A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip
N.º da peça: A3PE3000L-FG484I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
A3PE3000L-FG484I Visão geral
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration PROM. Within the programmable logic hierarchy, it sits at the device level of the power management and digital logic system, alongside SRAM-based and antifuse FPGAs. Flash-based devices such as the ProASIC3L family power up instantly (Live-at-Power-Up Level 0 support) and provide a true single-chip solution without a boot sequence.
Key features include the 130-nm, 7-layer-metal (6 copper) flash-based CMOS process, 1.2 V core operation for low static and dynamic power, and nonvolatile security via flash lock, which protects intellectual property without battery backfill or bitstream streaming. The L variant of the family adds low-power features versus the standard ProASIC3E A3PE3000.
Technically, the device provides 504 kbits of true dual-port SRAM distributed in variable-aspect-ratio blocks, supporting FIFOs, buffers and embedded datapaths. VersaTiles form the fine-grained fabric, while I/O banks support multiple single-ended and differential standards with configurable drive and slew.
Typical applications include industrial automation control, secure communications and military/aerospace systems requiring instant-on operation, single-chip integration and low static power.
Design consideration: budget the 1.2 V core rail and 2.5 V/3.3 V I/O rails separately and follow Microchip's power-decoupling guidance; flash FPGAs tolerate hot-socketing but sequencing rules still apply.
This page synthesizes distributor pricing, drop-in alternatives within the ProASIC3 family, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para A3PE3000L-FG484I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3PE3000L-FG484I (mesmo formato e footprint) — diferindo em Family, Package, Process Technology, System Gates, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3PE3000L-1FGG484I
✅ Drop-In✓ Em estoque
$104.5 / unidade
Ver ficha técnica →A3PE3000L-FGG484I
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A3PE3000L-FG484
✅ Drop-In✓ Em estoque
$112 / unidade
Ver ficha técnica →A3PE3000L-1FG484I
✅ Drop-In✓ Em estoque
$89.9 / unidade
Ver ficha técnica →A3PE3000-FGG484
✅ Drop-In✓ Em estoque
$152.6 / unidade
Ver ficha técnica →A3PE3000-FG484
✅ Drop-In✓ Em estoque
$139.75 / unidade
Ver ficha técnica →A3PE3000L-FG484I Classificações máximas e características elétricas
| Family | ProASIC3L (ProASIC3 Low Power) |
| System Gates | 3000000 (3.00E6) |
| Logic Cells (DFFs) | 75264 |
| User I/O (this package) | 341 |
| Max User I/O (family) | 616 |
| Embedded SRAM | 504 kbit true dual-port |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.14 V to 1.575 V (1.2 V typical) |
| Configuration | Nonvolatile flash, Live-at-Power-Up Level 0 |
| Single-Chip Solution | Yes (no external configuration PROM) |
| Temperatura de operação | -40C to +100C (TJ, industrial) |
| Encapsulamento | 484-ball FBGA (23x23 mm, 1 mm pitch) |
| Tipo de montagem | Surface Mount |
| Status RoHS | ROHS3 Compliant |
| Packaging | Tray |
| Manufacturer Lead Time | 8 weeks |
| Logic Family | CMOS |
Guia de Configuração de Pinos do A3PE3000L-FG484I 484-ball fbga (23x23 mm, 1 mm pitch)
Configuração de pinos para A3PE3000L-FG484I (pacote 484-ball fbga (23x23 mm, 1 mm pitch)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3PE3000L-FG484I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3PE3000L-FG484I é adequado para 6 aplicaçãos: Industrial Automation Control, Secure Communications Equipment, Aerospace and Defense Systems, Test and Measurement Instrumentation, Medical Device Control Logic, Battery-Powered Embedded Systems.
Industrial Automation Control
The A3PE3000L-FG484I fits industrial automation controllers where deterministic, instant-on logic must run the moment power is applied, with no configuration load time. Its 3 million gates and 75264 DFFs absorb motor sequencing, safety interlock and protocol-bridge logic, while 504 kbit of true dual-port SRAM buffers fieldbus frames. The industrial -40C to +100C (TJ) rating survives cabinet temperature swings, and the 1.2 V core keeps convection-cooled enclosures within thermal budget. Unlike SRAM FPGAs, the flash configuration needs no external PROM, improving reliability in single-chip PLC and I/O-module designs.
Recomendado
Secure Communications Equipment
Flash-based FPGAs are the default choice for secure radios and encrypted links because the bitstream never leaves the chip: the A3PE3000L-FG484I stores configuration in on-chip flash with flash-lock security, eliminating the configuration-stream snooping risk of SRAM FPGAs. The 3M-gate fabric implements AES/DES cores and bus encryption, while 341 user I/O supports multiple parallel and serial interface banks in the 484-ball FBGA. Live-at-Power-Up Level 0 operation means links re-establish instantly after power interruptions, and the -40C to +100C industrial grade covers outdoor and vehicular communication cabinets.
