EP1S20F672I7 vs EP1S20F672C7N Comparação
Comparação detalhada lado a lado de EP1S20F672I7 por Intel e EP1S20F672C7N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Intel
EP1S20F672I7 - Stratix FPGA, 18,460 LEs, 672-BGA | Intel / Altera
EP1S20F672I7 ⚠ Última compraComparação de especificações
| Parâmetro | EP1S20F672I7 | EP1S20F672C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Última compra | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $199,50 | $109,20 |
| Family | Stratix (first generation) | Stratix |
| Logic Elements (LEs) | 18,460 | 18,460 |
| Maximum RAM Bits | 1,669,248 | — |
| DSP Blocks | [DATA_NEEDED: exact DSP block count] | 56 (dedicated 18x18 multipliers) |
| Maximum User I/Os | 426 | — |
| Supply Voltage (VCCINT core) | 1.5 V | — |
| Logic Family | CMOS | — |
| Encapsulamento | 672-BBGA (FineLine BGA), 35 x 35 mm, 1.27 mm pitch | 672-FBGA (FineLine BGA) |
| Temperatura de operação | -40C to +85C (industrial grade, I7 suffix) | 0°C to +85°C (commercial) |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG | PS, PPS, FPP, JTAG |
| Number of Pins / Balls | 672 | — |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount |
| Clock Management PLLs | [DATA_NEEDED: PLL count] | — |
| Status RoHS | unknown | — |
| Lead-Free / Finish | SnPb (e0 per Partstack datasheet extract) | — |
| Nível MSL | unknown | [DATA_NEEDED: moisture sensitivity level] |
| Status | Last Time Buy (per distributor notices) | — |
| Series | — | Stratix (first generation) |
| Logic Cells | — | 18,460 |
| Configurable Logic Blocks (CLBs) | — | 2,132 |
| Embedded Memory (TriMatrix) | — | 1,669,248 bits (426 Kbit total) |
| Maximum User I/O | — | 586 |
| I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| PLLs | — | Up to 12 |
| Maximum Operating Frequency | — | 420.17 MHz |
| Core Voltage | — | 1.5 V |
| Process Technology | — | 130 nm CMOS |
| Package Body Size | — | 35 mm x 35 mm |
| Ball Pitch | — | 1.27 mm |
| Speed Grade | — | C7 (-7) |
| Lead-Free / RoHS | — | Yes (lead-free finish, RoHS compliant) |