10M08SAU169C8G vs 10M08SCU169I7G Comparação
Comparação detalhada lado a lado de 10M08SAU169C8G por Intel e 10M08SCU169I7G por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | 10M08SAU169C8G | 10M08SCU169I7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $10,20 | $9,85 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LEs) | 8,000 | — |
| Embedded Memory (bits) | 387,072 (≈378 Kbits user flash + M9K block RAM) | — |
| User I/Os | 130 | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| M9K Block RAM (Kbits) | 173 (≈378 Kbits total embedded memory including user flash) | — |
| DSP Blocks | Yes (18x18 multiplier blocks) | — |
| PLLs | 4 analog PLLs + 2 fractional PLLs | — |
| On-chip ADC | Yes (single, 12-bit, 1 MSps equivalent — device dependent) | — |
| Configuration Memory | Dual-configuration on-chip flash (non-volatile, instant-on) | Internal flash (non-volatile, dual-boot) |
| Core Voltage | 1.2 V | — |
| I/O Voltage Standards | LVCMOS/LVTTL up to 3.3 V | — |
| Speed Grade | C8 (-8) | — |
| Encapsulamento | 169-LFBGA (UBGA, 11x11 mm, 0.8 mm pitch) | 169-ball UFBGA / UBGA (U169), 11 mm x 11 mm, 0.65 mm pitch |
| Temperatura de operação | Commercial / Industrial (per device suffix) | -40 C to +100 C (industrial, suffix I7G) |
| Process Node | 55 nm embedded flash | — |
| External Memory Interface | DDR3, LPDDR2, SRAM (hard IP) | — |
| PCIe Hard IP | Yes (PCIe Gen2 x1 hard IP block) | — |
| Status RoHS | Compliant | — |
| Configuration Mode | JTAG (1149.1) + Active Serial (AS) | — |
| Development Toolchain | Intel Quartus Prime | — |
| Logic Elements (LE) | — | 8,000 |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: M9K count and total bits] |
| Embedded User Flash | — | 387,072 bits (48 KB) |
| User I/O Count | — | 130 |
| Maximum User I/O (package) | — | 130 (U169) |
| Core Voltage (VCCINT) | — | 1.2 V |
| Process Technology | — | TSMC 55 nm embedded flash |
| PLL Count | — | [DATA_NEEDED: number of PLLs] |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: multiplier count] |
| ADC | — | 12-bit, 1 MSPS, 4 channels (single supply variant) |
| Tipo de montagem | — | Surface Mount (BGA) |
| Lead-Free / RoHS | — | Yes / Compliant |
| Nível MSL | — | 3 (per JEDEC J-STD-020) |
| Configuration Method | — | JTAG, internal flash, dual-boot |
| Supported I/O Standards | — | LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI |