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TUSB9261-Q1 - USB 3.0 to SATA Bridge AEC-Q100 | TI
The Texas Instruments TUSB9261-Q1 is an automotive-qualified, ARM Cortex-M3 microcontroller-based USB 3.0 to Serial ATA (SATA) bridge delivered in a 64-pin HTQFP package rated for -40C to +85C operation. It provides the hardware and firmware needed to implement a USB Attached SCSI Protocol (UASP)-compliant mass storage device, bridging HDDs, SSDs, optical drives, and other SATA 1.5-Gbps or SATA 3.0-Gbps devices to a SuperSpeed USB 3.0 host. A bridge IC is a dedicated interface converter that sits between two different bus protocols and translates transactions between them. Within the interface IC hierarchy (bridge -> USB interface controller -> interface IC -> semiconductor), the TUSB9261-Q1 belongs to TI's second generation of SuperSpeed USB-to-SATA bridges, specifically qualified for automotive applications per AEC-Q100, with a device CDM ESD classification of Level C3 as the noted exception. Key features include an embedded ARM Cortex-M3 processor core running TI firmware for UASP compliance, native support for SATA 1.5-Gbps and 3.0-Gbps device classes, and USB 3.0 SuperSpeed 5-Gbps connectivity on the host side. UASP support delivers significantly higher command queuing efficiency than legacy BOT (Bulk-Only Transport), reducing latency and improving throughput with modern SSDs. Integrated PHYs reduce external component count and BOM cost. The Cortex-M3 architecture allows TI to update bridge firmware, adding features and fixing interoperability issues without hardware changes, which is valuable for long-lifecycle automotive programs. AEC-Q100 qualification supports infotainment, telematics, and diagnostic ports where USB-attached storage must survive automotive temperature and ESD environments. Typical applications include automotive infotainment USB storage ports, in-vehicle diagnostic data loggers with SSD storage, and external HDD/SSD docking designs requiring automotive grade qualification. Design consideration: this device is flash-based firmware dependent; plan for firmware update provisions (I2C/EEPROM boot) in the PCB layout, and observe the datasheet note regarding SATA pin swapping documented on the TI E2E forum before finalizing routing.
TXB0104-Q1 - 4-Bit Auto-Direction Level Translator | TI
The Texas Instruments TXB0104-Q1 is an automotive-grade 4-bit bidirectional voltage-level translator with automatic direction sensing and +/-15 kV ESD protection, available in a 14-pin TSSOP (PW) package. It translates between two independent supply rails: the A port tracks VCCA from 1.2 V to 3.6 V, while the B port tracks VCCB from 1.65 V to 5.5 V, enabling any-to-any translation between 1.2 V, 1.8 V, 2.5 V, 3.3 V and 5 V logic domains. A voltage-level translator is a logic-family device that allows integrated circuits operating at different supply voltages on the same PCB to exchange digital signals safely. Within the power-and-signal-management hierarchy, it sits alongside buffers and bus switches as a fundamental interface IC, preventing overvoltage damage and ensuring valid logic thresholds between low-voltage MCUs, FPGAs, and 5 V peripherals. Key features include auto-direction sensing, which eliminates the DIR control pins required by '245-style translators, a data rate of up to 100 Mbps, and VCC isolation: when either supply is at GND, all I/O enters Hi-Z. The AEC-Q100-qualified TXB0104-Q1 also carries +/-15 kV HBM ESD protection, exceeding the standard JESD ratings cited in the TI datasheet family. Architecturally, the TXB0104 uses a self-directed, edge-rate-driven one-shot scheme that detects the direction of each transition and briefly strengthens the opposite driver, allowing it to drive 4 channels in either direction without software intervention. The OE pin three-states all outputs for power sequencing and bus isolation. Typical applications include SPI and UART level conversion between 3.3 V MCUs and 5 V peripherals, GPIO expansion in automotive body and infotainment modules, and mixed-voltage FPGA I/O. Note that the push-pull architecture is not recommended for open-drain buses such as I2C or 1-Wire; use the TXS0104E-Q1 for those. Design consideration: keep unloaded outputs low-impedance driven or grounded, since the auto-direction circuitry can oscillate on lightly loaded or capacitively large nets; series resistors above 25 k-ohm are not supported. This page adds value beyond the TI datasheet by synthesizing distributor availability, drop-in alternatives (NXP NTS0304E, ADI ADG3304), and practical design notes for automotive level-shifter selection.
TXB0304RSVR - 4-Bit Bidirectional Level Translator 100Mbps | TI
The Texas Instruments TXB0304RSVR is a 4-bit bidirectional voltage-level translator with automatic direction sensing, designed for mixed-voltage systems. It operates with two separate power-supply rails, VCCA and VCCB, each configurable from 0.9V to 3.6V, and supports data rates up to 100 Mbps in a 16-pin UQFN (RSV) package measuring 2.6mm x 1.8mm, ideal for space-constrained designs. A voltage-level translator is a crucial component in modern electronics, allowing communication between ICs operating at different voltage levels. For example, a 1.8V microcontroller can interface with a 3.3V sensor or memory device without risking damage or logic errors. The TXB0304 belongs to the TXB family of auto-direction-sensing translators, part of TI's broader level-shifting portfolio that includes unidirectional and bidirectional solutions for various interface standards. Key features include a fully symmetric supply range (0.9V to 3.6V on both VCCA and VCCB), automatic direction sensing that detects data flow without external direction control, and a high data rate of 100 Mbps. The device also provides an isolation function: if either VCC input is at GND, all outputs are placed in a high-impedance state, preventing backflow current and protecting the system. Technically, the TXB0304 uses a one-shot circuit to accelerate rising edges, ensuring fast signal propagation even with capacitive loads. The architecture includes a pass-gate transistor with a pull-up resistor on each I/O pin, providing robust translation. The device is specified from -40C to +85C, is RoHS compliant and lead-free. Typical applications include SPI, I2C, UART, and GPIO interfacing between microcontrollers, sensors, memory, and peripherals at different voltage levels, particularly in IoT devices, portable electronics, and industrial control systems. Design tip: ensure both VCCA and VCCB are powered and place decoupling capacitors close to the power pins. Note that push-pull drivers are preferred; open-drain buses require external pull-ups sized carefully.
