A3PE3000L-FG896 vs A3PE3000L-FGG896I Comparação
Comparação detalhada lado a lado de A3PE3000L-FG896 por Microchip Technology e A3PE3000L-FGG896I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE3000L-FG896 - ProASIC3L Low Power FPGA 620 I/O | Microchip
A3PE3000L-FG896 ✓ AtivoMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ AtivoComparação de especificações
| Parâmetro | A3PE3000L-FG896 | A3PE3000L-FGG896I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $0,00 | $139,90 |
| Family | ProASIC3L | ProASIC3L |
| System Gates | 3,000,000 | 3000000 |
| User I/O | 620 | — |
| Logic Cells | 75,264 | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Technology | 130 nm nonvolatile flash | — |
| Configuration Memory | Nonvolatile flash (single-chip, Instant On) | — |
| Encapsulamento | 896-ball FBGA | — |
| Tipo de montagem | Surface Mount | Surface Mount (SMD/SMT) |
| Low Power Feature | Flash*Freeze technology | — |
| Max Operating Frequency | [DATA_NEEDED: max operating frequency] | — |
| Embedded Memory | [DATA_NEEDED: embedded memory size] | — |
| Temperatura de operação | [DATA_NEEDED: operating temperature range] | Industrial grade (I suffix) |
| Operating Temperature Suffix | Commercial (unmarked suffix; -I grade is industrial) | — |
| Status RoHS | unknown | [DATA_NEEDED: RoHS status] |
| Nível MSL | [DATA_NEEDED: MSL level] | — |
| Programmability | In-system reprogrammable | — |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| Tensão de alimentação | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| Encapsulamento / Caixa | — | 896-BGA (FBGA, 1 mm pitch) |
| Packaging | — | Tray, standard quantity 27 |
| Speed Grade | — | Standard (no speed suffix) |