10AX115U3F45E2SG vs 10AX115U3F45I2SG Comparação
Comparação detalhada lado a lado de 10AX115U3F45E2SG por Intel e 10AX115U3F45I2SG por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | 10AX115U3F45E2SG | 10AX115U3F45I2SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $5.800,00 | $7.450,00 |
| Family | Arria 10 GX | — |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory Bits | 68,857,856 (≈ 52.99 Mbit) | — |
| Number of Transceivers | [DATA_NEEDED: per-die transceiver count, F45 package variant] | — |
| Maximum Transceiver Data Rate | 17.4 Gbps | — |
| DSP Blocks | Variable-precision, hardened floating-point | — |
| Hard Memory Controllers | 2 (DDR4/DDR3/QDRII+/RLDRAM3) | — |
| Hard PCIe Gen3 IP Blocks | 2 × PCIe Gen3 (x8/x4/x2/x1) | — |
| Encapsulamento | 1932-ball FCBGA (F45, 45×45 mm, 1.0 mm pitch) | 1932-ball FCBGA (F45) |
| Process Node | 20 nm Tri-Gate (Intel) | — |
| Speed Grade | -2 (E2 commercial/extended) | I2 |
| Temperatura de operação | Industrial (junction -40 °C to +100 °C) – device grade U | — |
| Supply Voltage Core | [DATA_NEEDED: VCC/VCCP core voltage] | — |
| Configuration Method | FPGA configuration via serial/parallel flash, JTAG | — |
| RoHS Compliance | Compliant | — |
| Nível MSL | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | [DATA_NEEDED: MSL rating] |
| Series | — | Arria 10 GX |
| Logic Elements | — | 1,150,000 |
| Embedded Memory (M20K) | — | 68,857,856 bits (67.5 Mbit) |
| Embedded Memory Blocks | — | 1,518 |
| DSP Blocks (18x19 Multipliers) | — | 1,518 |
| User I/O Pins | — | 480 |
| Transceivers | — | 24 channels |
| Max Transceiver Data Rate | — | 14.4 Gbps |
| Hard Memory Controller | — | Yes (DDR4 / DDR3 / QDRII+) |
| Process Technology | — | TSMC 20 nm |
| Operating Temperature Grade | — | Industrial (-40C to +100C junction) |
| Configuration Scheme | — | AES-256 encrypted, partial reconfiguration |
| Tipo de montagem | — | Surface Mount |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |