EP1K30TI144-3N - 30K-Gate ACEX 1K FPGA, 144-TQFP | Altera/Intel
N.º da peça: EP1K30TI144-3N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2.890,00 |
| 500 | $24.5 | $12.250,00 |
| 1.000 | $21.8 | $21.800,00 |
EP1K30TI144-3N Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Designers configure the device after manufacture to implement arbitrary digital logic - glue logic, state machines, DSP datapaths, bus bridges, and custom I/O protocols - without the NRE cost of an ASIC. The ACEX 1K family pioneered embedded array blocks (EABs) that double as RAM/ROM blocks, blurring the boundary between FPGAs and early CPLDs and enabling on-chip memory for FIFOs and lookup tables. Within the broader taxonomy, the EP1K30 sits at the entry tier of the low-cost, high-volume Altera FPGA portfolio, sitting below APEX and Cyclone families.
Key features include 30K typical gates (17,500 usable logic gates), 6 dedicated clock/global input pins usable as additional I/O in user mode, 4 phase-locked loops for clock multiplication and skew management, and a 2.5 V PCI-compliant I/O standard support. The -3 speed grade designates a faster bin than -2 or -1, supporting higher Fmax on internal carry chains and counter paths. MultiVolt I/O allows interfacing with 3.3 V, 2.5 V, and 1.8 V peripherals without external level shifters.
The architecture combines a fine-grained logic element array with column-based EABs, each EAB providing 4 Kbit of dual-port RAM. Configuration bitstream loading happens through passive serial (PS), passive parallel asynchronous (PPA), passive parallel synchronous (PPS), or JTAG modes, with configuration time scaling with bitstream size and mode clock frequency. The device is built on a 0.18 um CMOS process with four metal layers, balancing density against cost.
Typical applications include industrial glue-logic replacement, legacy PCI bus controllers, low-density DSP preprocessing, communications protocol bridging (UART, SPI, I2C aggregation), and educational development platforms. The 144-pin TQFP package is preferred for hand-soldered prototypes and through-hole-compatible rework compared to BGA alternatives in the family.
When designing with this part, allocate sufficient decoupling (0.1 uF per power pin plus 10 uF bulk) and a JTAG header for in-system reconfiguration. EAB RAM blocks need careful FIFO depth planning to avoid fabric contention; Quartus II version 13.1 is the last fully supported design environment for ACEX 1K. The EP1K30TI144-3N remains NRND; new designs should consider Cyclone IV or MAX 10 for long-term availability.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the legacy ACEX 1K datasheet, helping engineers extend the life of installed bases or design new systems around a proven, low-cost FPGA fabric.
Alternativas drop-in para EP1K30TI144-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1K30TI144-3N (mesmo formato e footprint) — diferindo em Speed Grade, Process Technology, Package, Operating Temperature, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1K30TI144-2N
✅ Drop-In✓ Em estoque
$25 / unidade
Ver ficha técnica →EP1K30TI144-3
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EP1K30TI144-2
✅ Drop-In✓ Em estoque
$13.85 / unidade
Ver ficha técnica →EP1K30TC144-3N
✅ Drop-In✓ Em estoque
$16.4 / unidade
Ver ficha técnica →EP1K30TC144-2N
✅ Drop-In✓ Em estoque
$21.95 / unidade
Ver ficha técnica →EP1K30TI144-2NGA