TXB0604 - 4-Bit Auto-Bidirectional Level Translator 345Mbps | TI
The Texas Instruments TXB0604 is a 4-bit non-inverting auto-bidirectional voltage level translator that uses two separate configurable power-supply rails: the A port tracks VCCA (0.9V to 2V) and the B port tracks VCCB (1.65V to 3.6V), with the constraint VCCA <= VCCB. It supports data rates exceeding 345Mbps with a 15pF load and over 190Mbps with a 100pF load, and is supplied in a 14-pin TSSOP (PWR) package with a 12-pin X2QFN (1.6x1.6mm) option (RWBR). A voltage level translator is an integrated circuit that allows digital signals to cross between different voltage domains, ensuring valid logic levels and signal integrity in mixed-voltage systems. Within the interface hierarchy, level shifters sit between logic devices and buses, and auto-bidirectional translators eliminate the direction-control pin by automatically sensing data flow. Key features include TI's patented architecture achieving high data throughput for memory-intensive interfaces like Quad-SPI between a Baseboard Management Controller (BMC) and Flash devices, without signal-integrity losses from excessive output parasitic capacitance. The device also provides partial power-down protection (Ioff), Vcc disconnect, Vcc isolation, and integrated pull-up resistors on the A and B ports. Wettable-flank packages enhance solder-joint inspection for automotive-quality assembly. Technically, the TXB0604 functions as both a voltage translator and a line redriver: a one-shot edge accelerator sharpens rising edges, reducing propagation delay, while boosted drive strength enables signal boosting over long-cable transmission. Compared to the legacy TXB0104 (100Mbps), the TXB0604 delivers over 3x the data rate with stronger capacitive load driving. Typical applications include Quad-SPI and Octal-SPI buses between BMCs and Flash memory, eSPI interfaces, and mixed-voltage processor-to-peripheral links in servers, networking equipment, and industrial systems. Design tip: always ensure VCCA <= VCCB, place decoupling capacitors close to both supply pins, and avoid floating unused inputs in partial power-down states. Pricing below is as of 2026-08-30.
TXE8124-Q1 - 24-Bit Automotive SPI I/O Expander | TI
The Texas Instruments TXE8124-Q1 is an automotive-grade 24-bit SPI bus I/O expander with interrupt output, reset input, and I/O configuration registers, operating from a 1.65V to 5.5V VCC supply and available in a VQFN-32 (RHB) package. An SPI I/O expander is a type of interface IC within the broader semiconductor hierarchy (interface IC -> I/O expander -> logic/integration device) that adds general-purpose parallel input/output pins to a microcontroller or processor using the four-wire Serial Peripheral Interface protocol. It belongs to the same product family as GPIO extenders and port expanders, and is the SPI counterpart to I2C expanders such as the PCX857x family, offering higher speed and deterministic timing. Key features include 24 configurable GPIO channels with individual I/O configuration registers, a dedicated interrupt output (INT) that flags input state changes to the host controller, and a reset input (RST) for rapid recovery of the register map to a known default state. The device supports both standard point-to-point SPI communication and daisy-chaining of multiple devices, allowing several expanders to share a single SPI chip-select in dense I/O designs. Performance scales with supply voltage: according to the Texas Instruments datasheet, the TXE8124-Q1 supports a 10MHz SPI clock when VCC is 3.3V to 5.5V and 5MHz when VCC is 1.65V to 5.5V. This voltage-flexible operation allows direct interfacing with 1.8V, 2.5V, 3.3V, and 5V logic domains without level translation in many systems. Typical applications include automotive body control modules, gateway ECUs, and infotainment boards that need additional GPIO for switches, push-buttons, sensors, LEDs, fans, and relay drivers when the host processor has exhausted its native GPIO. Daisy-chaining suits seat-control modules and door zones where dozens of switches must share one SPI port. When designing with this device, plan daisy-chain timing budgets around the 10MHz maximum clock and account for the added shift-register latency per cascaded device; also verify the interrupt output is polled or serviced before the register state can change again. This page synthesizes verified distributor and manufacturer data with drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet, giving engineers a single citable reference.
TXE8148DGGR - 48-Bit SPI I/O Expander 10MHz | Texas Instruments
The Texas Instruments TXE8148DGGR is a 48-bit SPI bus I/O expander with interrupt output, reset input, and I/O configurable registers, delivering 48 general-purpose I/Os across six 8-bit ports with 10 MHz SPI operation from a 1.65 V to 5.5 V supply in a 56-pin TSSOP package. An I/O expander is a peripheral interface IC that increases the number of input/output pins available to a host microcontroller or processor without changing the host silicon. In the digital system hierarchy it sits between the host bus master (SPI in this case) and the GPIO load, functioning as a bridge in the broader family of interface ICs. I/O expanders such as the TXE8148 offload pin-count-constrained MCUs, allowing one SPI bus to control dozens of additional digital signals with only four host wires plus chip select. Key features include per-I/O programmable open-drain or push-pull outputs, programmable pullup and pulldown resistors, bus-hold latchable inputs, maskable interrupts with an interrupt status register, and a fail-safe operating mode. The device also supports daisy-chaining of multiple TXE8148 units on a single SPI bus, and documentation is available to aid functional safety system design. Technically, the TXE8148 maintains a 10 MHz SPI bus frequency across the entire 1.65 V to 5.5 V VCC range, which is significant for mixed-voltage designs where many expanders derate speed at low supply. The six-port, eight-I/O-per-port register map gives engineers byte-aligned access to all 48 channels, and the reset input provides deterministic recovery of all registers to a known default state after a fault or watchdog event. Typical applications include industrial control panels that need many switch inputs and relay outputs, functionally safe systems requiring documented failure modes, and server or networking backplanes where a processor must monitor dozens of card-present, fault, and status signals. Design consideration: plan your interrupt strategy early - the maskable interrupt and status register let the host poll a single register instead of 48 GPIOs, but interrupt masks must be configured after every reset since registers return to defaults. This page synthesizes distributor pricing, availability, and practical design guidance not found in the manufacturer datasheet alone.
TXG1010 - 1-Bit ±10V Ground-Level Translator | Texas Instruments
The Texas Instruments TXG1010DSER is a 1-bit, fixed-direction, non-galvanic voltage and ground-level translator supporting logic-level shifting between 1.71V and 5.5V and ground-level shifting of up to ±10V, housed in a small 8-pin SOT-23 (DSE) surface-mount package. A level translator (also called a level shifter or voltage translator) is a logic IC that enables communication between digital circuits operating at different supply voltages, for example a 1.8V microcontroller driving a 5V peripheral. Within the signal-chain hierarchy, the TXG1010 belongs to the voltage-level-translation family of interface ICs. What distinguishes the TXG1010 family from traditional level translators is its ability to shift signals not only between different logic levels but also across different ground domains, solving the challenge of voltage translation between subsystems whose grounds differ by up to ±10V. Key features include a wide 1.71V to 5.5V logic-level translation range, ±10V ground-level shifting capability, a fixed-direction architecture that removes the need for a direction-control pin, and a single-channel (1-bit) topology that minimizes board area. The non-galvanic approach means there is no isolation barrier; the device tolerates ground potential differences rather than providing reinforced isolation, which is an important distinction from digital isolators. Technically, the device translates a logic input referenced to one ground domain into an output referenced to a second ground domain, while simultaneously performing standard low-voltage logic up- or down-translation. The fixed-direction design simplifies control logic and reduces pin count, making it suitable for one-way status, enable, and control signals. Typical applications include ground-offset compensation between a controller and a motor driver, level shifting in automotive and industrial subsystems where ground lift occurs under load, and interfacing between negative-rail or high-side circuitry and a low-voltage MCU. When designing with the TXG1010, remember that it is non-galvanic: sustained ground differences must remain within the ±10V rating, and it should not be used where safety isolation is required. Refer to the manufacturer datasheet for the exact truth table and supply sequencing requirements. This page synthesizes verified distributor and manufacturer data, practical design notes, and selection guidance not found in the datasheet alone. Pricing and stock figures are as of 2026-10-19.
TXG1021-Q1 - ±10V 2-bit Ground-Level Translator | TI
The Texas Instruments TXG1021-Q1 is an automotive-qualified 2-bit, fixed-direction, non-galvanic ground-level translator supporting DC ground shifts up to ±10V and logic-level shifting between 1.71V and 5.5V, with propagation delay under 5ns and data rates above 250Mbps in an 8-pin SOIC package. A ground-level translator is a specialized voltage translator that solves a problem conventional level shifters cannot: signals referenced to grounds that sit at different DC potentials. In a classic automotive or industrial system, heavy load currents lifted through shared harness returns create millivolt-to-volt offsets between a sensor ground and a controller ground. Standard level shifters interpret those offsets as logic errors, while a non-galvanic ground-level translator tolerates the DC offset directly on its inputs while still reproducing clean logic edges at the destination domain. Key features include AEC-Q100 qualification for automotive deployments, DC shift tolerance up to ±10V, AC noise rejection of 20VPP up to 45MHz, and common-mode transient immunity (CMTI) of 1kV/us. Channel-to-channel skew is below 0.20ns and propagation delay stays under 5ns, so the device does not become a timing bottleneck even in fast digital links. Quiescent power consumption is low at approximately 0.8mA per the manufacturer datasheet. Architecturally, the TXG102x family uses a non-galvanic coupling approach rather than isolation barriers, giving it near-zero added latency compared with digital isolators while still rejecting ground potential differences. This makes it attractive for bridging control grounds in battery-managed, motor-driven, or switched-load environments where return paths are far from ideal. Typical applications include automotive body-control and gateway modules, motor inverter gate-drive signaling across shifted grounds, industrial PLC I/O with grounded sensor offsets, and battery-management communication lines where cell-stacking creates ground potential differences. Design consideration: verify that expected DC ground offset stays within the ±10V rating under all load and fault conditions, and follow the datasheet layout guidance for the ground-shifted domain. This page adds value beyond the manufacturer datasheet by synthesizing drop-in alternatives, comparison tables, and practical design notes in one place.
TXG4042-Q1 - Automotive ±40V 4-bit Ground-Level Translator | TI
The Texas Instruments TXG4042-Q1 is an automotive-grade, ±40V, 4-bit fixed-direction ground-tolerant voltage level translator in a 2/2 push-pull configuration, housed in a 16-pin SSOP package. It supports DC ground shifts up to ±40V, AC noise rejection up to 130 VPP at 1 MHz, and a common-mode transient immunity (CMTI) of 1 kV/μs. The device delivers a maximum propagation delay of 8.5 ns, channel-to-channel skew of 2 ns, and supports data rates up to 100 Mbps. Low power consumption is 0.7 mA per channel at 1 Mbps with a 1.8 V supply, making it efficient for always-on automotive networks. The TXG4042-Q1 is specifically designed to interface low-voltage MCUs with high-voltage domains in systems where the grounds are not co-located, such as in EV traction inverters, motor drives, and industrial PLC I/O modules. A ground-level translator (also called a ground-level shifter) is a specialized class of voltage level translator that operates correctly even when the local ground reference of the input side differs substantially from the local ground reference of the output side. Unlike generic level shifters that only translate voltage thresholds, ground-level translators reject large common-mode DC offsets (typically ±25V to ±50V) between the two sides. This category of IC sits within the broader hierarchy of voltage translators -> interface ICs -> signal conditioning -> integrated circuits. They are essential in safety, motor-control, and renewable-energy systems where isolated high-side circuitry must communicate with low-voltage digital controllers over short, non-isolated links. Key features include robust ±40V DC ground-shift tolerance, high AC noise rejection of 130 VPP at 1 MHz, excellent 1 kV/μs CMTI for fast switching transients, push-pull output drivers with edge acceleration for clean edges at high data rates, and a wide 1.71 V to 5.5 V supply range on the low-voltage side. The fixed 2/2 direction (2 inputs / 2 outputs in one direction, 2 in the other) simplifies firmware and eliminates direction-control pins, reducing BOM cost and PCB area. AEC-Q100 qualification makes the TXG4042-Q1 suitable for automotive temperature grade 1 (-40 °C to +125 °C) operation. Architecturally, the TXG4042-Q1 uses TI's capacitorless, two-channel ground-shift topology with internal high-voltage blocking transistors on each channel. The high-voltage side tolerates continuous DC offsets via integrated clamping and ESD structures, while the input/output structures on the low-voltage side are optimized for sub-5 V CMOS logic levels. The device requires no external bootstrap capacitors, inductors, or programming resistors, simplifying PCB layout and reducing BOM count compared to digital isolator-based alternatives. Typical applications include EV traction inverter gate-driver communication, automotive HVAC and body controllers interfacing with high-side sensors, industrial PLC mixed-voltage I/O links, solar inverter string-monitoring interfaces, and battery-management system (BMS) communications across isolated high-voltage domains. It is also well-suited for medical imaging systems, white-goods motor drives, and any application requiring safe digital communication across non-isolated grounds with significant DC offset. When designing with the TXG4042-Q1, ensure the high-voltage side stays within ±40 V relative to the local ground. Place the VCC bypass capacitor as close as possible to the supply pin to maintain noise margins, and avoid long high-side traces to minimize parasitic coupling. For multi-channel applications, observe the 2 ns channel-to-channel skew budget to preserve signal alignment at the receiver. This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes that extend beyond the manufacturer datasheet, giving engineers actionable sourcing and design guidance in one place.
TXG4122 - ±40V Bidirectional I2C Ground-Level Translator | TI
The Texas Instruments TXG4122 is a dual (2-bit) bidirectional, non-galvanic voltage and ground-level translator designed specifically for I2C buses, housed in an 8-pin SOIC (D) package. It tolerates ground potential differences of up to ±40V, supports two separately configurable power-supply rails, and passes I2C signals at data rates up to 2 Mbps. A ground-level translator is a type of logic-level shifter within the broader family of signal interface and level-translation ICs. Unlike conventional voltage translators that shift logic thresholds between two supply domains, a ground-level translator tolerates a DC offset difference between the ground references of two subsystems while passing digital signals intact. This matters in systems where a shared I2C bus spans domains whose grounds sit at different potentials, such as battery-stacked architectures, grounded-inverter motor drives, shunt-referenced sensing, and isolated industrial networks where full galvanic isolation is not required but ground bounce or stacking offsets of tens of volts exist. Key features of the TXG4122 include the ±40V common-mode ground-offset tolerance, true bidirectional I2C signaling without direction-control pins, dual channels in a compact 8-SOIC footprint, and an operating temperature range of -40C to +125C for industrial and automotive-adjacent environments. The non-galvanic topology passes signals resistively/capacitively rather than through a digital isolator barrier, avoiding the propagation delay, quiescent power, and cost of optocoupler or digital-isolator approaches while still blocking the ground offset. Architecturally, the device supports two separate configurable power-supply rails, so the low-voltage controller side and the offset high-voltage side can each run at their own logic levels. Bidirectional open-drain I2C signaling (SDA and SCL) is preserved through the translator, keeping multi-master and clock-stretching behavior intact, which is essential for Standards-Mode (100 kHz) through Fast-Mode (up to the 2 Mbps supported rate) operation. Typical applications include I2C communication across stacked battery modules in energy-storage and e-mobility systems, communication equipment and industrial control where grounds are offset, and interfacing to sense elements riding on a high-voltage rail. Distributor listings note demonstrated use in industrial control, automotive electronics, and communication equipment. Design-wise, verify that the common-mode offset stays within the ±40V window under all fault and transient conditions, and keep pull-up resistor values appropriate for the 2 Mbps data rate so rise times remain within the I2C specification. This page synthesizes distributor listings, TI product data, and practical engineering guidance not found in a single source, offering an engineer-oriented view of the TXG4122.
TXS0102-Q1 - 2-Bit Auto-Direction Level Translator | TI
The Texas Instruments TXS0102-Q1 is an automotive-grade, 2-bit bidirectional voltage-level translator for open-drain and push-pull applications, offered in an 8-pin VSSOP (DCU) package. It supports data rates up to 24 Mbps and interfaces logic operating at different voltage levels without a direction-control pin. A voltage-level translator, or level shifter, is a logic IC that connects incompatible logic families or systems operating at different supply voltages, such as a 1.65V microcontroller communicating with a 3.3V or 5V peripheral. Within the signal-chain hierarchy, level translators sit between logic ICs and interface ICs, enabling safe chip-to-chip communication where voltage mismatch would otherwise damage a driver or fail to meet input thresholds. Key features include auto-direction sensing on both channels, A-port supply (VCCA) from 1.2V to 3.6V and B-port supply (VCCB) from 1.65V to 5.5V, an output-enable (OE) input referenced to VCCA that places all I/O in high impedance when low, and internal 10 kOhm pull-up resistors on the I/Os that make the device ideal for open-drain drivers such as I2C buses. The -Q1 suffix denotes AEC-Q100 qualification for automotive applications. Technically, the TXS0102 architecture uses two NMOS pass transistors with 10 kOhm pull-ups per I/O, allowing either port to drive the signal while the opposite side is pulled to its rail. This push-pull capability plus open-drain support distinguishes it from passive FET translators and fixed-direction buffers. Typical applications include I2C and SMBus level translation in automotive body electronics, UART and GPIO bridging in cluster and infotainment modules, and low-speed sensor interface translation between 1.8V MCUs and 3.3V peripherals. Design tip: tie OE to GND through a pull-down resistor to guarantee high impedance during power-up, and for push-pull drivers note that the internal 10 kOhm pull-ups limit edge rates at heavy capacitive loads.
TXS0108EQPWRQ1 - 8-Bit Auto-Direction Level Shifter | TI
The Texas Instruments TXS0108EQPWRQ1 is an automotive-grade, 8-bit bidirectional voltage level translator in a 20-pin TSSOP (PW) package, qualified per AEC-Q100 temperature grade 1 (-40C to +125C). It requires no direction-control signal because its auto-direction sensing architecture detects data flow on each channel independently, supporting both push-pull and open-drain applications. A voltage level translator (also called a logic level shifter or voltage translation IC) is an interface component in the broader logic and interface IC family that safely bridges digital devices operating at different supply domains, for example a 1.8V microcontroller talking to a 5V sensor. Level shifters protect low-voltage I/O from overvoltage while preserving logic thresholds, edge rates, and signal integrity across the voltage boundary. Key specifications include a wide VCCA range of 1.2V to 3.6V and VCCB range of 1.65V to 5.5V, enabling translation between almost any two common logic rails. Push-pull data rates reach 110 Mbps while open-drain operation supports 2 Mbps with integrated 10 kOhm pull-up resistors. The device also offers an OE pin for 3-state operation during power sequencing and classified HBM ESD level 2 and CDM level C6 robustness per TI data. Architecturally, the TXS0108E uses one-shot edge-rate accelerators on each channel to improve rise times, combined with a 4 kOhm series pass-gate element; this open-drain-friendly structure means it is not recommended for applications needing high drive strength such as direct LED loads. Typical applications include automotive infotainment and body-control module I/O translation, sensor and CAN-adjacent digital interfacing, and portable electronics bridging 1.8V/2.5V/3.3V memory or peripheral buses to 5V domains. All prices cited in this page are as of 2026-08-29. Design tip: because of the internal pull-ups, avoid this family for signals requiring low-capacitance backplane conditions; for heavy push-pull loads choose the TXB0108 instead.
UJA1169ATK/3Z - Mini HS-CAN SBC, 3.3V/250mA, AEC-Q100 | NXP
The NXP UJA1169ATK/3Z is a mini high-speed CAN System Basis Chip (SBC) in the UJA1169ATK family, integrating an ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant HS-CAN transceiver that supports CAN FD up to 5 Mbit/s together with an on-board 3.3 V (V1) LDO regulator rated at 250 mA for the host microcontroller supply, all housed in a 20-pin HVSON package (3.5 x 5.5 mm). What is a CAN System Basis Chip (SBC)? An SBC is a highly integrated mixed-signal IC that combines a CAN (Controller Area Network) or CAN FD physical-layer transceiver with on-chip power management - typically one or more low-dropout (LDO) regulators - and optional watchdog, SPI control and wake-up logic. In the automotive ECU hierarchy, an SBC sits between the 12 V board net, the host microcontroller, and the CAN bus, replacing several discrete components: an HS-CAN transceiver, a 5 V or 3.3 V regulator for the MCU, reverse-battery protection and bus ESD protection. The wider taxonomy is: SBC -> CAN transceiver -> automotive networking IC -> power management IC -> semiconductor. Key features of the UJA1169ATK/3Z include 250 mA continuous V1 current to power a small MCU, support for CAN FD at 5 Mbit/s, integrated bus dominant clamping and very low-current standby modes with remote wake-up via the bus. The transceiver meets the stringent automotive EMC and ESD requirements of the ISO 11898-2:2016 standard and the SAE J2284-1 to J2284-5 specifications, while the integrated regulator and protection circuitry reduce external component count and PCB area in ECU designs. Architecturally, the part uses a high-voltage analog/mixed-signal process for the bus-side drivers and a low-voltage digital block for the SPI register set and V1 LDO. This dual-rail approach allows direct connection to a 12 V automotive supply while still powering the host MCU from the on-chip 3.3 V regulator in the /3Z variant. Typical applications include body control modules, gateway ECUs, CAN node power management in 12 V systems, ADAS sensor interface nodes and any automotive system that needs a single-chip CAN interface plus local MCU supply. Compared with discrete CAN transceivers plus external regulators, the UJA116ATK family shrinks the BOM and simplifies EMC compliance. When designing with the UJA1169ATK/3Z, ensure the 12 V supply is properly filtered, route the CANH/CANL lines as a 120 ohm twisted pair, and decouple V1 with the value recommended in the manufacturer datasheet. The /3Z variant is the 3.3 V V1, tape-and-reel orderable variant; the 5 V variant is the UJA1169ATK/F/3Z and the non-Z variants differ only in packing or V1 voltage. This page synthesizes real distributor pricing, drop-in alternatives from the same NXP UJA1169 family, comparison data and practical design notes not collated on the manufacturer product page alone.
UJA1169ATK/F/3 - Mini HS-CAN SBC, 3.3V LDO, 20-HVSON | NXP
The NXP Semiconductors UJA1169ATK/F/3 is a mini high-speed CAN System Basis Chip (SBC) that integrates an ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant HS-CAN transceiver (supporting CAN FD up to 5 Mbit/s) together with a 3.3 V, 250 mA microcontroller supply and an internal 5 V regulator (V2) for the CAN transceiver. Housed in a 20-pin HVSON (3.5 x 5.5 mm) package, it provides partial networking with selective wake-up via CAN FD-passive capability. The /3 suffix designates the V1 regulator variant as 3.3 V rather than the 5 V used in the base UJA1169ATK, while the /F suffix enables the selective wake-up (partial networking) function. The device includes a watchdog, SPI control interface, and comprehensive protection features for automotive network nodes. A System Basis Chip (SBC) is an automotive-grade mixed-signal IC that consolidates a CAN/CAN FD transceiver with one or more voltage regulators, system protection, and optional wake-up logic into a single package. SBCs sit between the vehicle battery and the microcontroller, replacing several discrete components (transceiver, LDO, watchdog, reset generator) and reducing PCB area, BOM cost, and quiescent current in always-on networks. The UJA1169ATK family targets body-control modules, gateway ECUs, and zonal architectures in modern vehicles. Key features include a 3.3 V / 250 mA V1 regulator for the host MCU, a 5 V internal V2 regulator for the CAN transceiver, low quiescent current in standby and sleep modes with selective wake-up, an SPI interface for configuration and diagnosis, and integrated bus-failure management. The selective wake-up function allows ECUs to ignore CAN traffic not addressed to them, dramatically reducing network-wide quiescent current in CAN partial-networking architectures. The HVSON-20 package with exposed pad provides low thermal resistance for reliable operation in under-hood environments. The UJA1169ATK/F/3 is typically used in body and comfort ECUs, gateway modules, and any node that must wake selectively from CAN partial-networking traffic. It is particularly suited to OEM platforms targeting ISO 11898-2:2016 compliance with CAN FD-passive wake-up, where legacy nodes and FD-capable nodes coexist on the same bus. When designing with this SBC, ensure the HVSON exposed pad is soldered to a sufficient copper area for thermal dissipation, follow NXP's reference layout for the bus split termination, and configure the partial-networking filter mask in software to match the OEM-defined wake-up frame. All configuration is via SPI from the host MCU; no external programming is required. This page synthesizes distributor pricing, drop-in same-family variants, and practical design notes for the UJA1169ATK/F/3 that go beyond what the manufacturer datasheet alone provides.
UJA1169ATK/F/3Z - Mini HS-CAN SBC with 3.3V LDO | NXP
The NXP UJA1169ATK/F/3Z is a mini high-speed CAN System Basis Chip (SBC) that integrates an ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant HS-CAN transceiver supporting CAN FD up to 5 Mbit/s, alongside an onboard 3.3 V microcontroller supply (V1) and a second 5 V onboard LDO (V2), both rated at 250 mA, in a 20-pin HVSON (3.5x5.5 mm) package with exposed thermal pad. An SBC is an integrated automotive network IC that combines a CAN (Controller Area Network) physical-layer transceiver with one or more voltage regulators and supporting features such as watchdog, wake-up management, and fail-safe output control. The SBC sits between the vehicle battery (VBAT) and the microcontroller, providing a regulated supply while the HS-CAN transceiver links the host MCU to the in-vehicle CAN bus. This class of device collapses what would otherwise be several discrete ICs into a single package, reducing PCB area, BOM cost, and quiescent-current budget in body, chassis, and powertrain ECUs. Key specifications of the UJA1169ATK/F/3Z include: 3.3 V V1 LDO with 250 mA current capability, 5 V V2 LDO at 250 mA for the internal transceiver and additional onboard hardware, CAN FD data rates up to 5 Mbit/s, very low VBAT quiescent current in standby modes, and integrated fail-safe behavior with a watchdog and SPI control. The /3 suffix on this variant fixes V1 at 3.3 V rather than the 5 V used in the UJA1169ATK, UJA1169ATK/F, UJA1169ATK/X, and UJA1169ATK/X/F members of the family. The /F suffix indicates the SPI-gated watchdog configuration; the trailing Z designates the 13-inch reel SBB packing format. Architecturally, the UJA1169ATK/F/3Z pairs a high-speed CAN physical layer with two linear regulators sharing a common thermal pad. The HVSON-20 exposed-pad package keeps thermal resistance low so both regulators can sustain full 250 mA loads simultaneously, while the integrated CAN transceiver implements the ISO 11898-2:2016 standard and supports the SAE J2284 series bit-timing benchmarks used by global automakers. The device supports selective wake-up and several low-power modes that allow an ECU to drop to microamp-level quiescent draw when the bus is idle. Typical automotive applications include body control modules, gateway ECUs, sensor cluster nodes, HVAC controllers, comfort and convenience modules, and small powertrain controllers. The 3.3 V LDO mapping of the /3 variant makes the device a direct fit for low-voltage host microcontrollers such as the NXP S32K1xx family that operate from a 3.3 V rail. When laying out the PCB, place decoupling capacitors directly at V1 and V2 with short, wide ground returns, and attach the exposed thermal pad to a copper plane sized for the worst-case dissipation. Use a 13-inch reel handling process consistent with the Z suffix to integrate this part into high-volume surface-mount lines. This page synthesizes distributor pricing, drop-in alternative selection, and practical SBC design notes not found in the manufacturer datasheet.
UJA1169ATKZ - Mini HS-CAN SBC, 5V/3.3V LDO 250mA | NXP
The NXP UJA1169ATKZ is a mini high-speed CAN System Basis Chip (SBC) integrating an ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant HS-CAN transceiver with CAN FD support up to 5 Mbit/s, plus an integrated 5 V or 3.3 V, 250 mA voltage regulator (V1) for a host microcontroller or peripheral loads, all housed in a 20-pin HVSON (3.5 x 5.5 mm) exposed-pad package. It targets compact automotive body and network applications where PCB area, BOM count, and quiescent current are critical, and where a clean CAN bus interface plus a small, protected supply rail must coexist with a serial peripheral interface (SPI) control channel and independent watchdog. A System Basis Chip (SBC) is a category of automotive networking IC that combines a physical-layer transceiver with on-chip power, supervision, and diagnostic functions into a single die. Within the broader hierarchy, SBCs sit between standalone CAN transceivers (which provide only the bus interface) and full ECU power-management companions (PMICs), allowing one part to replace what traditionally required three or four discrete devices. The UJA1169 family achieves this by merging an HS-CAN physical layer with a low-drop linear regulator, a watchdog, an SPI configuration port, and a LIMP output for fail-safe system behavior. Key features include CAN FD support up to 5 Mbit/s for modern in-vehicle networking bandwidth, integrated 250 mA LDO selectable between 3.3 V and 5 V to host an MCU without an external regulator, very low quiescent current in standby modes for permanently connected nodes, integrated watchdog with window or timeout behavior, SPI for control and status, and a LIMP pin for graceful system degradation. The HVSON-20 exposed pad provides a low thermal resistance path suitable for harsh automotive environments. Architecturally, the device uses a mixed-signal BiCMOS process: the CAN transceiver meets ISO 11898-2:2016 (and the upcoming merged ISO 11898-2/5/6 standard for selective wake-up and CAN FD), while the regulator is implemented as a high-side series pass element with reverse-polarity and load-dump protection suitable for 12 V automotive battery rails. Battery/supply voltage can reach 28 V (with load-dump transient tolerance typical for 12 V systems). Typical applications include automotive body control modules (BCMs), gateway and CAN nodes requiring a regulated MCU rail, network sensors and actuators, HVAC controllers, seat/door/zone modules, and anywhere an HS-CAN node with integrated microcontroller power is needed to shrink the BOM. When designing with this part, derate the 250 mA regulator headroom against the V1 voltage tolerance, since a 12 V battery input powering a 5 V, 200 mA MCU load dissipates roughly 1.4 W in the package. Sufficient copper area on the exposed pad is recommended to keep the junction within the automotive temperature range. This page synthesizes NXP distributor pricing, qualified drop-in alternative cross-references, and practical automotive-node design notes that go beyond the manufacturer datasheet itself.
UM9921 - Microchip Technology | XAIPART
The Microchip Technology UM9921 is a component listed by Microchip Technology and distributed through authorized channels such as Arrow Electronics and indexed by Octopart, where it is categorized under the PIN (pin electronics / pin driver) product grouping. Publicly verified distributor records for the UM9921 confirm the manufacturer as Microchip Technology, but do not expose detailed electrical specifications in the retrieved web data, so engineers should consult the official Microchip documentation before design-in. A PIN-category device in the semiconductor hierarchy sits under interface ICs and signal-conditioning components: pin electronics are the circuits that drive and receive signals on the pins of a device under test, a role most commonly found in automated test equipment (ATE) and validation platforms. Within that hierarchy, the component family progresses from discrete drivers and comparators to integrated pin-electronics channels and, ultimately, complete ATE pin-card assemblies. Components in this class typically combine a high-speed driver, a comparator window, and active loads in a single channel. Because the retrieved verified web data for the UM9921 does not include published key parameters such as supply voltage, output current, package type, or operating temperature range, this page deliberately marks those values as data-pending rather than estimating them. This ensures that every number presented can be traced to a real source - in this case the Octopart index entry and the Arrow Electronics product page, both of which list the UM9921 under Microchip Technology. Typical use contexts for Microchip PIN-category parts include test and measurement systems, engineering validation fixtures, and production test equipment where per-pin drive and compare functions are required. The UM9921 should be selected only after confirming pinout, package, and electrical ratings from the manufacturer datasheet. Design consideration: before substituting or second-sourcing this part, verify pin-to-pin compatibility and package identity against the original, since cross-brand equivalents for specialized PIN-category components are rarely drop-in replaceable. This page synthesizes distributor listings, availability signals, and honest data-gap markers not found on aggregator sites, providing an accurate starting point for sourcing and qualification.
UPD72874GC-YEB-A - IEEE 1394a OHCI 1.1 PHY-Link Host Controller | Renesas
The Renesas UPD72874GC-YEB-A is a single-chip IEEE 1394a OHCI 1.1 compliant PHY-Link host controller integrating three 1394 ports (one cable port and two additional ports), the PHY analog front end, the link layer, and the OHCI host interface. According to the manufacturer datasheet, the device operates up to 400 Mbps (S400) and is housed in a plastic QFP package. It was originally developed by NEC Electronics and is now produced under the Renesas brand following the 2010 merger. An OHCI (Open Host Controller Interface) PHY-Link controller is a type of bridge IC that connects a host CPU (typically via PCI) to an IEEE 1394 (FireWire) serial bus. The PHY (Physical Layer) handles bus arbitration, signal encoding/decoding, and cable presence detection, while the Link Layer implements the transaction and DMA engines defined by the OHCI specification. By collapsing these two layers into one LSI, the part reduces board area, BOM cost, and design complexity relative to two-chip solutions. Key features include compliance with IEEE Std 1394a-2000 and the 1394 OHCI Specification 1.1, support for 100/200/400 Mbps transfer rates, bus-powered capability, integrated 1.5 kV cable-port ESD protection (typical for the family), 3.3 V core supply with 5 V tolerant I/O, and a power-management state machine for suspended and standby modes. The host bus interface conforms to PCI 2.1 with a 32-bit data path at up to 33 MHz. The device implements a deeply pipelined DMA engine with physical DMA, asynchronous transmit, asynchronous receive, isochronous transmit, isochronous receive, and self-ID receive DMA contexts. Internal PHY/link arbitration logic handles bus reset propagation, parent/child port selection, gap-count optimization, and cycle-master arbitration so that the host CPU only sees OHCI-compliant descriptors and interrupt events. Typical applications include desktop and notebook PC FireWire host add-in cards (PCI / mini-PCI), DV camcorder connection docks, external RAID and multi-disk enclosures, industrial machine-vision frame grabbers, and legacy PC-based audio interfaces for IEEE 1394 audio devices. Designers chose this part when they needed a single chip that already passed 1394a compliance testing rather than qualifying PHY and Link separately. When laying out the board, keep the 1394 cable-port differential traces (TPB/TPA pairs) matched to 110 ohm differential impedance and isolated from switching nodes. Decouple each VCC pin with a 0.1 uF ceramic cap placed within 3 mm of the lead, and provide a ferrite bead on the cable bus power rail to limit injected noise.
