A3PE600-FG484M vs A3P600-FGG484 Comparação

Comparação detalhada lado a lado de A3PE600-FG484M por Microchip Technology e A3P600-FGG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
A3PE600-FG484M A3PE600-FG484M - 600K-Gate ProASIC3E Flash FPGA | Microchip

A3PE600-FG484M - 600K-Gate ProASIC3E Flash FPGA | Microchip

A3PE600-FG484M ✓ Ativo
Microchip Technology
A3P600-FGG484 A3P600-FGG484 - 600K Gate ProASIC3 FPGA | Microchip

A3P600-FGG484 - 600K Gate ProASIC3 FPGA | Microchip

A3P600-FGG484 ✓ Ativo

Comparação de especificações

Parâmetro A3PE600-FG484M A3P600-FGG484
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $68,90 $44,75
Family ProASIC3E (Flash-Based FPGA) ProASIC3
System Gates 600000 600K
Logic Elements / Cells 13824 —
CLBs 13824 —
Maximum User I/O 270 —
Embedded SRAM 110592 bits (True Dual-Port) —
Maximum System Frequency 231 MHz 231 MHz
Technology 130 nm, 7-layer metal (6 copper), flash-based CMOS —
Core Voltage 1.2 V to 1.5 V —
Supply Voltage Range 1.14 V to 1.575 V (nominal 1.5 V) —
Configuration Live-at-power-up flash fabric, single-chip (no external boot device) —
Temperatura de operação [DATA_NEEDED: operating temperature range] —
Encapsulamento 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm ball pitch 484-Pin FBGA (FGG484)
Tipo de montagem Surface Mount Surface Mount
Packaging Tray (M suffix) —
Status RoHS [DATA_NEEDED: RoHS status] Lead Free
Distributor Stock Reference 4480 pieces (Heisener listing) —
Process Technology — 130 nm CMOS
Core Supply Voltage — 1.5 V
User I/O Count — 235
Configuration Memory — Flash-based (non-volatile, single chip)
Terminal Form — Ball
Package Shape — Square BGA
Temperature Grade — Commercial
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]
Operating Temperature Minimum — 0 C
Operating Temperature Maximum — [DATA_NEEDED: maximum operating temperature]
Number of Logic Elements (LEs) — [DATA_NEEDED: logic element count]
Embedded Memory — [DATA_NEEDED: embedded SRAM capacity]

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