EP1K30TI144-2N vs EP1K30TI144-3N Comparação
Comparação detalhada lado a lado de EP1K30TI144-2N por Intel e EP1K30TI144-3N por Altera. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP1K30TI144-2N | EP1K30TI144-3N |
|---|---|---|
| Marca | Intel | Altera |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $25,00 | $21,80 |
| Series | ACEX-1K | EP1K30 |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements / Cells | 1728 | — |
| Typical Gate Count | 30,000 gates | — |
| Embedded Memory (RAM bits) | 24,576 bits | — |
| Maximum User I/O | 102 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Number of Embedded Array Blocks (EABs) | [DATA_NEEDED: EAB count] | — |
| Core Voltage (VCCINT) | 2.5 V | — |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V | — |
| Process Technology | 0.22 µm CMOS SRAM | 0.18 um CMOS, 4 metal layers |
| Speed Grade | -2 | -3 (fastest in EP1K30 family) |
| Operating Temperature Grade | Industrial | — |
| Faixa de temperatura de operação | -40 °C to +100 °C ambient | — |
| Encapsulamento | 144-pin LQFP | TQFP-144 (0.5 mm pitch) |
| Lead Pitch | 0.5 mm | — |
| Tipo de montagem | Surface Mount | Surface Mount (Gull-Wing) |
| Configuration Interface | JTAG (IEEE 1149.1), serial passive/active | — |
| Status RoHS | Compliant (per Utmel product note) | [DATA_NEEDED: RoHS status] |
| Nível MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | ACEX 1K |
| Logic Elements | — | 1,728 |
| Typical Gates | — | 30,000 |
| Usable Gates | — | 17,500 |
| Embedded Memory (EAB) | — | 24 Kbit (6 EABs of 4 Kbit each) |
| Maximum User I/O Pins | — | 102 |
| Dedicated Input Pins | — | 6 |
| Total Terminals | — | 144 |
| Core Supply Voltage | — | 2.5 V nominal (2.375 V min, 2.625 V max) |
| Temperatura de operação | — | -40C to +85C (Industrial) |
| Configuration Modes | — | Passive Serial, Passive Parallel Async, Passive Parallel Sync, JTAG (IEEE 1149.1) |
| PLLs | — | 4 |
| Thermal Resistance (theta_JA) | — | Approximately 35-40 C/W (PCB-dependent) |