EP2C15AF256I8N vs EP2C20F256C7N Comparação
Comparação detalhada lado a lado de EP2C15AF256I8N por Altera e EP2C20F256C7N por Altera. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP2C15AF256I8N | EP2C20F256C7N |
|---|---|---|
| Marca | Altera | Altera |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Última compra |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $17,26 | $38,50 |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Series / Family | Cyclone II (EP2C15) | — |
| Number of Logic Elements / Cells | 14448 | — |
| Total RAM Bits | 239616 | 239616 |
| Number of User I/O | 152 | — |
| Number of LABs / CLBs | [DATA_NEEDED: Number of LABs/CLBs; commonly 903 for 14448 LEs, not provided in verified data] | — |
| Encapsulamento / Caixa | FBGA-256 / 256-LBGA | — |
| Package Code | LBGA | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Number of Pins / Terminals | 256 | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage / Power Supplies | 1.2 V core; 1.5 V/3.3 V and 3.3 V I/O support per Vyrian listing | — |
| Faixa de temperatura de operação | -40°C to +100°C (industrial I8 grade; chipdig listing of 0°C to 85°C conflicts and is noted in validation) | — |
| Temperature Grade | Industrial (I) | — |
| Speed Grade | 8 (I8 ordering code) | — |
| Product Category | FPGA - Field Programmable Gate Array | — |
| Status RoHS | Compliant (N suffix, lead-free) | Compliant |
| Series | — | Cyclone II |
| Family | — | FPGA Cyclone II |
| Number of Logic Elements (LEs) | — | 18752 |
| Number of LABs/CLBs | — | 1172 |
| Maximum User I/O Pins | — | 152 |
| Number of Embedded Multipliers (18x18) | — | 52 |
| Number of PLLs | — | 4 |
| Core Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 402.58 MHz |
| Process Technology | — | 90 nm CMOS |
| Encapsulamento | — | 256-LBGA (FineLine BGA) 17x17 mm |
| Temperatura de operação | — | 0C to +85C (Commercial) |
| Nível MSL | — | 3 (168 hours) |
| Configuration Method | — | SRAM-based (AS, PS, JTAG) |