10AX090S3F45E2LG vs 10AX090R3F40E2LG Comparação
Comparação detalhada lado a lado de 10AX090S3F45E2LG por Intel e 10AX090R3F40E2LG por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | 10AX090S3F45E2LG | 10AX090R3F40E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $12.480,00 | $5.750,00 |
| Series | Arria 10 GX | — |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | 339,620 | — |
| Embedded Memory (bits) | 59,234,304 | — |
| DSP Blocks | 1,518 | Hardened fixed/floating-point DSP blocks (on-die) |
| Transceivers | 624 (per package aggregate channels) | Multi-gigabit serial transceivers (on-die) |
| Maximum Transceiver Data Rate | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) | — |
| Encapsulamento | 1932-ball FCBGA (F45, 45mm flip-chip BGA) | 1517-Ball FCBGA |
| Process Node | TSMC 20nm | — |
| Core Voltage (nominal) | 0.9 V | — |
| User I/O Banks | 12 | — |
| Maximum User I/O | 624 | — |
| Faixa de temperatura de operação | 0C to 100C (E2 commercial) | — |
| Speed Grade | S3 (-2 speed grade equivalent) | — |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Memory Interfaces | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 | Hardened DDR3/DDR4 memory controller IP |
| Family | — | Arria 10 GX |
| Embedded Memory | — | 59,234,304 bits |
| User I/O Count | — | 342 |
| Process Technology | — | 20 nm |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| Number of Terminals | — | 1517 |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |