A3PE3000L-FG484M vs A3PE3000L-FG484 Comparação
Comparação detalhada lado a lado de A3PE3000L-FG484M por Microchip Technology e A3PE3000L-FG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-FG484M ✓ AtivoMicrochip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ AtivoComparação de especificações
| Parâmetro | A3PE3000L-FG484M | A3PE3000L-FG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $129,00 | $112,00 |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 (3.00E6) | 3000000 |
| Logic Elements (VersaTiles) | 75264 | — |
| True Dual-Port SRAM | 504 kbits | — |
| User I/O | 341 (up to 616 in larger packages) | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Process Technology | 130-nm, 7-layer metal (6 copper) flash-based CMOS | — |
| Logic Family | CMOS | — |
| Configuration Memory | Nonvolatile on-chip flash, live at power-up (Level 0) | — |
| Low-Power Feature | Flash*Freeze technology | — |
| Temperatura de operação | 0 to 70 C | [DATA_NEEDED: Operating Temperature] |
| Tensão de alimentação | 1.5 V | — |
| Package Type | FBGA-484, 1 mm pitch, 23 x 23 mm | 484-ball FBGA (PBGA484) |
| Pins / Balls | 484 | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Single-Chip Solution | Yes (no external configuration device required) | — |
| Logic Cells / CLBs | — | 75264 |
| User I/Os | — | 341 |
| Maximum System Frequency | — | 250 MHz |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Technology | — | 130 nm CMOS flash, nonvolatile |
| Configuration | — | Flash-based, Instant On, single-chip |
| Low Power Feature | — | Flash*Freeze technology |
| Package Dimensions | — | 23 x 23 mm, 1 mm ball pitch |
| Package Height | — | 2.23 mm |
| Process | — | CMOS |
| Supply Voltage I/O | — | [DATA_NEEDED: I/O supply voltage range] |
| Embedded Memory | — | [DATA_NEEDED: Embedded RAM block capacity] |
| Status RoHS | — | [DATA_NEEDED: RoHS compliance] |