Recomendado
Aerospace and Defense Systems
The A3PE3000L-FG484I suits avionics and defense subsystems that need single-event-mitigated, low-power programmable logic with guaranteed instant-on behavior. Flash cells are inherently more SEU-tolerant for configuration storage than SRAM, reducing scrubbing overhead. With a 1.14 V to 1.575 V core range and low static power, the part fits power-constrained platforms, while the industrial -40C to +100C rating supports unheated compartments. The 484-ball FBGA with 1 mm pitch provides 341 I/O for sensor buses, ARINC-style parallel interfaces and redundant control channels within a 23x23 mm footprint.
Recomendado
Test and Measurement Instrumentation
Bench and modular instruments use the A3PE3000L-FG484I as trigger engines, timing generators and bus bridges, where 75264 flip-flops provide deep counter and state-machine resources and 504 kbit dual-port SRAM implements capture FIFOs. The flash fabric powers up with the instrument, removing boot delay at power-on self-test. Multiple I/O standards on the 341 user pins let one device interface to both legacy 5 V-tolerant style front ends and modern low-voltage digital buses. Low 1.2 V core operation keeps the internal supply rail simple alongside 3.3 V I/O rails in a mixed-signal instrument chassis.
Recomendado
Medical Device Control Logic
Portable and benchtop medical devices benefit from the A3PE3000L-FG484I's low static power and instant-on flash configuration: patient-interface logic, sensor timing and safety monitors are active immediately when the device is switched on. The single-chip solution removes the external configuration PROM, a failure point and board area cost in compact medical hardware. 3 million gates consolidate glue logic, motor control sequencing and display interface functions, and the -40C to +100C TJ range covers autoclave-adjacent and cold-storage environments. Nonvolatile flash lock also supports design IP protection required by device manufacturers.
Recomendado
Battery-Powered Embedded Systems
The ProASIC3L family exists specifically for low-power battery and energy-harvesting designs: the A3PE3000L-FG484I runs a 1.2 V core (1.14 V to 1.575 V range) with reduced static and dynamic power versus the 1.5 V ProASIC3E, extending battery life in duty-cycled systems. Because configuration is nonvolatile, the FPGA can enter deep sleep and resume instantly without reconfiguration energy - a key advantage over SRAM FPGAs that must reload their bitstream at every wake-up. The 341 available I/O in the 484-ball FBGA consolidates sensor, display and radio interfaces into one always-ready programmable device.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3PE3000L-FG484I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3PE3000L-1FGG484I | A3PE3000L-FGG484I | A3PE3000-FGG484 | A3PE3000-FG484 |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (23x23 mm, 1 mm pitch) | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Brand | Microchip Technology (formerly Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Core Voltage | 1.2 V (1.14 V - 1.575 V) | 1.2 V (1.14 V - 1.575 V) | 1.2 V (1.14 V - 1.575 V) | 1.5 V | 1.5 V |
| Speed Rating | Standard grade | -1 (relaxed) | Standard grade | 231 MHz class (ProASIC3E) | 231 MHz class (ProASIC3E) |
| Configuration / Security | On-chip flash, Live-at-Power-Up Level 0, flash lock | Same flash-based, single-chip | Same flash-based, single-chip | Same flash-based, single-chip | Same flash-based, single-chip |
Principais diferenciais
- Lower core power than the ProASIC3E equivalent (vs A3PE3000-FG484)
- Cost-optimized speed grade option (vs A3PE3000L-FGG484I)
- Industrial temperature qualification (vs A3PE3000L-FG484)
Notas de projeto
Estimated: power-budget the three rails separately - VMON/core at 1.2 V (permitted 1.14 V to 1.575 V), VDDI/auxiliary, and VDDI/O banks at 2.5 V or 3.3 V. At 3M gates, dynamic power scales with toggle rate, so run Microchip Libero SmartPower on the compiled netlist before fixing the core regulator rating; static power at 1.2 V is far lower than the 1.5 V A3PE3000E equivalent. Use SmartPower-reported worst-case current, not gate-count estimates, when sizing the 1.2 V DC-DC converter.
The 484-ball FBGA is a 1 mm pitch, 23x23 mm BGA: design an expandable fanout (via-in-pad or dog-bone) on at least 6 layers, and dedicate the central ball region to power/ground per Microchip's package pinout tables. Place 100 nF ceramic decoupling on every VDD/VDDI ball group plus bulk capacitance at the board entry. Because this is a flash FPGA, no configuration PROM routing is needed - but route JTAG and flash-lock programming access for in-system updates.
Do not mix the commercial (no I suffix) and industrial (I suffix) grades across a BOM without re-qualifying: A3PE3000L-FG484 (commercial) drops in on the same footprint but is not rated -40C to +100C. Also remember that although the family supports up to 616 user I/O, this 484-ball package exposes only 341 - over-allocating I/O in HDL will fail place-and-route. Re-run timing closure in Libero after any speed-grade migration (e.g., to -1 parts).
Informações de conformidade
ROHS3 Compliant per Microchip USA product listing for the A3PE3000L-FGG484I family. REACH, halogen-free and conflict-minerals statuses not stated in the provided data.