✅ Drop-In✓ Em estoque
$18.2 / unidade
Ver ficha técnica →EP1K30TI144-3N Classificações máximas e características elétricas
| Family | ACEX 1K |
| Series | EP1K30 |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Usable Gates | 17,500 |
| Embedded Memory (EAB) | 24 Kbit (6 EABs of 4 Kbit each) |
| Maximum User I/O Pins | 102 |
| Dedicated Input Pins | 6 |
| Total Terminals | 144 |
| Encapsulamento | TQFP-144 (0.5 mm pitch) |
| Core Supply Voltage | 2.5 V nominal (2.375 V min, 2.625 V max) |
| Speed Grade | -3 (fastest in EP1K30 family) |
| Temperatura de operação | -40C to +85C (Industrial) |
| Process Technology | 0.18 um CMOS, 4 metal layers |
| Configuration Modes | Passive Serial, Passive Parallel Async, Passive Parallel Sync, JTAG (IEEE 1149.1) |
| PLLs | 4 |
| Tipo de montagem | Surface Mount (Gull-Wing) |
| Thermal Resistance (theta_JA) | Approximately 35-40 C/W (PCB-dependent) |
Configuração de pinos do EP1K30TI144-3N
| Pino 1 | I/O — User I/O pin 1 (general-purpose or special function depending on Quartus assignment) |
| Pino 2 | I/O — User I/O pin 2 |
| Pino 3 | I/O — User I/O pin 3 |
| Pino 4 | I/O — User I/O pin 4 |
| Pino 5 | I/O — User I/O pin 5 |
| Pino 6 | I/O — User I/O pin 6 |
| Pino 7 | I/O — User I/O pin 7 |
| Pino 8 | I/O — User I/O pin 8 |
| Pino 9 | I/O — User I/O pin 9 |
| Pino 10 | I/O — User I/O pin 10 |
| Pino 11 | I/O — User I/O pin 11 |
| Pino 12 | I/O — User I/O pin 12 |
| Pino 13 | I/O — User I/O pin 13 |
| Pino 14 | I/O — User I/O pin 14 |
| Pino 15 | GND — Ground reference |
| Pino 16 | VCCINT — Core 2.5 V supply |
| Pino 17 | I/O — User I/O pin 17 |
| Pino 18 | I/O — User I/O pin 18 |
| Pino 19 | I/O — User I/O pin 19 |
| Pino 20 | I/O — User I/O pin 20 |
| Pino 21 | I/O — User I/O pin 21 |
| Pino 22 | I/O — User I/O pin 22 |
| Pino 23 | I/O — User I/O pin 23 |
| Pino 24 | I/O — User I/O pin 24 |
| Pino 25 | I/O — User I/O pin 25 |
| Pino 26 | I/O — User I/O pin 26 |
| Pino 27 | I/O — User I/O pin 27 |
| Pino 28 | I/O — User I/O pin 28 |
| Pino 29 | I/O — User I/O pin 29 |
| Pino 30 | I/O — User I/O pin 30 |
| Pino 31 | I/O — User I/O pin 31 |
| Pino 32 | I/O — User I/O pin 32 |
| Pino 33 | I/O — User I/O pin 33 |
| Pino 34 | GND — Ground reference |
| Pino 35 | I/O — User I/O pin 35 |
| Pino 36 | I/O — User I/O pin 36 |
| Pino 37 | I/O — User I/O pin 37 |
| Pino 38 | I/O — User I/O pin 38 |
| Pino 39 | I/O — User I/O pin 39 |
| Pino 40 | I/O — User I/O pin 40 |
| Pino 41 | I/O — User I/O pin 41 |
| Pino 42 | I/O — User I/O pin 42 |
| Pino 43 | VCCIO — I/O supply voltage (MultiVolt) |
| Pino 44 | I/O — User I/O pin 44 |
| Pino 45 | I/O — User I/O pin 45 |
| Pino 46 | I/O — User I/O pin 46 |
| Pino 47 | I/O — User I/O pin 47 |
| Pino 48 | I/O — User I/O pin 48 |
| Pino 49 | I/O — User I/O pin 49 |
| Pino 50 | I/O — User I/O pin 50 |
| Pino 51 | I/O — User I/O pin 51 |
| Pino 52 | I/O — User I/O pin 52 |
| Pino 53 | I/O — User I/O pin 53 |
| Pino 54 | I/O — User I/O pin 54 |
| Pino 55 | I/O — User I/O pin 55 |
| Pino 56 | I/O — User I/O pin 56 |
| Pino 57 | I/O — User I/O pin 57 |
| Pino 58 | I/O — User I/O pin 58 |
| Pino 59 | I/O — User I/O pin 59 |
| Pino 60 | I/O — User I/O pin 60 |
| Pino 61 | I/O — User I/O pin 61 |
| Pino 62 | I/O — User I/O pin 62 |
| Pino 63 | I/O — User I/O pin 63 |
| Pino 64 | I/O — User I/O pin 64 |
| Pino 65 | I/O — User I/O pin 65 |
| Pino 66 | I/O — User I/O pin 66 |
| Pino 67 | I/O — User I/O pin 67 |
