A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip
N.º da peça: A3PE3000L-FG484M ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $189 | $189,00 |
| 10 | $175.5 | $1.755,00 |
| 100 | $158 | $15.800,00 |
| 500 | $142 | $71.000,00 |
| 1.000 | $129 | $129.000,00 |
A3PE3000L-FG484M Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor device that implements user-defined digital logic through a configurable fabric of logic blocks, routing resources, and I/O cells. The ProASIC3L family sits within Microchip's broader flash FPGA hierarchy, positioned above the ProASIC3E in power efficiency and below Fusion/M1 series in system integration. Unlike SRAM-based FPGAs, flash-based FPGAs are nonvolatile, live at power-up (Instant On), and require no external configuration ROM.
Key features include the Flash*Freeze technology, which drops static and dynamic power to microwatt levels while retaining state, a 1.2 V to 1.5 V core voltage, and a 130-nm, 7-layer metal (6 copper) flash-based CMOS process. Security is enhanced because the configuration bitstream is stored on-chip in flash, immune to readback attacks.
Architecturally, the device provides VersaTiles as its universal logic element, embedded block RAM organized as true dual-port SRAM, and banked I/O supporting multiple voltage standards. Performance reaches approximately 250 MHz system speeds, sufficient for glue logic, bus bridging, and control-plane functions.
Typical applications include industrial control, portable and battery-powered instrumentation, communications line cards, aerospace subsystems, and ASIC prototyping, where single-chip instant-on operation and low standby power matter.
Designers should budget power using the Microchip Libero SoC power calculator and watch I/O bank voltage assignments, since 484 balls share limited bank resources.
This page adds verified distributor pricing tiers, same-package drop-in alternatives, and practical design notes not found in the datasheet alone.
Alternativas drop-in para A3PE3000L-FG484M — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3PE3000L-FG484M (mesmo formato e footprint) — diferindo em Family, Package, Process Technology, System Gates, Configuration.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3PE3000L-FGG484M
✅ Drop-In✓ Em estoque
$298 / unidade
Ver ficha técnica →A3PE3000L-FG484I
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A3PE3000L-1FG484M
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A3PE3000L-FG484
✅ Drop-In✓ Em estoque
$112 / unidade
Ver ficha técnica →M1A3PE3000L-FGG484M
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3PE3000L-FG484M Classificações máximas e características elétricas
| Family | ProASIC3L (Flash-based FPGA) |
| System Gates | 3000000 (3.00E6) |
| Logic Elements (VersaTiles) | 75264 |
| True Dual-Port SRAM | 504 kbits |
| User I/O | 341 (up to 616 in larger packages) |
| Core Voltage | 1.2 V to 1.5 V |
| Process Technology | 130-nm, 7-layer metal (6 copper) flash-based CMOS |
| Logic Family | CMOS |
| Configuration Memory | Nonvolatile on-chip flash, live at power-up (Level 0) |
| Low-Power Feature | Flash*Freeze technology |
| Temperatura de operação | 0 to 70 C |
| Tensão de alimentação | 1.5 V |
| Package Type | FBGA-484, 1 mm pitch, 23 x 23 mm |
| Pins / Balls | 484 |
| Tipo de montagem | Surface Mount |
| Single-Chip Solution | Yes (no external configuration device required) |
Guia de Configuração de Pinos do A3PE3000L-FG484M fbga-484, 1 mm pitch, 23 x 23 mm
Configuração de pinos para A3PE3000L-FG484M (pacote fbga-484, 1 mm pitch, 23 x 23 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3PE3000L-FG484M.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3PE3000L-FG484M é adequado para 6 aplicaçãos: Portable Battery-Powered Instrumentation, Industrial Control and Automation, Communications Line Cards, Aerospace and Defense Subsystems, ASIC Prototyping and Low-Volume Production, Medical Device Control Electronics.
Portable Battery-Powered Instrumentation
The A3PE3000L-FG484M fits handheld and portable test equipment because the ProASIC3L family was specifically optimized for low static and dynamic power on top of the standard ProASIC3 fabric. With a core voltage down to 1.2 V, dynamic power scales directly with V squared, cutting switching energy roughly 36% versus a 1.5 V core. Flash*Freeze mode drops standby draw to microwatts while retaining register and SRAM state, so the instrument can duty-cycle between active measurement and idle without reconfiguration latency. Because configuration is nonvolatile flash, the device is live at power-up with no boot current spike, extending battery budget in systems that power-cycle frequently.
Recomendado
Industrial Control and Automation
In industrial PLC I/O modules, motor control interfaces, and machine monitoring nodes, the A3PE3000L-FG484M provides 341 user I/Os with banked voltage support, letting one chip bridge legacy 5 V-tolerant signaling domains and modern 1.8 V/2.5 V/3.3 V logic. The 75264 VersaTiles implement deterministic state machines and safety interlocks without processor software latency, while 504 kbits of true dual-port SRAM buffer sensor histories and communication frames. The single-chip, nonvolatile design eliminates configuration devices that can fail in electrically noisy factory environments, improving MTBF. The industrial-temperature A3PE3000L-FG484I variant covers -40 to +100 C cabinet installations.
Recomendado
Communications Line Cards
Networking and telecommunications line cards use the A3PE3000L-FG484M as control-plane glue logic, bus bridging, and status aggregation between physical-layer devices and backplane management. The 484-ball FBGA provides enough I/O to interface PHY chips, framers, and management MACs simultaneously, and VersaTile fabric reaches approximately 250 MHz system performance - adequate for clock-domain crossing, serializers of low-rate telemetry, and backplane handshaking rather than high-speed payload switching. Instant-on operation means the FPGA is available the moment power arrives, which simplifies hot-swap sequencing. Flash*Freeze mode also trims idle power in redundant, always-installed card slots.
Recomendado
Aerospace and Defense Subsystems
The ProASIC3/EL architecture originated with Actel's military and aerospace heritage, and datasheet archives specifically document military ProASIC3L variants, making the A3PE3000L-FG484M a common choice for avionics control functions, satellite payload housekeeping, and secure ground equipment. Flash-based configuration is inherently resistant to bitstream readback, supporting design security requirements, and single-event susceptibility is mitigated versus SRAM configuration cells because the configuration is held in nonvolatile flash. Designers typically pair the device with triple-modular-redundancy coding in Libero and select screening/temperature variants as the program requires, using the same 484-ball footprint across qualification builds.
Recomendado
ASIC Prototyping and Low-Volume Production
ASIC teams use the A3PE3000L-FG484M for RTL prototyping and bridge-to-production: its 3 million system gates and 504 kbits of dual-port SRAM accommodate mid-size SoC peripherals, controllers, and datapaths, while the ProASIC3E-generation flow means netlists port from ASIC synthesis with minimal retargeting. Because configuration is nonvolatile and secure, prototype boards can ship to customers without exposing the netlist, unlike SRAM FPGAs whose bitstreams can be copied from the boot PROM. In low-volume production where mask costs are unjustified, the same flash FPGA substitutes for the ASIC indefinitely, and the 484-ball footprint supports dense BGA-based prototype boards.
Recomendado
Medical Device Control Electronics
Benchtop diagnostics, portable patient monitors, and lab automation instruments benefit from the A3PE3000L-FG484M's combination of deterministic logic, low idle power, and secure nonvolatile configuration. Patient-interface boards need many independently-banked I/Os - the 341 available user I/Os on FG484 drive sensor arrays, switches, and display interfaces without external glue logic. Flash*Freeze keeps standby power inside battery-operated monitor budgets between measurements, and the single-chip design avoids configuration components whose integrity matters in safety-related equipment. Firmware-in-FPGA updates are performed over JTAG or in-system, supporting field maintenance of regulated medical products with controlled design archives.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3PE3000L-FG484M — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3PE3000L-FGG484M | A3PE3000L-FG484I | A3PE3000L-1FG484M | M1A3PE3000L-FGG484M |
|---|---|---|---|---|---|
| Package | FBGA-484, 1 mm pitch, 23 x 23 mm | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3.00E6 | 3.00E6 | 3.00E6 | 3.00E6 | 3.00E6 |
| Flash*Freeze Technology | Yes | Yes | Yes | Yes | Yes |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
Principais diferenciais
- Micropower standby via Flash*Freeze (vs A3PE3000-1FGG484I (ProASIC3E standard family))
- Industrial temperature option in identical footprint (vs A3PE3000L-FG484I)
- Nonvolatile secure single-chip configuration (vs SRAM-based competitor FPGAs (e.g., Xilinx Spartan-class))
Notas de projeto
Estimate power before layout using the Microchip Libero SoC SmartPower tool, not hand arithmetic. Dynamic power scales with core voltage squared, so running the 1.2 V lower core rail instead of 1.5 V cuts switching power roughly 36% (1.2/1.5 = 0.8; 0.8 squared = 0.64). Budget for Flash*Freeze wake-up latency in duty-cycled systems - entry and exit take microseconds, which is negligible for most sensors but must be modeled for fast control loops. Provide independent, well-decoupled 1.2 V/1.5 V core, 2.5 V auxiliary, and I/O bank rails per the datasheet power-up requirements.
The 484-ball FBGA with 1 mm pitch requires via-in-pad or dog-bone fanout on roughly 0.8-1.0 mm via grids; plan an 8-layer stack with dedicated ground planes under the die area to control I/O return paths. Follow the datasheet power-ramp requirements - core should be stable per the specified sequencing or use the device's built-in support for any-rail-first power-up. Place 100 nF ceramic decoupling on every VCC/VCORE ball group and bulk capacitance near the regulators. JTAG programming balls should be routed to a header for in-system reprogramming with FlashPro.
Common pitfalls: (1) Migrating a design compiled for the -1 speed grade (A3PE3000L-1FG484M) onto this standard-grade part may fail timing - recompile and re-verify timing reports. (2) I/O bank voltage conflicts arise when 341 user I/Os are assigned across few banks; run Libero pin checking early. (3) The commercial 'M' part is rated 0 to 70 C only - specify the -I variant for extended temperature. (4) Do not rely on cross-brand FPGA substitution; flash FPGA pinouts are proprietary, so only same-family FG484 parts are true drop-ins.
Informações de conformidade
Verified web data does not state RoHS/REACH status for the M suffix variant; the FGG (green) packaging variants are typically the RoHS/lead-free options. Consult Microchip's environmental page for the exact compliance declaration before ordering for regulated markets.
