IRLR3636TRLPBF vs IRFZ48NSTRLPBF Comparação
Comparação detalhada lado a lado de IRLR3636TRLPBF por Infineon e IRFZ48NSTRLPBF por Infineon. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | IRLR3636TRLPBF | IRFZ48NSTRLPBF |
|---|---|---|
| Marca | Infineon | Infineon |
| Categoria | MOSFETs | MOSFETs |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $0,74 | $1,18 |
| FET Type | N-Channel MOSFET | N-Channel Power MOSFET |
| Technology | IR HEXFET® (IR MOSFET™) | — |
| Drain-to-Source Voltage (VDS) | 60 V | 55 V |
| Continuous Drain Current (ID, TC=25°C) | 50 A | — |
| Continuous Drain Current (ID, TC=100°C) | 32 A [DATA_NEEDED: exact TC=100°C ID rating] | — |
| Pulsed Drain Current (IDM) | [DATA_NEEDED: IDM rating] | [DATA_NEEDED: pulsed drain current] |
| RDS(on) Max @ VGS=10V | 6.8 mΩ | — |
| Gate-to-Source Voltage (VGS) Max | ±20 V | — |
| Gate Threshold Voltage (VGS(th)) | 1.0 V to 2.5 V (logic-level) | — |
| Total Gate Charge (QG) | 33 nC | — |
| Power Dissipation (PD, TC=25°C) | 143 W | — |
| Faixa de temperatura de operação | -55 °C to +175 °C (TJ) | — |
| Encapsulamento | TO-252AA (DPAK) | D2PAK (TO-263) Surface Mount |
| Tipo de montagem | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (PBF suffix) | — |
| Avalanche Rated | Yes (per Infineon datasheet family) | — |
| Continuous Drain Current (ID) @ Tc=25C | — | 64 A |
| Static Drain-to-Source On-Resistance (Rds(on)) | — | 14 mΩ at VGS = 10 V |
| Gate-to-Source Threshold Voltage (VGS(th)) | — | 2.0 V to 4.0 V |
| Total Gate Charge (Qg) | — | 54 nC |
| Gate-to-Source Voltage (VGS) max | — | ±20 V |
| Power Dissipation (Pd) @ Tc=25C | — | 130 W |
| Power Dissipation (Pd) @ Ta=25C on FR-4 | — | 3.8 W |
| Temperatura de junção de operação | — | -55C to +175C |
| Packaging | — | Tape & Reel (13-inch reel, TRL) |
| Lead Finish | — | Lead-free (PBF) matte tin |
| Status RoHS | — | Compliant |
| Technology Family | — | HEXFET advanced process technology |