EPF10K200EBC600-2 vs EPF10K200SBC600-1 Comparação
Comparação detalhada lado a lado de EPF10K200EBC600-2 por Intel e EPF10K200SBC600-1 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Intel
EPF10K200SBC600-1 - 200K Gate FLEX-10KS FPGA, 470 I/O | Intel / Altera
EPF10K200SBC600-1 ObsoleteComparação de especificações
| Parâmetro | EPF10K200EBC600-2 | EPF10K200SBC600-1 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $198,00 | $425,00 |
| Series | FLEX-10KE | EPF10K200 |
| Logic Family | CMOS (SRAM-based) | — |
| Process Technology | 0.30 µm CMOS | 0.22 µm CMOS |
| Typical Gate Count | 200,000 gates | — |
| Logic Elements (LEs) | 9984 | — |
| Logic Array Blocks (LABs) | 1248 | 1,248 |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | — |
| Maximum User I/O | 470 pins | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Tensão de alimentação | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Package Type | 600-ball BGA (BGA-600) | — |
| Package Dimensions | 45 × 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Height | 1.1 mm max | — |
| Temperatura de operação | 0°C to +70°C (Commercial) | 0 °C to 70 °C (Commercial) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | — |
| Part Status | Obsolete | — |
| Status RoHS | unknown | Non-compliant (per third-party listing) |
| Family | — | FLEX-10KS |
| Logic Elements / Cells | — | 9,984 |
| Gate Count (typical) | — | 200,000 gates |
| Number of User I/Os | — | 470 |
| Number of Logic Cells | — | 4,992 |
| Embedded RAM (bits) | — | 24,576 (across EABs) |
| Max Internal Frequency | — | 250 MHz |
| Core Supply Voltage (VCCINT) | — | 2.375 V to 2.625 V (typ. 2.5 V) |
| Speed Grade | — | -1 (fastest commercial) |
| Encapsulamento | — | 600-ball BGA, 45 × 45 mm, 1.27 mm pitch |
| JTAG Support | — | IEEE Std 1149.1 |
| Configuration | — | Serial via EPC2/EPC8 configuration devices |