A3PE3000L-FGG484 vs A3PE3000L-FG484 Comparação

Comparação detalhada lado a lado de A3PE3000L-FGG484 por Microchip Technology e A3PE3000L-FG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
A3PE3000L-FGG484 A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip

A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip

A3PE3000L-FGG484 ✓ Ativo
Microchip Technology
A3PE3000L-FG484 A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip

A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip

A3PE3000L-FG484 ✓ Ativo

Comparação de especificações

Parâmetro A3PE3000L-FGG484 A3PE3000L-FG484
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $0,00 $112,00
Family ProASIC3L (Low Power Flash FPGA) ProASIC3L (Low Power Flash FPGA)
System Gates 3,000,000 3000000
Logic Cells 75,264 —
User I/O 341 —
Embedded RAM 516,096 bits —
Core Voltage 1.2 V to 1.5 V —
Process Technology 130 nm flash —
Configuration Technology Nonvolatile flash, Instant On —
Low Power Feature Flash*Freeze technology Flash*Freeze technology
Encapsulamento 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm, 1.0 mm pitch —
Tipo de montagem Surface Mount Surface Mount
Temperatura de operação [DATA_NEEDED: operating temperature range] [DATA_NEEDED: Operating Temperature]
Supply Voltage - I/O [DATA_NEEDED: I/O bank voltage range] —
Status RoHS Compliant (per Newark: RoHS Compliant: Yes) [DATA_NEEDED: RoHS compliance]
Packaging Tray —
Security Single-chip, flash-based, secure nonvolatile configuration —
Logic Cells / CLBs — 75264
User I/Os — 341
Maximum System Frequency — 250 MHz
Core Voltage Range — 1.2 V to 1.5 V
Technology — 130 nm CMOS flash, nonvolatile
Configuration — Flash-based, Instant On, single-chip
Package Type — 484-ball FBGA (PBGA484)
Package Dimensions — 23 x 23 mm, 1 mm ball pitch
Package Height — 2.23 mm
Process — CMOS
Supply Voltage I/O — [DATA_NEEDED: I/O supply voltage range]
Embedded Memory — [DATA_NEEDED: Embedded RAM block capacity]

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