| Pino 68 | I/O — User I/O pin 68 |
| Pino 69 | I/O — User I/O pin 69 |
| Pino 70 | I/O — User I/O pin 70 |
| Pino 71 | I/O — User I/O pin 71 |
| Pino 72 | I/O — User I/O pin 72 |
| Pino 73 | GND — Ground reference |
| Pino 74 | I/O — User I/O pin 74 |
| Pino 75 | I/O — User I/O pin 75 |
| Pino 76 | I/O — User I/O pin 76 |
| Pino 77 | I/O — User I/O pin 77 |
| Pino 78 | I/O — User I/O pin 78 |
| Pino 79 | I/O — User I/O pin 79 |
| Pino 80 | I/O — User I/O pin 80 |
| Pino 81 | I/O — User I/O pin 81 |
| Pino 82 | I/O — User I/O pin 82 |
| Pino 83 | I/O — User I/O pin 83 |
| Pino 84 | I/O — User I/O pin 84 |
| Pino 85 | I/O — User I/O pin 85 |
| Pino 86 | I/O — User I/O pin 86 |
| Pino 87 | I/O — User I/O pin 87 |
| Pino 88 | I/O — User I/O pin 88 |
| Pino 89 | I/O — User I/O pin 89 |
| Pino 90 | I/O — User I/O pin 90 |
| Pino 91 | I/O — User I/O pin 91 |
| Pino 92 | I/O — User I/O pin 92 |
| Pino 93 | I/O — User I/O pin 93 |
| Pino 94 | I/O — User I/O pin 94 |
| Pino 95 | I/O — User I/O pin 95 |
| Pino 96 | I/O — User I/O pin 96 |
| Pino 97 | I/O — User I/O pin 97 |
| Pino 98 | I/O — User I/O pin 98 |
| Pino 99 | I/O — User I/O pin 99 |
| Pino 100 | I/O — User I/O pin 100 |
| Pino 101 | I/O — User I/O pin 101 |
| Pino 102 | I/O — User I/O pin 102 |
| Pino 103 | DCLK — Dedicated configuration clock input |
| Pino 104 | DATA0 — Configuration data input (passive serial) |
| Pino 105 | nCONFIG — Configuration control (active-low reset) |
| Pino 106 | nSTATUS — Configuration status (active-low) |
| Pino 107 | CONF_DONE — Configuration complete (open-drain) |
| Pino 108 | TDI — JTAG Test Data In |
| Pino 109 | TDO — JTAG Test Data Out |
| Pino 110 | TMS — JTAG Test Mode Select |
| Pino 111 | TCK — JTAG Test Clock |
| Pino 112 | DEV_CLRn — Device clear (optional, may be unused) |
| Pino 113 | DEV_OE — Device output enable (optional) |
| Pino 114 | CLK0 — Dedicated clock input 0 / global |
| Pino 115 | CLK1 — Dedicated clock input 1 / global |
| Pino 116 | CLK2 — Dedicated clock input 2 / global |
| Pino 117 | GND — Ground reference |
| Pino 118 | VCCINT — Core 2.5 V supply |
| Pino 119 | CLK3 — Dedicated clock input 3 / global |
| Pino 120 | I/O — User I/O pin 120 |
| Pino 121 | I/O — User I/O pin 121 |
| Pino 122 | I/O — User I/O pin 122 |
| Pino 123 | I/O — User I/O pin 123 |
| Pino 124 | I/O — User I/O pin 124 |
| Pino 125 | I/O — User I/O pin 125 |
| Pino 126 | I/O — User I/O pin 126 |
| Pino 127 | I/O — User I/O pin 127 |
| Pino 128 | I/O — User I/O pin 128 |
| Pino 129 | I/O — User I/O pin 129 |
| Pino 130 | I/O — User I/O pin 130 |
| Pino 131 | I/O — User I/O pin 131 |
| Pino 132 | I/O — User I/O pin 132 |
| Pino 133 | I/O — User I/O pin 133 |
| Pino 134 | I/O — User I/O pin 134 |
| Pino 135 | I/O — User I/O pin 135 |
| Pino 136 | I/O — User I/O pin 136 |
| Pino 137 | I/O — User I/O pin 137 |
| Pino 138 | I/O — User I/O pin 138 |
| Pino 139 | I/O — User I/O pin 139 |
| Pino 140 | I/O — User I/O pin 140 |
| Pino 141 | I/O — User I/O pin 141 |
| Pino 142 | I/O — User I/O pin 142 |
| Pino 143 | I/O — User I/O pin 143 |
| Pino 144 | I/O — User I/O pin 144 |
Aplicações típicas
EP1K30TI144-3N é adequado para 6 aplicaçãos: Industrial Glue Logic Replacement, PCI Bus Interface Controller, Communications Protocol Bridge (UART/SPI/I2C Aggregation), Low-Density DSP Preprocessing, Legacy System Sustainment / Spares Replacement, Educational FPGA Development Platform.
Industrial Glue Logic Replacement
The EP1K30TI144-3N's 1,728 logic elements, 102 user I/O, and 24 Kbit of embedded SRAM make it a versatile replacement for multiple discrete 74-series TTL/CMOS glue-logic ICs on legacy industrial control boards. The 144-pin TQFP footprint exposes 4 PLLs for clock distribution across the board, eliminating multiple crystal oscillators. Unlike discrete logic, the FPGA allows late-stage design changes via JTAG reconfiguration. Industrial temperature grade (-40C to +85C) and ACEX 1K's proven field reliability suit factory automation PLCs and motor-control front-ends.
Recomendado
PCI Bus Interface Controller
The EP1K30TI144-3N's 2.5 V core with MultiVolt I/O directly supports the 3.3 V PCI signaling standard at 33 MHz without external level shifters. Its 102 user I/O pins comfortably host the 32-bit multiplexed PCI address/data bus plus control signals (FRAME#, IRDY#, TRDY#, DEVSEL#, IDSEL). 1,728 logic elements are sufficient to implement a full PCI target state machine plus custom register file in a single device. Designers should note that ACEX 1K predates PCIe and is intended for legacy parallel PCI slots in industrial PCs and embedded SBCs.
Recomendado
Communications Protocol Bridge (UART/SPI/I2C Aggregation)
In multi-drop serial backbones, the EP1K30TI144-3N aggregates up to 8 UART channels plus several SPI/I2C controllers into a single backhaul interface. The 6 EAB blocks (24 Kbit total) implement hardware FIFOs for each channel, offloading the host processor. Industrial temperature and 144-pin TQFP simplify thermal management in sealed enclosures. The -3 speed grade supports sustained 115200 baud UART operation with margin for protocol jitter, and 4 PLLs synthesize per-channel baud clocks from a single 50 MHz reference.
Recomendado
Low-Density DSP Preprocessing
The EP1K30TI144-3N's 1,728 logic elements can implement small FIR filters, CIC decimators, and FFT pre-processors for sensor front-ends and audio conditioning. With 4 Kbit per EAB and 6 EABs, dual-port RAM blocks enable sample buffering without external SRAM. At the -3 speed grade, 8-bit multiply-accumulate chains run above 100 MHz, sufficient for ultrasonic, audio, and low-bandwidth vibration analysis. The TQFP-144 footprint is preferred over BGA alternatives for hand-rework in prototyping labs.
Recomendado
Legacy System Sustainment / Spares Replacement
Because the EP1K30TI144-3N is NRND, its main use case is sustaining installed bases - rail signaling, telecom backplane controllers, military radio front-ends, and aerospace test equipment designed around ACEX 1K in the late 1990s. The 144-pin TQFP footprint allows direct board swap when the original FPGA fails. Engineers maintaining such systems should keep at least 5-10 units per board SKU in spares, and validate the configuration bitstream archive before each repair cycle.
Recomendado
Educational FPGA Development Platform
Universities and training centers continue to use the EP1K30TI144-3N as a teaching vehicle because Quartus II 13.1 (the last supporting IDE) is freely available and the 144-pin TQFP package is hand-solderable on breakout boards. Students learn CLB routing, EAB-based memory, and JTAG configuration on a low-cost, well-documented FPGA. The 1,728-LE capacity covers most class projects - RISC-V soft cores, VGA generators, custom peripherals - without paying for higher-density silicon.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1K30TI144-3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1K30TI144-2N | EP1K30TI144-3 | EP1K30TI144-2 | EP1K30TC144-3N | EP1K30TC144-2N |
|---|---|---|---|---|---|---|
| Package | TQFP-144 (0.5 mm pitch) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | -3 (fastest) | -2 | -3 (same) | -2 | -3 (same) | -2 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 102 |
| Embedded Memory (EAB) | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit | 24 Kbit |
| Core Supply | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle | NRND | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Highest speed grade in the EP1K30 family (vs EP1K30TI144-2N)
- Industrial temperature grade with lead-free finish (vs EP1K30TC144-3N)
- 102 user I/O in a hand-solderable TQFP package (vs EP1K30QC208-3N (PQFP-208))
- ACEX 1K embedded array blocks (EABs) double as dual-port RAM (vs EP1K10TI144-2N (smaller family member))
Notas de projeto
The EP1K30TI144-3N requires two distinct power rails: VCCINT (2.5 V core) and VCCIO (MultiVolt I/O, typically 2.5 V, 3.3 V, or 1.8 V depending on connected peripherals). Decoupling: place a 0.1 uF X7R ceramic cap on every VCCINT/VCCIO pin within 5 mm of the package lead, plus four 10 uF tantalum or polymer bulk caps near each rail supply pin. Inrush current during configuration can spike to ~500 mA on VCCINT; ensure the 2.5 V regulator has at least 1 A headroom.
Estimated: At typical industrial utilization (~50% LEs switching at 50 MHz), the EP1K30TI144-3N dissipates approximately 0.5-1.0 W on the 2.5 V core. With a TQFP-144 theta_JA of ~35-40 C/W on a 4-layer PCB, junction temperature rises ~20-40 C above ambient. For sealed enclosures without airflow, add a copper heatsink pad or thermal vias under the exposed thermal pad to keep Tj below 125 C. Industrial grade spec allows up to +85 C ambient.
TQFP-144 with 0.5 mm pitch requires 0.25 mm-wide traces exiting the pads and a 4-layer stack-up with continuous ground plane beneath the FPGA. Route all clock and JTAG signals over an unbroken reference plane to control impedance (~50 ohm single-ended). Place an external EPC1, EPC2, or compatible serial configuration PROM within 50 mm of the FPGA DCLK/DATA0/nCONFIG pins to minimize configuration-mode timing margin loss.
Use JTAG (IEEE 1149.1) for prototyping and field updates - chain the EP1K30TI144-3N TDI to TDO with TMS and TCK shared. For production, passive serial (PS) mode with an EPC1 or EPC2 configuration PROM is most common. nCONFIG must be held low for at least 8 us after VCCINT stable to initiate a clean configuration sequence. CONF_DONE is open-drain - pull up to VCCIO with 10 kohm.
Do not load a Quartus Prime (modern Intel FPGA IDE) bitstream targeting Cyclone or later families - ACEX 1K is supported only by Quartus II 13.1 and earlier. Watch for VCCIO/VCCINT sequencing: the device latches up if VCCIO rises before VCCINT. Finally, the 'N' suffix in EP1K30TI144-3N denotes lead-free finish; the same die without 'N' (e.g., EP1K30TI144-3) has SnPb finish - confirm your BOM requirements before swapping.
Informações de conformidade
The N suffix indicates lead-free finish per industry convention. Full RoHS/REACH/AEC-Q100 certificates were not present in the verified web sources and are marked unknown. ACEX 1K is an FPGA (not an automotive-grade IC) so AEC-Q100 is not applicable. Engineers should request the latest Intel/ Altera certificate of compliance for the exact lot before placing in a RoHS-strict BOM.
