EPF10K200EBC600-2 vs EPF10K200SBC600-1 Comparison

Detailed side-by-side comparison of EPF10K200EBC600-2 by Intel and EPF10K200SBC600-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EBC600-2 EPF10K200SBC600-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Series FLEX-10KE EPF10K200
Logic Family CMOS (SRAM-based) —
Process Technology 0.30 µm CMOS 0.22 µm CMOS
Typical Gate Count 200,000 gates —
Logic Elements (LEs) 9984 —
Logic Array Blocks (LABs) 1248 1,248
Embedded Memory (EAB) 98304 bits (96 Kbits) —
Maximum User I/O 470 pins —
Propagation Delay 0.4 ns 0.4 ns
Supply Voltage 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) —
I/O Standards LVTTL, LVCMOS, PCI, GTL+ —
Package Type 600-ball BGA (BGA-600) —
Package Dimensions 45 × 45 mm —
Ball Pitch 1.27 mm —
Package Height 1.1 mm max —
Operating Temperature 0°C to +70°C (Commercial) 0 °C to 70 °C (Commercial)
Mounting Type Surface Mount Surface Mount
Configuration Method JTAG (IEEE 1149.1), EPC2 serial PROM —
Part Status Obsolete —
RoHS Status unknown Non-compliant (per third-party listing)
Family — FLEX-10KS
Logic Elements / Cells — 9,984
Gate Count (typical) — 200,000 gates
Number of User I/Os — 470
Number of Logic Cells — 4,992
Embedded RAM (bits) — 24,576 (across EABs)
Max Internal Frequency — 250 MHz
Core Supply Voltage (VCCINT) — 2.375 V to 2.625 V (typ. 2.5 V)
Speed Grade — -1 (fastest commercial)
Package — 600-ball BGA, 45 × 45 mm, 1.27 mm pitch
JTAG Support — IEEE Std 1149.1
Configuration — Serial via EPC2/EPC8 configuration devices

Datasheets & Resources

Browse All Products Create BOM Request Quote