LFE5UM-45F-6BG554C vs LFE5UM-85F-6BG554C Comparação
Comparação detalhada lado a lado de LFE5UM-45F-6BG554C por Lattice Semiconductor e LFE5UM-85F-6BG554C por Lattice Semiconductor. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Lattice Semiconductor
LFE5UM-45F-6BG554C - ECP5 FPGA 45K LUTs w/ SERDES, 554-CABGA | Lattice
LFE5UM-45F-6BG554C ✓ AtivoLattice Semiconductor
LFE5UM-85F-6BG554C - ECP5-5G FPGA, 84K LUTs, 12 SERDES | Lattice
LFE5UM-85F-6BG554C ✓ AtivoComparação de especificações
| Parâmetro | LFE5UM-45F-6BG554C | LFE5UM-85F-6BG554C |
|---|---|---|
| Marca | Lattice Semiconductor | Lattice Semiconductor |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $115,10 | $13,10 |
| Family | LatticeECP5 | ECP5-5G (LFE5UM) |
| Logic Cells | 44,000 (nominal, LUT4-equivalent) | — |
| Logic Elements / LUTs | Approximately 45,000 LUT4 | — |
| Embedded Block RAM | 1,944 Kb | 3744 Kbits |
| Distributed RAM | [DATA_NEEDED: distributed RAM Kbits] | [DATA_NEEDED: distributed RAM Kbits] |
| DSP Slices | [DATA_NEEDED: DSP slice count] | — |
| User I/O (this package) | 245 | — |
| SERDES Channels | 4 x multi-protocol SERDES (1.5 / 3.2 / 5 Gbps) | 12 |
| Hardened PCIe Gen2 | Yes (x1 endpoint) | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Process Node | 40 nm CMOS | 40 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Speed Grade | -6 (commercial, lower timing margin than -7/-8) | -6 |
| Temperatura de operação | Commercial (0C to +85C, C suffix) | — |
| Encapsulamento | 554-pin cabga (chip-array BGA), 23 mm x 23 mm | 554-ball caBGA (BG554) |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount (BGA) |
| Nível MSL | 3 (per partstack data) | [DATA_NEEDED: MSL rating] |
| Peak Reflow Temperature | 260 C, 30 s max | — |
| Lead-Free / Termination Finish | Yes, Tin-Silver-Copper (e1 per JESD-609) | — |
| Configuration Interface | IEEE 1149.1 JTAG, SPI, Dual-boot / Multi-boot | — |
| TransFR Support | Yes (transparent field reconfiguration) | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LUT4) | — | 84000 |
| DSP Slices (18x18 multipliers) | — | 156 |
| User I/O | — | 259 |
| SERDES Data Rate (max) | — | 5 Gbps |
| Package Body Size | — | 23 x 23 mm |
| Operating Temperature Grade | — | Commercial (C) |
| Configuration Memory | — | SRAM-based (volatile, requires external boot) |