EP2AGX190FF35I5 vs EP2AGX190FF35I3G Comparação

Comparação detalhada lado a lado de EP2AGX190FF35I5 por Intel e EP2AGX190FF35I3G por Altera. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Altera
EP2AGX190FF35I3G EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera

EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera

EP2AGX190FF35I3G ⚠ Última compra

Comparação de especificações

Parâmetro EP2AGX190FF35I5 EP2AGX190FF35I3G
Marca Intel Altera
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Última compra
Status do estoque In Stock In Stock
Preço unitário (USD) $1.700,00 $1.840,00
Family Arria II GX Arria II GX
Logic Elements (LE) 181165 181,165
Embedded Memory Bits 10177536 —
User I/O Count 612 —
Process Technology 40 nm —
Core Voltage 0.9 V 0.9 V
Encapsulamento 1152-ball FC-FBGA (Flip-Chip BGA) 1152-ball FC-FBGA (FF35), 35 mm body
Speed Grade 5 (slowest in family, lower power) 3
Operating Temperature Grade Industrial (-40 C to +100 C ambient) —
Maximum User Frequency 500 MHz —
DSP Blocks [DATA_NEEDED: DSP block count and 18x18 multiplier count] —
Transceiver Count [DATA_NEEDED: number of multi-gigabit transceivers] —
Transceiver Data Rate [DATA_NEEDED: max Gbps per channel] —
PCIe Hard IP PCIe Gen1/Gen2 hard IP blocks (per family feature) —
Configuration Memory SRAM-based, supports EPCS serial Flash loaders —
Tipo de montagem Surface Mount (BGA, reflow soldering required) Surface Mount (flip-chip BGA)
Status RoHS Compliant (per Intel product page) Compliant (suffix G)
Lead-Free Yes (per Intel product page) Yes
Nível MSL [DATA_NEEDED: Moisture Sensitivity Level] —
Adaptive Logic Modules (ALM) — [DATA_NEEDED: ALM count]
User I/O Pins — 612
Embedded Memory (bits) — 10,177,536
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Transceivers — 8 high-speed transceiver channels (multi-gigabit)
Embedded Multipliers — [DATA_NEEDED: 18x18 multiplier count]
PLLs — [DATA_NEEDED: PLL count]
I/O Voltage Standards — 1.2 V to 3.3 V (LVTTL, LVCMOS, LVDS, HSTL, SSTL)
Process Node — 40 nm
Temperatura de operação — -40 °C to +100 °C (industrial, suffix I)
Ball Pitch — [DATA_NEEDED: 1.0 mm (typical for FF35)]
Programming Toolchain — Quartus II / Quartus Prime

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