10AX115U3F45I2SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
N.º da peça: 10AX115U3F45I2SG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9540.66 | $9.540,66 |
| 10 | $9050 | $90.500,00 |
| 50 | $8520 | $426.000,00 |
| 100 | $8090 | $809.000,00 |
| 500 | $7450 | $3.725.000,00 |
10AX115U3F45I2SG Visão geral
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that can be rewired after manufacturing to implement arbitrary digital functions. In the broader system hierarchy, an FPGA sits between general-purpose microcontrollers and fixed-function ASICs: unlike a microcontroller, an FPGA achieves true hardware parallelism and deterministic latency; unlike an ASIC, it is reprogrammable in the field. The Arria 10 family specifically targets transceiver-rich applications such as 4K video processing, wireless baseband, and 100G/400G datapath bridging.
Key features of the 10AX115U3F45I2SG include 1,150,000 logic elements, 67.5 Mbits embedded M20K memory, 1,518 18x19 multipliers, and 24 high-speed transceivers up to 14.4 Gbps. The 14.4 Gbps transceiver rate makes the device a natural fit for PCIe Gen3 x8, 10GbE, CPRI, and 6G/12G SDI aggregation. Hardened floating-point DSP blocks accelerate FFT, FIR, and matrix-multiply kernels in radar and beamforming DSP pipelines.
Architecturally, the device is built on TSMC's 20 nm process with a 14.4 Gbps hardened SerDes block, partial reconfiguration support, and a secure configuration scheme with AES-256 bitstream encryption. The transceiver PMA layer supports multiple protocols via soft PCS logic. The hard memory controller supports DDR4 up to 2666 Mbps in addition to DDR3 and QDRII+ SRAM interfaces. Power consumption is governed by an embedded Smart Voltage ID block that adapts core voltage to process and temperature corners.
Typical applications for the 10AX115U3F45I2SG include 4K/8K broadcast video processing, wireless baseband digital up/down conversion, 100G Ethernet datapath bridging, military radar preprocessing, medical imaging front-ends, and high-performance computing (HPC) protocol offload cards. The industrial speed grade (-I2) targets -40C to +100C junction operation.
A key design consideration is thermal management: at full transceiver and DSP utilization the FCBGA package can dissipate 25-35 W, requiring a heatsink and 8-layer or thicker PCB with microvia thermal vias under the lid. Power-on sequencing must follow Intel's Arria 10 Power Management User Guide to avoid latch-up of the 0.9 V core rail.
This page synthesizes distributor pricing, same-family drop-in alternatives drawn from the Intel Site MPN list, and practical design notes that complement (rather than replace) the official Intel Arria 10 Device Datasheet and Device Overview.
Alternativas drop-in para 10AX115U3F45I2SG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AX115U3F45I2SG (mesmo formato e footprint) — diferindo em Package, Speed Grade, Core Voltage, DSP Blocks, Process Node.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AX115U3F45I2LG
✅ Drop-In✓ Em estoque
$6600 / unidade
Ver ficha técnica →10AX115U3F45E2SG
✅ Drop-In✓ Em estoque
$5800 / unidade
Ver ficha técnica →10AX115U2F45I2SG
✅ Drop-In✓ Em estoque
$8902.49 / unidade
Ver ficha técnica →10AX115U2F45I2LG
✅ Drop-In✓ Em estoque
$9589.87 / unidade
Ver ficha técnica →10AX115U2F45I1SG
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →10AX115U2F45E2SG
✅ Drop-In✓ Em estoque
$6920.66 / unidade
Ver ficha técnica →10AX115U3F45I2SG Classificações máximas e características elétricas
| Series | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory (M20K) | 68,857,856 bits (67.5 Mbit) |
| Embedded Memory Blocks | 1,518 |
| DSP Blocks (18x19 Multipliers) | 1,518 |
| User I/O Pins | 480 |
| Transceivers | 24 channels |
| Max Transceiver Data Rate | 14.4 Gbps |
| Hard Memory Controller | Yes (DDR4 / DDR3 / QDRII+) |
| Process Technology | TSMC 20 nm |
| Encapsulamento | 1932-ball FCBGA (F45) |
| Operating Temperature Grade | Industrial (-40C to +100C junction) |
| Speed Grade | I2 |
| Configuration Scheme | AES-256 encrypted, partial reconfiguration |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Guia de Configuração de Pinos do 10AX115U3F45I2SG 1932-ball fcbga (f45)
Configuração de pinos para 10AX115U3F45I2SG (pacote 1932-ball fcbga (f45)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AX115U3F45I2SG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AX115U3F45I2SG é adequado para 7 aplicaçãos: 4K/8K Broadcast Video Processing, Wireless Baseband Digital Up/Down Conversion, 100G Ethernet Datapath Bridging, Military Radar Pre-Processing, Medical Imaging Front-End (Ultrasound / CT), High-Performance Computing (HPC) Protocol Offload, Industrial Automation and Machine Vision.
