A3PE3000L-FG484I vs A3PE3000L-FG484 Comparação
Comparação detalhada lado a lado de A3PE3000L-FG484I por Microchip Technology e A3PE3000L-FG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip
A3PE3000L-FG484I ✓ AtivoMicrochip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ AtivoComparação de especificações
| Parâmetro | A3PE3000L-FG484I | A3PE3000L-FG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $0,00 | $112,00 |
| Family | ProASIC3L (ProASIC3 Low Power) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 (3.00E6) | 3000000 |
| Logic Cells (DFFs) | 75264 | — |
| User I/O (this package) | 341 | — |
| Max User I/O (family) | 616 | — |
| Embedded SRAM | 504 kbit true dual-port | — |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | — |
| Core Supply Voltage | 1.14 V to 1.575 V (1.2 V typical) | — |
| Configuration | Nonvolatile flash, Live-at-Power-Up Level 0 | Flash-based, Instant On, single-chip |
| Single-Chip Solution | Yes (no external configuration PROM) | — |
| Temperatura de operação | -40C to +100C (TJ, industrial) | [DATA_NEEDED: Operating Temperature] |
| Encapsulamento | 484-ball FBGA (23x23 mm, 1 mm pitch) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Speed | [DATA_NEEDED: speed grade / max frequency] | — |
| Status RoHS | ROHS3 Compliant | [DATA_NEEDED: RoHS compliance] |
| Packaging | Tray | — |
| Manufacturer Lead Time | 8 weeks | — |
| Logic Family | CMOS | — |
| Logic Cells / CLBs | — | 75264 |
| User I/Os | — | 341 |
| Maximum System Frequency | — | 250 MHz |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Technology | — | 130 nm CMOS flash, nonvolatile |
| Low Power Feature | — | Flash*Freeze technology |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 x 23 mm, 1 mm ball pitch |
| Package Height | — | 2.23 mm |
| Process | — | CMOS |
| Supply Voltage I/O | — | [DATA_NEEDED: I/O supply voltage range] |
| Embedded Memory | — | [DATA_NEEDED: Embedded RAM block capacity] |