K9DVGY8J5M vs K9HQGY8S5M Comparação

Comparação detalhada lado a lado de K9DVGY8J5M por Samsung Electronics e K9HQGY8S5M por Samsung Electronics. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Samsung Electronics
K9DVGY8J5M K9DVGY8J5M - Samsung V-NAND TLC Flash Memory Chip | Samsung

K9DVGY8J5M - Samsung V-NAND TLC Flash Memory Chip | Samsung

K9DVGY8J5M ✓ Ativo
Samsung Electronics
K9HQGY8S5M K9HQGY8S5M - 3D V-NAND Flash, FBGA-316 | Samsung | SSD Storage

K9HQGY8S5M - 3D V-NAND Flash, FBGA-316 | Samsung | SSD Storage

K9HQGY8S5M ✓ Ativo

Comparação de especificações

Parâmetro K9DVGY8J5M K9HQGY8S5M
Marca Samsung Electronics Samsung Electronics
Categoria Memory ICs Memory ICs
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $1,00 $0,00
Manufacturer Samsung Electronics Samsung Electronics
Product Type Raw NAND Flash Memory 3D V-NAND Flash Memory (stacked, client NAND)
NAND Technology Samsung V-NAND (3D TLC) 32-layer pMLC 3D V-NAND (per Samsung 850 Pro 256 GB analysis)
Flash ID EC519A3F8CCB —
Density [DATA_NEEDED: die density (Gb)] [DATA_NEEDED: total bit density]
Organization (Page/Block) [DATA_NEEDED: page and block organization] —
Tipo de interface [DATA_NEEDED: interface (toggle DDR / async)] —
Supply Voltage (VCC) [DATA_NEEDED: VCC voltage] —
Supply Voltage (VCCQ) [DATA_NEEDED: VCCQ voltage] —
Program Page Time (tPROG) [DATA_NEEDED: tPROG typical/us] —
Block Erase Time (tBERS) [DATA_NEEDED: tBERS typical/us] —
Read Time (tR) [DATA_NEEDED: tR typical/us] —
Program/Erase Endurance [DATA_NEEDED: P/E cycle endurance] —
Temperatura de operação [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Package Type [DATA_NEEDED: package type and dimensions] 316-ball Fine Pitch BGA (FBGA-316)
Tipo de montagem Surface Mount Surface Mount (BGA)
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Die Configuration — 4 x K9ADGD8S0A V-NAND dies (per TechInsights package analysis)
Memory Class — Non-volatile NAND flash
Interface — NAND (ONFI/Toggle-style asynchronous interface) - exact timing mode [DATA_NEEDED: interface timing mode]
Tensão de alimentação — [DATA_NEEDED: VCC range]
Page Size — [DATA_NEEDED: page size]
Block Size — [DATA_NEEDED: block size]
Program/Erase Cycles — [DATA_NEEDED: P/E endurance rating]
Nível MSL — [DATA_NEEDED: moisture sensitivity level]
Original Application — Samsung SSD 850 Pro solid-state drive

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