A3PE600-1FGG256I vs A3PE600-1FG256I Comparação
Comparação detalhada lado a lado de A3PE600-1FGG256I por Microchip Technology e A3PE600-1FG256I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE600-1FGG256I - 600K-Gate Flash FPGA 165 I/O | Microchip
A3PE600-1FGG256I ✓ AtivoMicrochip Technology
A3PE600-1FG256I - ProASIC3E FPGA 600K Gates 256-FBGA | Microchip
A3PE600-1FG256I ✓ AtivoComparação de especificações
| Parâmetro | A3PE600-1FGG256I | A3PE600-1FG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $33,50 | $38,20 |
| System Gates | 600000 | — |
| Logic Cells | 13824 | — |
| Embedded SRAM | 110592 bits (up to 504 kbits family density) | — |
| User I/O | 165 | 165 |
| Maximum System Performance | 272 MHz | — |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.5 V |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm flash |
| Configuration Memory | On-chip Flash (Live at Power-Up, Level 0) | On-chip flash, single chip, no external PROM |
| Encapsulamento | 256-LBGA (FBGA-256), 1.0 mm ball pitch | 256-FBGA (256-LBGA) |
| Temperatura de operação | -40C to +100C (TJ), industrial | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Logic Family | CMOS | — |
| Speed Grade | -1 | -1 |
| Family | ProASIC3E | ProASIC3E |
| Reprogrammability | Yes (single-chip, no external boot PROM) | Yes, live reprogrammable |
| Typical Application Domains | Industrial, communications, medical, aerospace/defense | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Logic Gates | — | 600000 gates |
| System Performance | — | 272 MHz |
| Temperature Grade | — | Industrial (-40C to +85C) |
| Terminal Form | — | Ball (BGA) |
| Package Shape | — | Square |
| Power-Up Behavior | — | Instant-on (flash based) |
| Embedded Memory | — | [DATA_NEEDED: embedded memory bits] |