1CG624PROTO is a radiation-tolerant field programmable gate array (FPGA) with 2,000,000 equivalent system gates, 32,256 logic cells, and 21,504 CLBs, supplied in a 624-terminal ceramic CBGA624 column-grid package. It is part of the RTAX-S/SL family developed for space-flight systems where low power, true single-chip form factor, and live-at-power-up operation are essential. What is a radiation-tolerant FPGA? An FPGA is an integrated circuit whose logic fabric can be configured after manufacture. A radiation-tolerant FPGA is designed to operate in environments with high-energy particles such as low-Earth orbit, deep space, and avionics. In the product hierarchy, RTAX-S/SL belongs to FPGA -> programmable logic device -> integrated circuit. Unlike ordinary commercial SRAM FPGAs, the RTAX2000SL family is intended for high-reliability systems that require predictable performance under ionizing-radiation exposure and a non-volatile, live-at-power-up architecture. The RTAX2000SL-1CG624PROTO provides 2,000,000 equivalent system gates, 32,256 logic cells, and 21,504 CLBs in the RTAX2000SL variant. The device is based on advanced CMOS technology and is supplied in the high-density CG624 footprint. According to the Microchip product family page, RTAX-S radiation-tolerant FPGAs combine industry-leading space-flight design advantages including low-power consumption, true single-chip implementation, and live-at-power-up operation. The architecture is derived from the Microsemi commercial Axcelerator family. Datasheet-level family features include embedded SRAM with built-in FIFO control logic, segmentable clocks, chip-wide highway routing, and carry logic. These resources enable complex digital system implementation without requiring an external boot PROM. The CBGA624 package provides a large number of controlled-impedance interconnects for dense space board designs. Typical applications include spacecraft command and data handling, launch-vehicle avionics, radiation-tolerant payload processing, secure defense communication baseband processing, and remote-sensing instrument control. The 2M-gate density is large enough for moderate image processing, telemetry formatting, protocol engines, and sensor interfaces, while remaining manageable for single-chip system architectures. Engineers using this PROTO ordering code should treat it as an engineering/prototype part for system development. When the design matures, select a production screening variant such as RTAX2000SL-1CG624V for flight hardware. Always verify package drawing, thermal management, and I/O assignments from the manufacturer datasheet before committing the layout. This page synthesizes distributor availability signals, cross-reference data, packaging context, and practical engineering notes that are not all listed on the manufacturer product page. Pricing and stock should always be re-quoted with an authorized distributor before procurement.

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RTAX1000S-1LG624V - 1M-Gate Rad-Tolerant FPGA | Microchip

RTAX1000SL-1CQ352V - 1M-Gate Rad-Tolerant Antifuse FPGA | Microchip

RTAX1000SL-1LG624V - 1M-Gate Rad-Tolerant FPGA | Microchip

RTAX1000SL-LG624V - Rad-Tolerant FPGA, 1M Gates | Microchip

RTAX2000D-1CQ352E - 2M-Gate Rad-Tolerant FPGA CQFP352 | Microchip

RTAX2000D-CQ352B - 2M-Gate Rad-Tolerant FPGA, CQFP-352 | Microchip

RTAX2000D-CQ352V - 2M-Gate Rad-Tolerant FPGA CQFP352 | Microchip

RTAX2000DL-CQ352B - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000DL-CQ352E - 2M-Gate Rad-Tolerant FPGA CQFP-352 | Microchip

RTAX2000S-1CGS624EV - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000S-1CQ352PROTO - Rad-Tolerant FPGA 2M Gates | Microchip

RTAX2000S-CG624PROTO - 2M-Gate Rad-Tolerant FPGA CCGA-624 | Microchip

RTAX2000S-CQ256PROTO - 2M-Gate Rad-Tolerant FPGA Prototype | Microchip

RTAX2000S-CQ256V - 2M-Gate Rad-Tolerant FPGA, CQFP-256 | Microchip

RTAX2000S-LG1152V - 2M-Gate Rad-Tolerant FPGA | Actel/Microchip

RTAX2000S-LG624V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000SL-1CG624PROTO - 2M Space FPGA | Microchip