P1011NSE2FFB - QorIQ P1 800MHz e500v2 SoC, 1-Core | NXP
N.º da peça: P1011NSE2FFB ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72.1 | $721,00 |
| 100 | $64.85 | $6.485,00 |
| 500 | $58.2 | $29.100,00 |
| 1.000 | $52.75 | $52.750,00 |
P1011NSE2FFB Visão geral
A QorIQ communications processor is a system-on-chip (SoC) that combines one or more Power Architecture CPU cores with networking peripherals, security accelerators, and high-speed I/O. It sits in the SoC taxonomy below general-purpose microprocessors and above bare MPU cores, targeting networking, telecom, aerospace/defense, and industrial applications where deterministic performance and integrated connectivity outweigh raw CPU throughput.
Key features of the P1011NSE2FFB include 32 KB L1 instruction and data caches per core, a 256 KB L2 cache with ECC, a 32-bit DDR2/DDR3 memory controller with ECC supporting up to 800 MT/s data rate, three enhanced 10/100/1000 Mbps Ethernet MACs with QoS and parse/classification, two PCIe Gen 1 controllers (x4/x2 or x4+x1), a USB 2.0 high-speed controller with ULPI interface, four TDM/HDLC channels, a SEC 2.0 crypto engine, and a 32-bit local bus. Operating temperature range spans 0°C to 125°C for industrial and rugged networking use.
The P1011 uses the e500v2 core derived from the Power Architecture embedded specification, featuring dual-issue superscalar execution, hardware MMU, and a Book-E compliant programming model. The 45 nm fabrication process enables the 800 MHz core frequency within a 689-ball BGA at typical power dissipation of approximately 6-9 W, depending on workload and peripheral activation.
Typical applications include branch-office routers, wireless LAN access points, industrial control gateways, smart-grid concentrators, secure VPN appliances, and aerospace/defense embedded networking. The integrated SEC engine suits IPsec/SSL offload, while the three GbE ports and TDM interfaces support legacy telecom interworking.
Designers should plan for a multi-layer PCB with continuous power planes, careful BGA fanout, and DDR3 termination. The device requires firmware boot from NOR/NAND/SPI and a validated DDR3 timing configuration in the RCW (Reset Configuration Word). Given the 689-ball BGA, professional PCB assembly and X-ray inspection are mandatory.
This page consolidates distributor pricing, NXP family drop-in alternatives, and design notes not present in the manufacturer datasheet.
Alternativas drop-in para P1011NSE2FFB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com P1011NSE2FFB (mesmo formato e footprint) — diferindo em Memory Controller, Operating Temperature, Security Engine, USB, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
P1011NXE2FFB
✅ Drop-In✓ Em estoque
$88 / unidade
Ver ficha técnica →P1021NXE2FFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1020NSE2FFB
✅ Drop-In✓ Em estoque
$39.95 / unidade
Ver ficha técnica →P2020NSE2FFB
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
P1010NSE2FFB
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
P1011NSE2FFB Classificações máximas e características elétricas
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 1 |
| Core Frequency (Max) | 800 MHz |
| Bit Width | 32-bit |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| L2 Cache | 256 KB with ECC |
| Process Technology | 45 nm |
| Encapsulamento | 689-TEPBGA II (31x31 mm) |
| Ethernet MACs | 3 × 10/100/1000 Mbps |
| Memory Controller | DDR2/DDR3 with ECC, up to 800 MT/s |
| PCIe Controllers | 2 × PCIe Gen 1 (x4/x2 or x4+x1) |
| USB | USB 2.0 High-Speed with ULPI |
| TDM/HDLC Channels | 4 |
| Security Engine | SEC 2.0 (crypto accelerator) |
| Local Bus | 32-bit |
| Temperatura de operação | 0°C to +125°C |
| Status RoHS | RoHS Compliant (Lead Free) |
| Nível MSL | 3 |
Guia de Configuração de Pinos do P1011NSE2FFB 689-tepbga ii (31x31 mm)
Configuração de pinos para P1011NSE2FFB (pacote 689-tepbga ii (31x31 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para P1011NSE2FFB.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
P1011NSE2FFB é adequado para 6 aplicaçãos: Branch-Office Routers, Industrial Control Gateways, Wireless LAN Access Points, Smart-Grid Concentrators, Secure VPN Appliances, Aerospace/Defense Embedded Networking.