USB2512B-I/M2 - 2-Port USB 2.0 Hi-Speed Hub Controller | Microchip
The Microchip USB2512B-I/M2 is a 2-port USB 2.0 Hi-Speed hub controller housed in a 36-pin SQFN (6x6 mm) package, designed for consumer, mobile, and embedded applications where low power and small footprint are critical. It operates across a 3.0 V to 3.6 V supply range, supports USB 2.0 Hi-Speed (480 Mbps), Full-Speed (12 Mbps), and Low-Speed (1.5 Mbps) downstream signaling, and integrates Microchip's MultiTRAK™ (multi-transaction translator) technology with one transaction translator per downstream port for parallel traffic handling. A USB hub controller is a USB class-compliant device that expands one upstream USB port into multiple downstream ports while managing power negotiation, bus enumeration, and split-transaction routing. The hub sits in the broader USB controller hierarchy (USB 2.0 interface IC → USB hub → USB compound device) and is the standard building block for adding USB Type-A downstream ports to laptops, docking stations, monitors, automotive head units, and embedded SBCs. Key features include integrated upstream and downstream termination resistors (saving external component count), configurable port-mapping via pin strap or SMBus, per-port power-switch control with over-current sensing, and individual port ganging. The device supports battery-charging detection (BC 1.2) on downstream ports when paired with an external charger emulator, and offers an optional JTAG boundary-scan interface for board-level test. MultiTRAK™ technology dedicates a transaction translator to each downstream port, allowing concurrent traffic on ports operating at different speeds (e.g., a Full-Speed keyboard plus a Hi-Speed storage drive). Compared to single-TT hubs that serialize all downstream transactions, this dramatically improves throughput in mixed-speed, detachable-device scenarios typical of consumer and embedded designs. Typical applications include laptop docking stations, USB Type-A expansion on monitors and TVs, automotive infotainment rear-seat charging hubs, industrial panel PCs, and consumer electronics such as set-top boxes and printers requiring USB port expansion. The 36-SQFN 6x6 mm footprint also enables compact mobile and IoT designs. When designing with this part, ensure the upstream port's VBUS detection is routed correctly and that downstream over-current sensing resistors match the chosen power switch FETs. The /PRTPWR and /OCS pins require careful PCB layout to avoid false-trip events during hot-plug events. This page synthesizes current distributor pricing, drop-in same-family alternatives (USB2512B-AEZG, USB2512BT-I/M2), and practical design notes not duplicated in the manufacturer datasheet.
USB2512BI-AEZG - 2-Port USB 2.0 Hi-Speed Hub Controller | Microchip
The Microchip Technology USB2512BI-AEZG is a 2-port USB 2.0 high-speed, low-power hub controller IC housed in a 36-pin QFN (6x6 mm) package. The device operates from a single 3.3 V supply and supports Low-Speed, Full-Speed, and Hi-Speed USB upstream and downstream traffic through a 2-port downstream configuration. It targets embedded USB port expansion for consumer, mobile, and industrial products. A USB hub controller is an interface IC that manages multiple downstream USB device connections from a single upstream USB host port, handling transaction translation, power management, and protocol negotiation across USB 1.1 (Low/Full Speed) and USB 2.0 (Hi-Speed) links. The USB2512BI-AEZG belongs to the USB 2.0 hub controller family within the broader interface IC category, sitting between the physical USB connectors and the system processor. Key features include Microchip's MultiTRAK™ high-performance transaction translator, per-port battery-charging support, an I²C/SMBus management interface for configuration, and integrated upstream-port power detection. The industrial temperature grade (-40°C to +85°C) plus 3.3 V single-supply operation simplifies power-tree design versus discrete hub implementations. The 36-pin QFN-EP package with exposed thermal pad offers good thermal dissipation for bus-powered and self-powered applications. Internally, the device uses a USB 2.0 UTMI/UTMI+ compatible PHY, an embedded hub repeater, and dedicated transaction translators per downstream port. MultiTRAK™ allows concurrent traffic on multiple downstream ports at mixed speeds, eliminating the throughput loss common to single-TT architectures. An external 24 MHz crystal provides the reference clock, and an optional EEPROM or SMBus master configures VID/PID and string descriptors. Typical applications include docking stations, monitors with built-in USB ports, laptop port replicators, embedded industrial PCs, automotive infotainment head units, and any consumer device that must expand a single USB host port into multiple ports while preserving Hi-Speed (480 Mbps) throughput. When designing with this IC, place the 24 MHz crystal within 5 mm of the XI/XO pins, route the USB DP/DM differential pairs as 90 Ω impedance matched traces, and connect the exposed pad to a continuous ground plane to meet USB-IF compliance and EMI targets. This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
USB2513B-AEZC-TR - 3-Port USB 2.0 Hi-Speed Hub Controller | Microchip
The Microchip USB2513B-AEZC-TR is a 3-port USB 2.0 Hi-Speed hub controller IC in a 36-pin QFN (6x6 mm) package with exposed pad, engineered for embedded USB port expansion in cost- and power-sensitive designs. It integrates a Hi-Speed upstream port and three downstream ports, supports USB 2.0 Link Power Management, and operates from a single 3.3 V supply. MultiTRAK technology delivers one transaction translator per downstream port, improving throughput in mixed-speed environments versus single-TT hubs. A USB hub controller is a USB Interface IC that aggregates one upstream USB connection into multiple downstream ports, allowing many devices to share a single host root port. Within the broader taxonomy, a USB hub belongs to USB Interface ICs, which sit under Interface ICs and ultimately under Integrated Circuits. The USB2513B-AEZC-TR implements the hub repeater and transaction-translator functions defined by the USB 2.0 specification, while adding vendor-specific features such as per-port battery-charging detection and configurable port mapping. This makes it the lowest-level "smart" intermediary between a USB host and peripherals. Key features include a 36-pin QFN-EP package with low thermal resistance, an SMBus/I2C management interface for configuration and GPIO control, integrated upstream and downstream termination resistors, and per-port enable and over-current sense inputs. The device supports self- and bus-powered operation, individual port switching, and optional FlexConnect technology for role reversal between upstream and downstream ports. Technically, the USB2513B uses MultiTRAK, which assigns a dedicated transaction translator to each downstream port. This avoids the head-of-line blocking seen in single-TT hubs when a full-speed device is connected alongside Hi-Speed traffic, sustaining throughput on all three ports simultaneously. Internal charge-pump regulation supplies the high-side drive for the downstream D+/D- lines without external 5 V short-circuit protection FETs when paired correctly. Typical applications include USB port expansion in set-top boxes, docking stations, automotive head units, monitors with USB hubs, and industrial HMI panels. Designers select this part when three downstream ports, low standby current, and a small QFN footprint are simultaneously required. When designing with this hub, the exposed pad must be soldered to a continuous ground plane for thermal dissipation and signal return. Place the 3.3 V decoupling capacitors within 2 mm of the respective supply pins and observe the 90-ohm differential impedance requirement for USB DP/DM traces. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not found in the manufacturer datasheet alone, helping procurement and embedded design teams shorten the bill-of-material selection cycle.
USB2514B-AEZC - 4-Port USB 2.0 Hi-Speed Hub Controller | Microchip
The Microchip Technology USB2514B-AEZC is a 4-port USB 2.0 Hi-Speed hub controller housed in a 36-pin QFN (6x6 mm) package with exposed pad. It operates from a 3.0V to 3.6V single supply, supports Low/Full/Hi-Speed USB signaling (480 Mbps), and integrates Microchip's MultiTRAK™ technology for industry-leading throughput in mixed-speed USB environments. The device provides four downstream ports with per-port battery-charging detection and is well suited for consumer, mobile, and embedded computing platforms. What is a USB hub controller? A USB hub controller is an interface IC that expands a single upstream USB port into multiple downstream ports, handling the USB protocol, transaction translation, and port power management. It belongs to the broader family of interface ICs (USB controllers → interface ICs → digital ICs → semiconductors) and sits between the host controller and end devices, isolating traffic per port and enumerating attached peripherals. Key features include USB 2.0 Hi-Speed compliance, integrated 1.5 kΩ upstream pull-up, automatic Hi-Speed termination, port-status indicators, ganged or individual port power switching, and optional battery charging support on downstream VBUS. The internal architecture pairs a serial interface engine (SIE), hub repeater, and transaction translator, allowing full- and low-speed devices to operate behind a Hi-Speed hub without throughput penalty. The USB2514B-AEZC also exposes I2C/SMBus configuration, GPIO for LED indicators, and PRTPWR power-control outputs per port. Its compact 36-QFN footprint and low standby current make it a common choice for space-constrained designs such as docking stations, monitors, automotive head units, and embedded motherboards. Typical applications include USB port expansion on docking stations, automotive infotainment hubs, monitors with built-in USB, all-in-one PCs, set-top boxes, and embedded industrial PCs. The 4-port density matches the most common desktop-peripheral expansion scenarios without external port-multiplier silicon. When designing with this part, observe the datasheet's recommended decoupling (1 µF + 0.1 µF near VBAT and VDD33) and provide a stable 3.3V rail. The exposed thermal pad must be soldered to a grounded copper pour to meet the QFN-36 thermal performance spec. PRTPWR drive strength is limited; pair with an external power switch (such as Microchip's MIC2026) for VBUS control. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
USB2660I-JZX-03 - USB 2.0 Hub & Multi-Format Flash Controller | Microchip
The Microchip Technology USB2660I-JZX-03 is a USB 2.0 Hi-Speed hub controller combined with a multi-format flash media reader/writer and dual Secure Digital (SD) interfaces, integrated in a single chip. Per the Microchip USB2660/USB2660i datasheet (DS00001931B), this combo device delivers up to 480 Mbps Hi-Speed USB performance, two downstream USB 2.0 ports, and multi-format flash card support including SD, MMC, Memory Stick, and xD-Picture Card. The device is housed in a 64-pin QFN (JZX) 9x9 mm package with exposed thermal pad, designed for surface mount desktop and notebook PC applications. The industrial temperature grade (-40C to +85C) makes the USB2660I variant suitable for non-consumer embedded use cases where the commercial-grade USB2660 is insufficient. A USB 2.0 Hi-Speed hub controller is a category of USB peripheral that aggregates multiple downstream ports and card-reader functions behind a single upstream port, while a flash media controller is a class of storage interface IC that bridges a host processor to removable flash memory cards using standardized protocols such as SD, MMC, and MSPro. The USB2660I sits at the intersection of these two product types, forming part of the broader USB interface IC hierarchy: USB peripheral controller -> USB hub controller -> combo hub + media reader -> Microchip USB264x/2660 family. This combination reduces PCB area, BOM count, and design complexity for system integrators that would otherwise need a separate hub chip and card-reader chip. Key features of the USB2660I-JZX-03 include 2 downstream USB 2.0 Hi-Speed ports, an internal transaction translator for mixed-speed USB environments, multi-format flash card support with dual SD interfaces, integrated card power FETs, on-board 24 MHz crystal driver, and USB-IF certified hub silicon. The chip is USB 2.0 compliant and supports Suspend and low-power modes per the USB specification. Programmable through an external I2C EEPROM, the device enables custom vendor/product IDs, string descriptors, and manufacturer-specific behavior. Internally the USB2660I uses Microchip's proven UTMI+ compliant physical layer and a hardened Hi-Speed USB 2.0 hub topology that delivers industry-leading data throughput in mixed-speed environments where some downstream devices run at Full-Speed (12 Mbps) and others at Hi-Speed (480 Mbps). The integrated media controller supports USB Mass Storage class and SDIO bridging, enabling SDIO peripherals to enumerate over USB with custom firmware. Typical applications include desktop and notebook PCs, multi-function printers with card reader slots, docking stations, set-top boxes, and industrial panel PCs that expose SD card slots and multiple USB ports to end users. Designers use the USB2660I-JZX-03 to consolidate USB expansion and media reading onto a single 9x9 mm QFN. When designing with the USB2660I-JZX-03, allocate at least four PCB layers for clean USB signal routing, route the differential DP/DM pair as a 90-ohm impedance-matched pair, and provide a local 0.1 uF decoupling cap adjacent to every power pin. The exposed thermal pad must be soldered to a contiguous ground pour to meet USB-IF Hub Certification thermal-rise limits.
USB3320C-EZK - Hi-Speed USB 2.0 ULPI Transceiver | Microchip
The Microchip USB3320C-EZK is a highly integrated full-featured Hi-Speed USB 2.0 transceiver built on the proven ULPI (UTMI+ Low Pin Interface) standard, housed in a 32-pin QFN (5x5 mm) package. It supports 480 Mbps High-Speed and 12 Mbps Full-Speed USB signaling, operates from a single 3.3 V supply with on-chip 1.8 V LDO regulator, and provides up to +30 V VBUS ESD protection on the USB connector side. A USB 2.0 transceiver (also called a PHY) is the physical-layer analog block that sits between a digital SoC's ULPI/UTMI link and the differential DP/DM lines of a USB connector. It handles HS chirp, packet detection, serializer/deserializer, and clock recovery, while leaving link-layer protocol to the host controller. Within the system hierarchy, the USB3320C-EZK is a peripheral controller companion IC: SoC (application processor) -> ULPI link -> USB3320 PHY -> DP/DM -> USB connector. This split architecture lets designers pair an inexpensive PHY with any SoC that exposes ULPI pins (NXP i.MX, ST STM32, Xilinx Zynq, TI Sitara). Key electrical characteristics include 480 Mbps Hi-Speed data rate, internal 1.8 V regulator eliminating external LDO, integrated 45 ohm HS termination resistors (no external Rs needed), 8-bit single-data-rate ULPI interface with 60 MHz reference clock, and integrated USB charger-detection hardware. The device is USB 2.0 specification compliant, USB Battery Charging v1.2 capable, and OTG-ready via the ID pin. The architecture uses a 60 MHz reference clock input (REFCLK) generated by the SoC, an internal PLL multiplies to 480 MHz for HS operations. A digital state machine handles UTMI/ULPI command interpretation, while the analog block performs line termination, current-mode driver bias, and disconnect detection. The chip supports both host and peripheral roles. Typical applications include USB 2.0 device/host ports on single-board computers, OTG ports on industrial tablets, automotive infotainment USB interfaces, medical device USB ports, and 5G/LTE modem modules with USB 2.0 diagnostic channels. Designers favor the USB3320C-EZK over UTMI-only PHYs because ULPI slashes pin count to 12 versus UTMI's 30+. When designing with this device, maintain 90-ohm differential impedance on DP/DM traces to the connector, place decoupling capacitors on VDD33/VDD18/VBAT as close as possible to the IC, and ensure the REFCLK signal has less than 50 ps jitter to pass USB compliance. Do not omit the ID pin pull-up for OTG or charger-detection operation.