A3PE3000L-FG896 vs A3PE3000L-FGG896I Comparación

Comparación detallada lado a lado de A3PE3000L-FG896 por Microchip Technology y A3PE3000L-FGG896I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
A3PE3000L-FG896 A3PE3000L-FG896 - ProASIC3L Low Power FPGA 620 I/O | Microchip

A3PE3000L-FG896 - ProASIC3L Low Power FPGA 620 I/O | Microchip

A3PE3000L-FG896 ✓ Activo
Microchip Technology
A3PE3000L-FGG896I A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip

A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip

A3PE3000L-FGG896I ✓ Activo

Comparación de especificaciones

Parámetro A3PE3000L-FG896 A3PE3000L-FGG896I
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $0,00 $139,90
Family ProASIC3L ProASIC3L
System Gates 3,000,000 3000000
User I/O 620 —
Logic Cells 75,264 —
Core Voltage 1.2 V to 1.5 V —
Technology 130 nm nonvolatile flash —
Configuration Memory Nonvolatile flash (single-chip, Instant On) —
Encapsulado 896-ball FBGA —
Tipo de montaje Surface Mount Surface Mount (SMD/SMT)
Low Power Feature Flash*Freeze technology —
Max Operating Frequency [DATA_NEEDED: max operating frequency] —
Embedded Memory [DATA_NEEDED: embedded memory size] —
Temperatura de funcionamiento [DATA_NEEDED: operating temperature range] Industrial grade (I suffix)
Operating Temperature Suffix Commercial (unmarked suffix; -I grade is industrial) —
Estado RoHS unknown [DATA_NEEDED: RoHS status]
Nivel MSL [DATA_NEEDED: MSL level] —
Programmability In-system reprogrammable —
Total RAM Bits — 516096 bits
Embedded Memory Type — True Dual-Port SRAM (504 kbits)
Number of I/O — 620
Tensión de alimentación — 1.14 V to 1.575 V
Core Voltage Support — 1.2 V to 1.5 V
Logic Family / Process — CMOS, 130-nm, 7-layer metal (6 copper), flash-based
Configuration Technology — Nonvolatile Flash, Live-at-Power-Up Level 0
Special Features — Flash*Freeze technology, single-chip solution
Encapsulado / Carcasa — 896-BGA (FBGA, 1 mm pitch)
Packaging — Tray, standard quantity 27
Speed Grade — Standard (no speed suffix)

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