A3PE600-1FGG256I vs A3PE600-1FG256I Comparaison
Comparaison détaillée côte à côte de A3PE600-1FGG256I par Microchip Technology et A3PE600-1FG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE600-1FGG256I - 600K-Gate Flash FPGA 165 I/O | Microchip
A3PE600-1FGG256I ✓ ActifMicrochip Technology
A3PE600-1FG256I - ProASIC3E FPGA 600K Gates 256-FBGA | Microchip
A3PE600-1FG256I ✓ ActifComparaison des spécifications
| Paramètre | A3PE600-1FGG256I | A3PE600-1FG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $33,50 | $38,20 |
| System Gates | 600000 | — |
| Logic Cells | 13824 | — |
| Embedded SRAM | 110592 bits (up to 504 kbits family density) | — |
| User I/O | 165 | 165 |
| Maximum System Performance | 272 MHz | — |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.5 V |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm flash |
| Configuration Memory | On-chip Flash (Live at Power-Up, Level 0) | On-chip flash, single chip, no external PROM |
| Boîtier | 256-LBGA (FBGA-256), 1.0 mm ball pitch | 256-FBGA (256-LBGA) |
| Température de fonctionnement | -40C to +100C (TJ), industrial | — |
| Type de montage | Surface Mount | Surface Mount |
| Logic Family | CMOS | — |
| Speed Grade | -1 | -1 |
| Family | ProASIC3E | ProASIC3E |
| Reprogrammability | Yes (single-chip, no external boot PROM) | Yes, live reprogrammable |
| Typical Application Domains | Industrial, communications, medical, aerospace/defense | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Logic Gates | — | 600000 gates |
| System Performance | — | 272 MHz |
| Temperature Grade | — | Industrial (-40C to +85C) |
| Terminal Form | — | Ball (BGA) |
| Package Shape | — | Square |
| Power-Up Behavior | — | Instant-on (flash based) |
| Embedded Memory | — | [DATA_NEEDED: embedded memory bits] |