10M08SAU169C8G vs 10M08SCU169I7G Vergleich
Detaillierter Direktvergleich von 10M08SAU169C8G von Intel und 10M08SCU169I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M08SAU169C8G | 10M08SCU169I7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,20 | $9,85 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LEs) | 8,000 | — |
| Embedded Memory (bits) | 387,072 (≈378 Kbits user flash + M9K block RAM) | — |
| User I/Os | 130 | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| M9K Block RAM (Kbits) | 173 (≈378 Kbits total embedded memory including user flash) | — |
| DSP Blocks | Yes (18x18 multiplier blocks) | — |
| PLLs | 4 analog PLLs + 2 fractional PLLs | — |
| On-chip ADC | Yes (single, 12-bit, 1 MSps equivalent — device dependent) | — |
| Configuration Memory | Dual-configuration on-chip flash (non-volatile, instant-on) | Internal flash (non-volatile, dual-boot) |
| Core Voltage | 1.2 V | — |
| I/O Voltage Standards | LVCMOS/LVTTL up to 3.3 V | — |
| Speed Grade | C8 (-8) | — |
| Gehäuse | 169-LFBGA (UBGA, 11x11 mm, 0.8 mm pitch) | 169-ball UFBGA / UBGA (U169), 11 mm x 11 mm, 0.65 mm pitch |
| Betriebstemperatur | Commercial / Industrial (per device suffix) | -40 C to +100 C (industrial, suffix I7G) |
| Process Node | 55 nm embedded flash | — |
| External Memory Interface | DDR3, LPDDR2, SRAM (hard IP) | — |
| PCIe Hard IP | Yes (PCIe Gen2 x1 hard IP block) | — |
| RoHS-Status | Compliant | — |
| Configuration Mode | JTAG (1149.1) + Active Serial (AS) | — |
| Development Toolchain | Intel Quartus Prime | — |
| Logic Elements (LE) | — | 8,000 |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: M9K count and total bits] |
| Embedded User Flash | — | 387,072 bits (48 KB) |
| User I/O Count | — | 130 |
| Maximum User I/O (package) | — | 130 (U169) |
| Core Voltage (VCCINT) | — | 1.2 V |
| Process Technology | — | TSMC 55 nm embedded flash |
| PLL Count | — | [DATA_NEEDED: number of PLLs] |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: multiplier count] |
| ADC | — | 12-bit, 1 MSPS, 4 channels (single supply variant) |
| Montageart | — | Surface Mount (BGA) |
| Lead-Free / RoHS | — | Yes / Compliant |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |
| Configuration Method | — | JTAG, internal flash, dual-boot |
| Supported I/O Standards | — | LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI |