A3PE600-FG484M vs A3P600-FGG484 对比
详细并排对比 A3PE600-FG484M 出自 Microchip Technology 和 A3P600-FGG484 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
A3PE600-FG484M - 600K-Gate ProASIC3E Flash FPGA | Microchip
A3PE600-FG484M ✓ 量产中规格对比
| 参数 | A3PE600-FG484M | A3P600-FGG484 |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $68.90 | $44.75 |
| Family | ProASIC3E (Flash-Based FPGA) | ProASIC3 |
| System Gates | 600000 | 600K |
| Logic Elements / Cells | 13824 | — |
| CLBs | 13824 | — |
| Maximum User I/O | 270 | — |
| Embedded SRAM | 110592 bits (True Dual-Port) | — |
| Maximum System Frequency | 231 MHz | 231 MHz |
| Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Supply Voltage Range | 1.14 V to 1.575 V (nominal 1.5 V) | — |
| Configuration | Live-at-power-up flash fabric, single-chip (no external boot device) | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | — |
| 封装 | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm ball pitch | 484-Pin FBGA (FGG484) |
| 安装类型 | Surface Mount | Surface Mount |
| Packaging | Tray (M suffix) | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Lead Free |
| Distributor Stock Reference | 4480 pieces (Heisener listing) | — |
| Process Technology | — | 130 nm CMOS |
| Core Supply Voltage | — | 1.5 V |
| User I/O Count | — | 235 |
| Configuration Memory | — | Flash-based (non-volatile, single chip) |
| Terminal Form | — | Ball |
| Package Shape | — | Square BGA |
| Temperature Grade | — | Commercial |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Operating Temperature Minimum | — | 0 C |
| Operating Temperature Maximum | — | [DATA_NEEDED: maximum operating temperature] |
| Number of Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM capacity] |