4K/8K Broadcast Video Processing
The 10AX115U3F45I2SG fits 4K/8K broadcast video pipelines because of its 24 transceivers supporting 6G/12G SDI and SMPTE 2022/2059 at up to 14.4 Gbps per lane, and its 1,150,000 logic elements which can ingest multi-channel 4K streams in parallel. Embedded 18x19 multipliers accelerate deinterlacing, scaling, and color-space conversion kernels without consuming external DSP chips. The 67.5 Mbit of M20K memory holds multiple line buffers for motion-adaptive processing at 60 fps. Placed on a video I/O card between SDI deserializers and an SoC host, it serves as the bridge between the SDI parallel bus and 10GbE/25GbE IP networks. The I2 industrial speed grade and -40C to +100C junction rating permit deployment in OB vans and outdoor broadcast enclosures. The 1932-ball FCBGA requires a high-density 12-layer PCB with microvia thermal arrays to dissipate the 18-22 W typical video-processing load.
Recomendado
Wireless Baseband Digital Up/Down Conversion
The 10AX115U3F45I2SG's combination of 1,518 18x19 multipliers and 24 transceivers at 14.4 Gbps makes it well-suited for wireless baseband digital up-conversion (DUC) and down-conversion (DDC) in 4G LTE and 5G NR small-cell applications. Each transceiver lane can carry CPRI up to 9.8 Gbps, so 24 lanes support a fully populated CPRI ring back to a baseband unit. The hard floating-point DSP blocks execute CFR, DPD, and crest-factor reduction kernels in fewer clock cycles than the previous-generation Arria V. Embedded 67.5 Mbit memory holds pre-distortion lookup tables and digital predistortion sample buffers without external SRAM. The 14.4 Gbps transceiver rate provides margin for higher-order QAM and carrier aggregation. Industrial temperature grade (I2) supports outdoor small-cell enclosures. Power consumption of approximately 20-25 W at full DSP+transceiver utilization requires a forced-air heatsink.
Recomendado
100G Ethernet Datapath Bridging
The 10AX115U3F45I2SG supports 100GbE aggregation by combining 24 transceivers at 14.4 Gbps into multiple 10G/25G/40G Ethernet channels, with soft IP implementing MAC, PCS, and RS-FEC layers. The 1.15M logic elements accommodate full 100G MAC-to-MAC bridge functions plus traffic shaping and QoS scheduling in a single device. The hard memory controller running DDR4 at 2666 Mbps provides line-rate buffering for 100G line cards without external packet-buffer SRAM. Industrial temp grade enables deployment in non-controlled-temperature telco edge cabinets. Estimated: total power at full 100G line rate is 28-32 W, requiring a finned heatsink with at least 200 LFM airflow. The 1932-ball FCBGA footprint aligns with standard 100G line-card PCB stack-ups.
