AFS600-FGG484 vs A3PE600-FGG484 Comparação

Comparação detalhada lado a lado de AFS600-FGG484 por Microchip Technology e A3PE600-FGG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
AFS600-FGG484 AFS600-FGG484 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG484 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG484 ✓ Ativo
Microchip Technology
A3PE600-FGG484 A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip

A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip

A3PE600-FGG484 ✓ Ativo

Comparação de especificações

Parâmetro AFS600-FGG484 A3PE600-FGG484
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $0,00 $53,70
Device Type Fusion mixed-signal FPGA —
System Gates 600000 gates 600000
Maximum Frequency 1098.9 MHz —
Technology 130 nm —
Metal Layers 7 layers —
Process Flash-based CMOS —
Tensão de alimentação 1.5 V —
I/O Count 172 I/O —
Temperatura de operação 0 C to 70 C —
Encapsulamento 484-pin FBGA; one verified source alternatively labels BGA-256 FBGA-484 (PBGA484)
Configuration Retention Nonvolatile flash —
Power-Up Feature Live at Power-Up (LAPU) —
Architecture Monolithic mixed-signal FPGA —
Programmable Logic High-performance flash-based programmable logic —
Analog Resources Configurable analog resources —
Flash Memory Large flash-memory blocks —
Clocking Comprehensive clock generation and management circuitry —
Processor Support Optional ARM support —
Tipo de montagem Surface mount —
Status do ciclo de vida [DATA_NEEDED: current lifecycle status] —
RoHS Compliance [DATA_NEEDED: RoHS compliance status] —
REACH Compliance [DATA_NEEDED: REACH compliance status] —
Family — ProASIC3E
Configurable Logic Blocks (CLBs) — 13824
Logic Cells — 13824
Embedded RAM — 110592 bits
User I/O — 270
Maximum System Frequency — 350 MHz
Supply Voltage (Core) — 1.425 V to 1.575 V
Process Technology — 130 nm CMOS flash
Configuration Memory — On-chip flash (non-volatile, live at power-up)
Package Dimensions — 23 x 23 mm, 2.23 mm height, 1 mm pitch
Terminal Type — Ball (BGA)
Estilo de montagem — Surface Mount
Temperature Grading — Commercial
Status RoHS — Green / [DATA_NEEDED: RoHS compliance detail]
Number of Pins / Balls — 484

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