A3P600-FG484 vs A3P600L-FG484 Comparação
Comparação detalhada lado a lado de A3P600-FG484 por Microchip Technology e A3P600L-FG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3P600-FG484 - ProASIC3 600K-Gate Flash FPGA, 484-BGA | Microchip
A3P600-FG484 ✓ AtivoMicrochip Technology
A3P600L-FG484 - ProASIC3L Low Power FPGA 600K Gates | Microchip
A3P600L-FG484 ✓ AtivoComparação de especificações
| Parâmetro | A3P600-FG484 | A3P600L-FG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $56,30 | $85,90 |
| Family | ProASIC3 (Flash FPGAs) | ProASIC3L (Flash FPGAs) |
| Total Gates | 600000 gates | — |
| Number of Registers | 13824 | — |
| VersaTiles (Logic Elements) | 13824 | — |
| Maximum User I/O | 235 I/O | — |
| System Performance | 231 MHz | — |
| Process Technology | 130 nm, 7-layer metal flash | — |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.14 V to 1.575 V |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| Embedded Memory | Embedded block SRAM (18 kbit blocks) | — |
| Soft Processor Support | ARM Cortex-M1 (optional soft core) | — |
| Encapsulamento | 484-pin FBGA, 23x23 mm | 484-FBGA (23 x 23 mm, 1.0 mm pitch, 2.23 mm height) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperatura de operação | 0C to +85C (TJ) | 0C to +85C (TJ) |
| Status RoHS | RoHS3 Compliant (lead-free per FGG variant) | Non-compliant (per Microchip USA listing) |
| Packaging | Tray | Tray |
| Programming | In-system programmable via JTAG, no external boot device | — |
| System Gates | — | 600000 |
| Logic Cells / CLBs | — | 13824 |
| Total RAM Bits | — | 110592 |
| User I/Os | — | 235 |
| Max Operating Frequency | — | 350 MHz (family rating) |
| Technology | — | CMOS, non-volatile flash based |
| Special Features | — | Flash*Freeze low-power standby technology |
| Configuration | — | Single-chip, on-chip flash (no external boot device) |
| Manufacturer Lead Time | — | 8 weeks |
| Product Status | — | Active |