Recomendado
Military Radar Pre-Processing
The 10AX115U3F45I2SG handles radar pre-processing because its 1,518 18x19 multipliers run windowing, pulse compression, and MTI filters at multi-hundred-MHz sample rates without external DSP chips. The 67.5 Mbit of embedded M20K memory stores range-Doppler map data, and the 24 transceivers digitize antenna arrays at up to 14.4 Gbps per lane. The I2 industrial temperature grade (-40C to +100C) supports deployment in ground-vehicle and shipboard radar enclosures. AES-256 encrypted bitstream and partial reconfiguration features protect firmware IP. Estimated: at full DSP and transceiver utilization, the device dissipates 30-35 W, demanding a cold-plate or conduction-cooled heatsink in MIL-STD-810 sealed enclosures. Quartus Prime Standard Edition supports DO-254 certifiable design flows for avionics adjacent applications.
Recomendado
Medical Imaging Front-End (Ultrasound / CT)
The 10AX115U3F45I2SG integrates beamforming and front-end filtering for ultrasound and CT imaging systems because its 1,518 DSP blocks execute FIR, I/Q demodulation, and envelope detection across 64-128 channels in parallel. The 67.5 Mbit M20K memory holds pre-computed beamforming coefficients and temporary scan-line buffers without external SRAM. The 24 transceivers aggregate probe-element data at up to 14.4 Gbps per lane, eliminating off-board analog front-end cards. The I2 industrial temp grade and low-jitter transceiver PLLs suit the EMI-sensitive medical environment. Estimated: power consumption of 22-28 W requires a low-profile fan-cooled heatsink in cart-mounted ultrasound systems. The AES-256 bitstream encryption protects patient-data processing IP.
Recomendado
High-Performance Computing (HPC) Protocol Offload
The 10AX115U3F45I2SG fits HPC protocol-offload accelerator cards because it implements low-latency MPI, OpenSHMEM, and custom RDMA transports via its 14.4 Gbps transceivers and 1.15M logic elements. The hard memory controller with DDR4 at 2666 Mbps reduces host-CPU memory contention by buffering scatter-gather lists in FPGA-side M20K blocks. The 480 user I/Os expose PCIe Gen3 x16 and multiple 10GbE/40GbE lanes directly to the host CPU through soft IP. Industrial temp grade allows deployment in standard server chassis. Estimated: a fully loaded protocol-offload card draws 25-32 W and needs a passive heatsink with 150 LFM chassis airflow. The AES-256 encrypted bitstream protects proprietary HPC protocol IP from reverse engineering.
Recomendado
Industrial Automation and Machine Vision
The 10AX115U3F45I2SG is well-suited to industrial machine-vision controllers because its 1.15M logic elements process multiple GigE Vision / CoaXPress camera streams in parallel, while the 24 transceivers drive CoaXPress links at up to 12.5 Gbps per lane. The 1,518 DSP blocks accelerate image pre-processing kernels (Sobel, Gaussian, FFT) at line-rate without external DSP chips. The 67.5 Mbit M20K memory holds frame buffers and feature-extraction tables. The I2 industrial temperature grade supports factory-floor operation from -40C to +100C. Estimated: at full machine-vision load the FPGA draws 20-26 W and requires a fanless heatsink in IP65 enclosures. The AES-256 bitstream encryption protects proprietary vision IP.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AX115U3F45I2SG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AX115U3F45I2LG | 10AX115U3F45E2SG | 10AX115U2F45I2SG | 10AX115U2F45I2LG | 10AX115U2F45I1SG | 10AX115U2F45E2SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | U3 (U3 = fastest) | U3 | U3 | U2 (one bin slower) | U2 (one bin slower) | U2 (one bin slower) | U2 (one bin slower) |
| Temperature Grade | Industrial (I2: -40C..+100C) | Industrial (I2) | Extended (E2: 0C..+100C) | Industrial (I2) | Industrial (I2) | Industrial (I1: slowest) | Extended (E2) |
| Transceivers | 24 @ 14.4 Gbps | 24 @ 14.4 Gbps | 24 @ 14.4 Gbps | 24 @ 14.4 Gbps | 24 @ 14.4 Gbps | 24 @ 14.4 Gbps | 24 @ 14.4 Gbps |
| User I/O | 480 | 480 | 480 | 480 | 480 | 480 | 480 |
| Embedded Memory | 67.5 Mbit (1,518 M20K blocks) | 67.5 Mbit (1,518 M20K blocks) | 67.5 Mbit (1,518 M20K blocks) | 67.5 Mbit (1,518 M20K blocks) | 67.5 Mbit (1,518 M20K blocks) | 67.5 Mbit (1,518 M20K blocks) | 67.5 Mbit (1,518 M20K blocks) |
| DSP Blocks (18x19) | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 |
| RoHS / Lead-Free | RoHS (G finish) | Lead-free (L finish) | RoHS (G finish) | RoHS (G finish) | Lead-free (L finish) | RoHS (G finish) | RoHS (G finish) |
Principais diferenciais
- Highest U3 speed grade in the 1.15M-LE Arria 10 F45 family (vs 10AX115U2F45I2SG)
- Industrial -40C to +100C junction rating for harsh environments (vs 10AX115U3F45E2SG)
- 24 transceivers at 14.4 Gbps in a single F45 FCBGA device (vs 10AX090U3F45I2SG)
Notas de projeto
Estimated: at full DSP and transceiver utilization, the 10AX115U3F45I2SG in the 1932-ball F45 FCBGA package dissipates 25-35 W. The lid requires a thermal interface material (TIM) pad or paste and an external heatsink rated for 0.2-0.3 C/W or better. Place a microvia thermal array (25+ vias per cm^2) directly under the package BGA footprint on a 12-layer PCB. For sealed industrial enclosures use a 200 LFM fan or a conduction-cooled cold plate. Always validate with the Arria 10 Early Power Estimator before committing to a thermal solution.
Power-on sequencing must follow the Arria 10 Power Management User Guide. The 0.9 V core rail must ramp last and monotonically, with VCCIO and VCCPD ramped before the core. Failure to sequence properly can trigger latch-up of the 20 nm core transistors. Use the Arria 10 development kit power tree as a reference: a dedicated Power Management IC such as the LTM4677 or ISLUSBPOLCTRL20 is recommended. Soft-start ramp time must be between 0.1 ms and 100 ms to avoid inrush trips.
The 1932-ball F45 FCBGA uses a 1.0 mm ball pitch, requiring laser-drilled microvias and a 12-layer or thicker PCB stack-up. Reference the Arria 10 F45 PCB Design Guidelines for the exact via-in-pad and back-drill stack-up. Use the Arria 10 Symbol and Footprint files from the Quartus Prime pin planner to verify the PCB footprint against the device datasheet. High-speed transceiver channels require matched-length routing with intra-pair skew less than 5 mil and lane-to-lane skew less than 50 mil for 14.4 Gbps operation.
Transceiver channels operating at 14.4 Gbps require a continuous reference-plane stack-up with no splits under the lanes. Use a 2 oz copper core for the transceiver power planes. AC-coupling capacitors must be placed within 250 mil of the FPGA ball, with the capacitor pad-to-via length matched to within 5 mil on each side of the capacitor. The PCIe Gen3 and 10GbE reference clock jitter must be below 100 fs RMS to meet the Arria 10 jitter tolerance mask. Use IBIS-AMI simulation with the Quartus Prime SI Toolkit for channel validation before tape-out.
Do not use the -E1, -E2, or -E3 speed grade for industrial temperature applications: the E grades are specified for 0C to +100C only. Substituting E2 for I2 in outdoor equipment voids the temperature rating. Do not operate the device above the maximum transceiver line rate of 14.4 Gbps: the device may produce bit errors but still appear functional. Always cross-check the bitstream SOF section against the configured device ID before release to production, especially when migrating between U3 and U2 speed grades.
Informações de conformidade
RoHS and lead-free compliance per Intel Arria 10 product page. AEC-Q100 not applicable (FPGA is not an automotive-grade part; automotive designers should evaluate under Intel's automotive program separately). Conflict-minerals compliance per Intel supplier declarations.