LFE2-6E-7F256C vs LFE2-6E-6FN256I Comparação

Comparação detalhada lado a lado de LFE2-6E-7F256C por Lattice Semiconductor e LFE2-6E-6FN256I por Lattice Semiconductor. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Lattice Semiconductor
LFE2-6E-7F256C LFE2-6E-7F256C - 6000-LUT FPGA, 190 I/O, 256-BGA | Lattice

LFE2-6E-7F256C - 6000-LUT FPGA, 190 I/O, 256-BGA | Lattice

LFE2-6E-7F256C [data_needed: lifecycle status]
Lattice Semiconductor
LFE2-6E-6FN256I LFE2-6E-6FN256I - 6K LUT FPGA, 190 I/O, 256-BGA | Lattice

LFE2-6E-6FN256I - 6K LUT FPGA, 190 I/O, 256-BGA | Lattice

LFE2-6E-6FN256I ✓ Ativo

Comparação de especificações

Parâmetro LFE2-6E-7F256C LFE2-6E-6FN256I
Marca Lattice Semiconductor Lattice Semiconductor
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida [DATA NEEDED: Lifecycle Status] Ativo
Device Type ECP2 field-programmable gate array (FPGA) IC ECP2 Field Programmable Gate Array (FPGA)
Logic Cell Count 6000 cells —
LUT Count 6000 LUTs —
Maximum Operating Frequency 420 MHz —
User I/O Count 190 I/O —
DSP Capability DSP —
Core Supply Voltage 1.2 V 1.14 V to 1.26 V
Logic Cell Count from Distributor Listing 56320 —
Encapsulamento 256-BGA 256-ball FBGA, 17 mm × 17 mm
Package Family FBGA-256 —
Package Type PBGA256 —
Package Dimensions 17 x 17 mm —
Ordering Code LFE2-6E-7F256C —
Speed Designation -7 —
Lead-Free Status Lead free Lead free
Tipo de montagem Surface mount Surface Mount
Faixa de temperatura de operação [DATA_NEEDED: operating temperature range] —
Block RAM Quantity [DATA_NEEDED: block RAM quantity] —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH compliance status]
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] [DATA_NEEDED: AEC-Q100 qualification status]
Logic Cells — 6,000 cells
Logic Blocks — 750 LABs
Embedded RAM — 56,320 bits (67 KB)
User I/O — 190 I/O
Maximum Frequency — 357 MHz
Nominal Core Voltage — 1.2 V
Process Technology — 90 nm
Temperatura de operação — -40°C to +100°C
Temperature Grade — Industrial
Package Code — FPBGA-256
Terminal Type — Ball
Number of Terminals — 256 balls
Package Shape — Square
Standard Packaging — Tray
Standard Quantity — 90 units

Fichas técnicas e recursos

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