TXB0104-Q1 - 4-Bit Auto-Direction Level Translator | TI
N.º da peça: TXB0104-Q1 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $0.72 | $0,72 |
| 10 | $0.62 | $6,20 |
| 100 | $0.48 | $48,00 |
| 500 | $0.39 | $195,00 |
| 1.000 | $0.31 | $310,00 |
TXB0104-Q1 Visão geral
A voltage-level translator is a logic-family device that allows integrated circuits operating at different supply voltages on the same PCB to exchange digital signals safely. Within the power-and-signal-management hierarchy, it sits alongside buffers and bus switches as a fundamental interface IC, preventing overvoltage damage and ensuring valid logic thresholds between low-voltage MCUs, FPGAs, and 5 V peripherals.
Key features include auto-direction sensing, which eliminates the DIR control pins required by '245-style translators, a data rate of up to 100 Mbps, and VCC isolation: when either supply is at GND, all I/O enters Hi-Z. The AEC-Q100-qualified TXB0104-Q1 also carries +/-15 kV HBM ESD protection, exceeding the standard JESD ratings cited in the TI datasheet family.
Architecturally, the TXB0104 uses a self-directed, edge-rate-driven one-shot scheme that detects the direction of each transition and briefly strengthens the opposite driver, allowing it to drive 4 channels in either direction without software intervention. The OE pin three-states all outputs for power sequencing and bus isolation.
Typical applications include SPI and UART level conversion between 3.3 V MCUs and 5 V peripherals, GPIO expansion in automotive body and infotainment modules, and mixed-voltage FPGA I/O. Note that the push-pull architecture is not recommended for open-drain buses such as I2C or 1-Wire; use the TXS0104E-Q1 for those.
Design consideration: keep unloaded outputs low-impedance driven or grounded, since the auto-direction circuitry can oscillate on lightly loaded or capacitively large nets; series resistors above 25 k-ohm are not supported.
This page adds value beyond the TI datasheet by synthesizing distributor availability, drop-in alternatives (NXP NTS0304E, ADI ADG3304), and practical design notes for automotive level-shifter selection.
Alternativas drop-in para TXB0104-Q1 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com TXB0104-Q1 (mesmo formato e footprint) — diferindo em Automotive Qualification, Data Rate, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
TXB0104PWR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
TXS0104EPWR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TXU0104PWR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
NTS0304EPWJ
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ADG3304BRUZ
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TXB0104QRUTRQ1
✅ Drop-In✓ Em estoque
$0.55 / unidade
Ver ficha técnica →TXB0104-Q1 Especificações
| Product Type | 4-bit bidirectional voltage-level translator |
| Canais | 4 |
| VCCA Supply Range | 1.2 V to 3.6 V |
| VCCB Supply Range | 1.65 V to 5.5 V |
| Taxa de dados | 100 Mbps |
| Direction Control | Automatic direction sensing |
| ESD Protection (HBM) | +/-15 kV |
| Tipo de saída | Push-pull, 3-state (OE controlled) |
| VCC Isolation | Yes - Hi-Z when either VCC is at GND |
| Automotive Qualification | AEC-Q100 |
| Encapsulamento | TSSOP-14 (PW) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +125C |
| Logic Family | TXB (auto-direction translating transceiver) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do TXB0104-Q1 tssop-14 (pw)
Configuração de pinos para TXB0104-Q1 (pacote tssop-14 (pw)). A numeração dos pinos, funções e diagramas de conexão estão definidos no datasheet do fabricante. Consulte-o para o footprint exato e diretrizes de soldagem.
Nenhum dado detalhado de pinagem disponível para TXB0104-Q1.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
TXB0104-Q1 é adequado para 6 aplicaçãos: Automotive Body Control Modules, SPI and UART Level Translation, Mixed-Voltage FPGA I/O Expansion, Industrial Sensor Interface, Portable and Consumer Mixed-Rail Designs, Infotainment and Display Interfaces.
Automotive Body Control Modules
The TXB0104-Q1 is AEC-Q100 qualified, making it suitable for level translation between a 3.3 V microcontroller and 5 V automotive peripheral sensors or actuators inside body control modules, gateways, and lighting controllers. Its +/-15 kV ESD rating withstands harsh 12 V-vehicle assembly and in-service environments, while VCC isolation (Hi-Z when either rail is grounded) protects the logic during cold-crank and load-dump power sequencing events. Placed on the MCU GPIO bank with OE tied to the 3.3 V rail through an RC delay, all four channels safely bridge 1.8-3.3 V processor I/O to legacy 5 V modules. The auto-direction feature removes firmware burden - no direction pins need servicing inside interrupt routines. Keep translations below 100 Mbps and avoid open-drain buses, using TXS0104E-Q1 for those nets.
Recomendado
SPI and UART Level Translation
SPI (up to ~50 MHz clock) and UART signaling are push-pull, exactly matching the TXB0104-Q1's auto-direction push-pull architecture. Connecting a 1.8 V or 3.3 V MCU to a 5 V SD card, flash memory, or GPS module requires only the translator between rails: SCLK, MOSI, and CS flow MCU-to-peripheral while MISO flows back, and the one-shot direction sensing handles per-edge direction changes on the shared net without software overhead. The 100 Mbps rating provides generous timing margin over standard SPI clock rates. Place the device close to the load with 100 nF decoupling on both VCCA and VCCB. Do not add series resistors above 25 k-ohm on SPI lines - they weaken the edge-rate detection and cause signal integrity failures.
Recomendado
Mixed-Voltage FPGA I/O Expansion
FPGA banks such as those on Xilinx 7-series devices often run banks at 1.8 V while board-level peripherals, LEDs, and legacy buses expect 3.3 V or 5 V. The TXB0104-Q1 bridges these domains on general-purpose push-pull nets: VCCA tracks the 1.8 V bank rail, VCCB tracks the 3.3 V or 5 V system rail, and the OE pin, driven by FPGA power-good, guarantees Hi-Z during configuration to prevent bus contention with other reset-of-fab drivers. Its 100 Mbps capability supports medium-speed parallel buses and status signaling beyond what resistor-divider solutions allow. For heavily loaded nets, verify that trace capacitance stays below the one-shot re-trigger threshold; short point-to-point routes on the same PCB are the intended topology.
Recomendado
Industrial Sensor Interface
Industrial controllers frequently mix a modern 3.3 V MCU with 5 V-dominant sensors, encoders, and legacy PLC-side signaling. The TXB0104-Q1's 1.2-3.6 V VCCA and 1.65-5.5 V VCCB ranges cover this exact combination, and its -40C to +125C operating envelope suits cabinet and machine-mounted electronics. Because each channel auto-senses direction, bidirectional lines such as ready/acknowledge handshakes work without host intervention. The +/-15 kV ESD capability provides extra margin near connector-entry points, though TVS diodes remain best practice on field-wired nets. Note that the push-pull architecture suits TTL/CMOS push-pull sensor outputs only; for open-collector NPN sensor outputs, add an external pull-up stage or select the TXS0104E-Q1 instead.
Recomendado
Portable and Consumer Mixed-Rail Designs
Battery-powered consumer products commonly combine a 1.8 V application processor with 3.3 V memory cards, 2.5 V RF modules, and 5 V USB-attached accessories. The TXB0104-Q1's wide 1.2 V VCCA support allows translation from the lowest processor banks, while VCC isolation prevents back-powering when the 5 V accessory rail is absent - all I/O go Hi-Z, protecting both sides. Although the standard TXB0104 may suffice for non-automotive builds, using the Q1 version adds thermal and ESD margin at near-identical cost. Keep VCCA decoupled with 100 nF close to the pin, sequence OE after both rails are stable, and route the four channels as short matched pairs when carrying clocked data above 50 Mbps.
Recomendado
Infotainment and Display Interfaces
Automotive infotainment head units bridge 1.8 V/3.3 V SoC graphics and control banks to 5 V backlight controllers, touch-controller interrupts, and legacy display enable lines. The TXB0104-Q1 translates four such control/status channels with auto-direction, eliminating direction-control firmware in display bring-up code. Its AEC-Q100 grade and -40C to +125C range meet cabin environment requirements, and the +/-15 kV ESD rating adds robustness at the display FPC connector where assembly handling stress is highest. Use OE under SoC power-good control so the translator stays Hi-Z through infotainment power sequencing and standby transitions. For high-speed LVDS or SerDes video itself, dedicated serializers are required - the TXB0104-Q1 serves the low-speed control plane only.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para TXB0104-Q1 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | TXB0104PWR | TXS0104EPWR | NTS0304EPWJ | ADG3304BRUZ | TXB0104QRUTRQ1 |
|---|---|---|---|---|---|---|
| Package | TSSOP-14 (PW) | TSSOP-14 (PW) - same | TSSOP-14 (PW) - same | TSSOP-14 (PW) - same | TSSOP-14 (RU-14) - same footprint | UQFN-12 (RU) - different |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | NXP Semiconductors | Analog Devices | Texas Instruments |
| Direction Control | Auto-direction sensing | Auto-direction sensing | Auto-direction sensing | Auto-direction (per NXP community) | Auto-direction | Auto-direction sensing |
Principais diferenciais
- Auto-direction sensing with no DIR pins (vs TXU0104PWR)
- AEC-Q100 automotive qualification at TSSOP-14 cost point (vs TXB0104PWR)
- True push-pull 100 Mbps drive (vs ADG3304BRUZ)
Notas de projeto
Never use the TXB0104-Q1 on I2C, 1-Wire, MDIO, or any open-drain bus. Its push-pull auto-direction architecture actively drives both rails, fighting external pull-ups and corrupting wired-OR data - this exact failure is documented in TI E2E thread 1577689 where a 1-Wire DQ design failed. Select the TXS0104E-Q1 (same TSSOP-14 footprint) for open-drain protocols. Also avoid series resistors above approximately 25 k-ohm in series with any data line: the one-shot direction-detection relies on edge rates that high resistance destroys.
Place 100 nF ceramic decoupling capacitors within 2 mm of both VCCA and VCCB pins, each with a low-inductance via to ground. Route the four translated channels as short, direct point-to-point nets below 50 mm; long or capacitively heavy traces (multi-drop stubs, cable harnesses) can exceed the one-shot drive capability and cause ringing or re-trigger oscillation. Tie the OE pin to VCCA through an RC (e.g., 10 k-ohm plus 100 nF) so outputs stay Hi-Z until both rails are stable, preventing bus contention during power sequencing.
The TXB0104-Q1 drives push-pull nets to 100 Mbps, but leave unused channels driven low from the source side or tied to ground on one port - floating auto-direction inputs can self-oscillate. For clocked buses (SPI above 50 MHz), verify setup/hold at the receiver since the translator adds propagation delay on every edge; consult the manufacturer datasheet timing tables for your exact VCCA/VCCB combination. For mixed push-pull and open-drain systems, dedicate TXB channels to push-pull and reserve a TXS0104E-Q1 for the open-drain nets rather than compromising on one part.
Informações de conformidade
AEC-Q100 qualified per TI product page (automotive 4-bit translator). RoHS/lead-free per standard TI logic-family compliance; REACH and halogen-free status not stated in provided data.