Branch-Office Routers
The P1011NSE2FFB's three Gigabit Ethernet MACs and SEC 2.0 crypto engine make it ideal for branch-office routers needing IPsec/SSL termination at line rate. With an 800 MHz e500v2 core and 256 KB L2 cache with ECC, the device can sustain multi-hundred-Mbps encrypted throughput while running routing daemons. Designers place the SoC on a multi-layer PCB with the DDR3 controller driving 1-2 GB of ECC memory for routing tables and connection state. Compared to a discrete MPU plus external crypto chip, the integrated SEC engine eliminates a chip and reduces BOM cost by approximately $8-12 per unit.
Recomendado
Industrial Control Gateways
Industrial gateways benefit from the P1011NSE2FFB's 0°C to 125°C operating range, three Ethernet MACs for protocol bridging (EtherCAT/Profinet/Ethernet/IP), and four TDM/HDLC channels for legacy serial interworking. The 689-TEPBGA II package supports rugged PCB designs with conformal coating, and the SEC 2.0 engine secures OPC-UA or MQTT traffic to SCADA systems. Designers typically pair the SoC with industrial PHY transceivers, isolated RS-485 transceivers, and a Linux BSP with PREEMPT-RT patches for deterministic control loop response under 100 µs.
Recomendado
Wireless LAN Access Points
The P1011NSE2FFB's two PCIe Gen 1 controllers support dual-radio Wi-Fi 5/6 module configurations, while the USB 2.0 with ULPI enables Bluetooth coexistence and 802.15.4 IoT radio aggregation. The 800 MHz core handles 802.11ax MU-MIMO scheduling and WPA3-Enterprise authentication without offloading to external accelerators. The 32-bit DDR3 with ECC keeps key rotation tables and EAP session state protected against bit-flips. A typical design pairs the SoC with two Qualcomm Atheros QCA9880/QCA6390 modules over PCIe x1 lanes and uses the third GbE as the upstream trunk.
Recomendado
Smart-Grid Concentrators
Smart-grid concentrators aggregate data from hundreds of smart meters via PLC, RF mesh, or cellular backhaul, and the P1011NSE2FFB's 800 MHz e500v2 core with hardware encryption is well-matched to DLMS/COSEM and IEC 61850 workloads. The three GbE MACs serve HAN/LAN/WAN port separation, while the SEC engine handles TLS 1.2 handshakes at metering update rates. The industrial temperature range and ECC memory meet IEC 61850-3 reliability requirements for substation-grade equipment. Designers use the TDM interface for legacy serial metering protocols and reserve PCIe for cellular modem uplink.
Recomendado
Secure VPN Appliances
The P1011NSE2FFB's SEC 2.0 hardware offloads IPsec/SSL bulk crypto, freeing the e500v2 core to handle policy enforcement, IKEv2 key exchange, and tunnel management for hundreds of concurrent VPNs. With three GbE MACs, the device supports dedicated WAN, LAN, and DMZ segments in a single-chip VPN concentrator design. The 32-bit DDR3 controller with ECC at 800 MT/s provides non-blocking memory bandwidth for large security association databases. Designers typically pair the SoC with a hardware RNG and tamper-detection circuitry to meet FIPS 140-2 Level 2 requirements for enterprise security appliances.
Recomendado
Aerospace/Defense Embedded Networking
Aerospace and defense embedded networking leverages the P1011NSE2FFB's 0°C to 125°C operating range, ECC-protected memory subsystem, and TDM/HDLC channels for MIL-STD-1553 or ARINC 429 interworking via external transceivers. The SEC 2.0 engine supports Type 1 HAIPE encryption with appropriate firmware, while the rugged 689-ball TEBGA II package survives shock and vibration per MIL-STD-810. Designers build the SoC into router/switch payloads for tactical communications, often paired with rad-tolerant SRAM and watchdog supervisors. The QorIQ ecosystem includes BSP support for VxWorks, INTEGRITY, and Green Hills INTEGRITY-178B safety-critical RTOSes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para P1011NSE2FFB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | P1011NXE2FFB | P1021NXE2FFB | P1020NSE2FFB | P2020NSE2FFB | P1010NSE2FFB |
|---|---|---|---|---|---|---|
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 |
| Number of Cores | 1 | 1 | 2 | 2 | 2 | 1 |
| Core Frequency (Max) | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 1200 MHz | 667 MHz |
| L2 Cache | 256 KB with ECC | 256 KB with ECC | 256 KB with ECC | 256 KB with ECC | 512 KB with ECC | 256 KB with ECC |
| Ethernet MACs | 3 × GbE | 3 × GbE | 3 × GbE | 3 × GbE | 3 × GbE + 1 × 10GbE (XAUI) | 3 × GbE |
| Operating Temperature | 0°C to +125°C | 0°C to +125°C | 0°C to +125°C | 0°C to +125°C | 0°C to +125°C | 0°C to +125°C |
| Lifecycle Status | EOL | EOL | EOL | EOL | NRND | EOL |
Principais diferenciais
- Single-core 800 MHz variant of the QorIQ P1 family in standard 689-ball TEBGA II (vs P1021NXE2FFB)
- Three Gigabit Ethernet MACs with integrated SEC 2.0 crypto offload (vs P2020NSE2FFB)
- DDR3 with ECC support at 800 MT/s (vs P1010NSE2FFB)
Notas de projeto
Estimated: The 689-ball TEBGA II at 1.0 mm pitch requires a minimum 6-layer PCB stack-up with microvia-in-pad or 0.2 mm laser-drilled stacked vias for inner-row ball access. Place 8+ ground balls adjacent to each high-speed signal group (DDR, PCIe, SGMII) for return-path integrity, and keep impedance-controlled traces to 50 Ω single-ended / 85 Ω differential per NXP's hardware design guide. X-ray inspection is mandatory after reflow.
The P1011NSE2FFB requires multiple voltage rails (core, DDR3 I/O, Ethernet I/O, PCIe I/O, USB PHY). Use a multi-phase buck regulator for the 1.0 V core rail rated for at least 8 A continuous, with output ripple below 30 mVpk-pk to avoid jitter on SGMII/PCIe SerDes. Place input bulk capacitance (22 µF X5R) within 25 mm of each BGA power ball cluster, and use 0.1 µF + 10 nF decoupling pairs on every quadrant of the device per NXP reference design.
Estimated: at 800 MHz with both GbE MACs and SEC engine active, the P1011NSE2FFB dissipates approximately 6-9 W, requiring the PCB thermal pad to be soldered to a continuous copper pour of at least 25x25 mm with thermal vias (0.3 mm pitch, filled). For sealed industrial enclosures with no airflow, consider a clip-on heatsink rated for 0.5 °C/W or less to maintain junction temperature below 110°C under worst-case workload.
Common pitfalls include: (1) mis-configuring the Reset Configuration Word (RCW) for DDR3 timing parameters, which causes boot failures - always validate against the QorIQ P1 Reference Manual rev 2.x; (2) omitting the 32.768 kHz system clock crystal on the RTC pins, which breaks power management; (3) failing to terminate the JTAG TDI/TMS signals per IEEE 1149.1, leading to boundary-scan failures; (4) leaving unused Ethernet MACs unconfigured at boot, which can prevent TDM/PCIe enumeration. Reference the NXP P1 BSP for the validated sequence.
Informações de conformidade
RoHS compliant and Lead Free per DigiKey listing. Not AEC-Q100 qualified (industrial, not automotive). For halogen-free status consult NXP directly.
