P1010NXE5KHB
P1010NXE5KHB - QorIQ P1010 1GHz Power Arch SoC | NXP
The NXP P1010NXE5KHB is a QorIQ P1010 communications processor based on the 32-bit Power Architecture e500v2, operating at up to 1000 MHz core frequency in a 425-pin TEPBGA-1 (19x19 mm) package. It integrates a single e500v2 core, 32 KB I-cache and 32 KB D-cache, SEC crypto engine, DDR3 memory controller, USB 2.0, SATA, two Gigabit Ethernet controllers, three PCI Express controllers, SD/MMC, SPI, I2C, UART and GPIO into a single SoC. Manufactured on 45 nm low-power CMOS, the typical power dissipation is as low as 1.1 W, making it suitable for thermally constrained fan-less designs.
The P1010 belongs to the QorIQ P1 family of communications processors, which occupies the value-performance tier of NXP's embedded networking SoC portfolio. Within the broader taxonomy it sits below the P2/P4 multi-core layers and above the PowerQUICC predecessors, combining application processing, packet processing and crypto acceleration for cost-sensitive networking endpoints. The e500v2 core delivers Power Architecture book-E compatibility, vector/SPE units, and double-precision FPU in hardware, enabling both control-plane and signal-processing workloads.
Key features include hardware-accelerated SEC 4.x for IPsec, SSL/TLS and bulk data encryption, integrated 64-bit DDR3L controller with ECC support, two 10/100/1000 RGMII Gigabit Ethernet MACs with jumbo frame and 1588 timestamping, three PCI Express Gen 2.0 controllers (x1/x2/x4), two SATA 2.0 (3 Gbps) ports, USB 2.0 host + PHY, SD/MMC 3.0, four I2C, two SPI, two UART and 32 GPIO. The integrated SEC engine supports DES, 3DES, AES, ARC4, SHA-1/2, MD-5, RSA, ECC and Kasumi, offloading crypto from the CPU.
Typical applications include industrial routers and gateways, IP cameras, network attached storage (NAS), industrial robotics, factory automation controllers, point-of-sale terminals and digital signage. The wide peripheral mix and integrated SEC make it especially attractive for secure networked endpoints where a host CPU plus external crypto is undesirable. Industrial temperature grade -40C to +105C supports deployment in outdoor enclosures and harsh industrial environments.
When designing with this device, allocate at least four PCB layers for the 19x19 mm BGA fan-out and follow NXP's AN4130 layout guidelines for DDR3L trace matching and SerDes reference clock routing. Boot configuration strapping is read from reset and serial flash, so choose between SPI NOR, I2C EEPROM and SD/MMC boot sources early in the schematic phase.
This page synthesizes NXP official datasheet values, current distributor stock and pricing as of 2026-10-17, and a curated set of drop-in package alternatives not consolidated on a single distributor page, providing practical engineering context the datasheet alone does not.
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