EPF10K200EBC600-3 vs EPF10K200EBC600-1 Comparação
Comparação detalhada lado a lado de EPF10K200EBC600-3 por Intel e EPF10K200EBC600-1 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 ObsoleteIntel
EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
EPF10K200EBC600-1 ObsoleteComparação de especificações
| Parâmetro | EPF10K200EBC600-3 | EPF10K200EBC600-1 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $575,00 | $322,17 |
| Family | FLEX 10KE | — |
| Series | FLEX-10KE | — |
| System Gates | 200,000 | — |
| Logic Elements / Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1248 | — |
| Embedded Memory (EABs) | 24,576 bits | — |
| Maximum User I/O | 470 | — |
| Number of PLLs | 4 | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Process Technology | 0.22 micrometer SRAM | — |
| Speed Grade | -3 (commercial) | — |
| Encapsulamento | 600-ball FineLine BGA, 45 x 45 mm | 600-BGA |
| Tipo de montagem | Surface Mount | — |
| Temperatura de operação | 0C to +70C (commercial) | — |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | unknown |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | FLEX-10KE |
| Logic Elements | — | 9,984 |
| Embedded Memory | — | 98,304 bits |
| Logic Array Blocks | — | 1,248 LABs |
| I/O Count | — | 470 I/O |
| Tensão de alimentação | — | 2.5 V |
| Technology | — | Mixed CMOS |
| Commercial Temperature | — | 85 C |
| Propagation Delay | — | 0.4 ns |
| Embedded Array | — | Enhanced embedded array |
| Memory Feature | — | Dual-port memory |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Operating Current | — | [DATA_NEEDED: operating current] |
| Pinout | — | [DATA_NEEDED: 600-BGA ball map] |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |