DSP56321VL220 vs DSP56303VF100 Comparação

Comparação detalhada lado a lado de DSP56321VL220 por NXP Semiconductors e DSP56303VF100 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
DSP56303VF100 DSP56303VF100 - 24-Bit 100MHz/100MIPS DSP | NXP | BGA-196

DSP56303VF100 - 24-Bit 100MHz/100MIPS DSP | NXP | BGA-196

DSP56303VF100 Obsolete

Comparação de especificações

Parâmetro DSP56321VL220 DSP56303VF100
Marca NXP Semiconductors NXP Semiconductors
Categoria DSP DSP
Status do ciclo de vida NRND Obsolete
Status do estoque In Stock In Stock
Preço unitário (USD) $23,90 $30,10
Core Architecture DSP56300 family, 24-bit fixed-point DSP56300 family, 24-bit fixed-point
Core Clock Frequency 220 MHz —
Instruction Throughput 220 MIPS —
Internal Core Voltage 1.8 V —
I/O Voltage 3.3 V 3.30 V
Program Address Space 16M x 24-bit words —
Data Address Space (X/Y) 16M x 24-bit words (each) —
On-chip Program RAM [DATA_NEEDED: program RAM size in words] —
On-chip Data RAM [DATA_NEEDED: X/Y data RAM size in words] —
DMA Channels 6 —
Instruction Cache Yes (configurable) —
Host Interface Serial Host Interface (SHI) + Host Port —
Audio Interface Enhanced Serial Audio Interface (ESAI) —
Communication Interface Serial Communication Interface (SCI) —
Timers Triple Timer module —
Bootstrap ROM Yes (flashless boot) 576 bytes
Encapsulamento 196-ball MAPBGA (15 x 15 mm) 196-ball LBGA (15x15 mm), MAP-BGA-196
Tipo de montagem Surface Mount (BGA) Surface Mount
Temperatura de operação [DATA_NEEDED: operating temperature range] [DATA_NEEDED: industrial temperature grade]
Lead Free / RoHS Lead-free (PBFREE), RoHS compliant —
Clock Frequency — 100 MHz
Performance — 100 MIPS (million instructions per second)
Instruction Cycle — Single clock cycle per instruction
Data Word Width — 24 bits
Address Space — 24-bit program and data
On-Chip RAM — 24 KB
Core Voltage — [DATA_NEEDED: internal core Vdd]
Interfaces — Host Interface (HI08), ESSI, SCI
On-Chip Peripherals — Triple Timer, PLL, External Memory Expansion port
Debug — JTAG/OnCE
Packaging — Tray
Status RoHS — [DATA_NEEDED: RoHS compliance per datasheet]
Nível MSL — [DATA_NEEDED: moisture sensitivity level]

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