EP2AGX190FF35I5N vs EP2AGX190FF35I3G Comparação
Comparação detalhada lado a lado de EP2AGX190FF35I5N por Intel e EP2AGX190FF35I3G por Altera. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Altera
EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera
EP2AGX190FF35I3G ⚠ Última compraComparação de especificações
| Parâmetro | EP2AGX190FF35I5N | EP2AGX190FF35I3G |
|---|---|---|
| Marca | Intel | Altera |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Última compra |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $1.605,00 | $1.840,00 |
| Device Family | Arria II GX | — |
| Logic Elements | 181165 | — |
| Adaptive Logic Modules (ALMs) | 7612 | — |
| User I/Os | 612 | — |
| Embedded Memory (Kbits) | 10177.536 | — |
| Number of Transceivers | Up to 16 | — |
| Transceiver Data Rate | Up to 3.75 Gbps | — |
| Core Supply Voltage | 0.9 V | — |
| Process Technology | 40 nm | — |
| Package Type | 1152-ball FC-FBGA (FF35) | — |
| Temperatura de operação | -40C to +100C (Industrial) | -40 °C to +100 °C (industrial, suffix I) |
| Pin/Pitch Configuration | [DATA_NEEDED: ball pitch and pin map] | — |
| Hard Memory Controllers | Yes | — |
| Hard PCI Express Blocks | Yes (Gen1) | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: count] | — |
| PLLs | Up to 8 | [DATA_NEEDED: PLL count] |
| Status RoHS | Compliant | Compliant (suffix G) |
| Family | — | Arria II GX |
| Logic Elements (LE) | — | 181,165 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| User I/O Pins | — | 612 |
| Embedded Memory (bits) | — | 10,177,536 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Transceivers | — | 8 high-speed transceiver channels (multi-gigabit) |
| Embedded Multipliers | — | [DATA_NEEDED: 18x18 multiplier count] |
| Core Voltage | — | 0.9 V |
| I/O Voltage Standards | — | 1.2 V to 3.3 V (LVTTL, LVCMOS, LVDS, HSTL, SSTL) |
| Process Node | — | 40 nm |
| Speed Grade | — | 3 |
| Encapsulamento | — | 1152-ball FC-FBGA (FF35), 35 mm body |
| Ball Pitch | — | [DATA_NEEDED: 1.0 mm (typical for FF35)] |
| Tipo de montagem | — | Surface Mount (flip-chip BGA) |
| Lead-Free | — | Yes |
| Programming Toolchain | — | Quartus II / Quartus Prime |