A3PE3000-1FG484 vs A3PE3000-FG484 Comparação
Comparação detalhada lado a lado de A3PE3000-1FG484 por Microchip Technology e A3PE3000-FG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip
A3PE3000-FG484 ✓ AtivoComparação de especificações
| Parâmetro | A3PE3000-1FG484 | A3PE3000-FG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $49,80 | $139,75 |
| Family | ProASIC3E | ProASIC3E Flash FPGA |
| System Gates | 3M (3.00E6) | 3000000 |
| Logic Elements | 35KLEs | — |
| User I/Os | 341 | — |
| RAM Bits | 516096 bits | — |
| True Dual-Port SRAM | Up to 504 kbits (family) | — |
| Core Supply Voltage | 1.5V | — |
| System Performance | 272MHz | — |
| Process Technology | 130nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm flash CMOS |
| Flash-Based | Yes, Live-At-Power-Up | — |
| Encapsulamento | 484-ball FBGA (FG484), 1mm pitch | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperatura de operação | 0 to 70C | [DATA_NEEDED: operating temperature range] |
| Configuration | Single-chip, no external boot PROM required | — |
| Level 0 Support | Yes | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | G suffix = RoHS compliant (FG484 non-G variant per datasheet ordering info) |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Nível MSL | [DATA_NEEDED: MSL level] | — |
| Logic Cells (DFEs) | — | 75264 |
| User I/O | — | 341 |
| Core Voltage | — | 1.5 V |
| System Frequency | — | 231 MHz |
| Configuration Memory | — | On-chip flash (non-volatile, single-chip) |
| Soft CPU Support | — | Optional soft ARM support |
| Differential I/O Standards | — | LVDS, LVPECL |
| Footprint Compatibility | — | FG256 and FG484 footprint-compatible |
| Packaging | — | Tray |
| Embedded Memory | — | [DATA_NEEDED: embedded block RAM capacity] |