LFE5UM-45F-6BG554C - ECP5 FPGA 45K LUTs w/ SERDES, 554-CABGA | Lattice
N.º da peça: LFE5UM-45F-6BG554C ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $178.5 | $178,50 |
| 10 | $165.2 | $1.652,00 |
| 100 | $142.75 | $14.275,00 |
| 250 | $128.4 | $32.100,00 |
| 500 | $115.1 | $57.550,00 |
LFE5UM-45F-6BG554C Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (LUTs, flip-flops, routing, and dedicated silicon blocks such as block RAM, DSP slices, PLLs, and SERDES transceivers). FPGAs occupy a position between general-purpose microcontrollers (programmed in software) and ASICs (custom-masked silicon): they are parallel, hardware-reconfigurable, and re-spin without mask changes, which makes them ideal for low-volume production, fast-prototype connectivity, and high-bandwidth data-plane acceleration. Within the broader semiconductor taxonomy, FPGAs sit at the same hierarchy level as microcontrollers and DSPs in embedded logic, and the LatticeECP5 family is targeted at low-cost, low-power, high-volume edge and connectivity applications.
Key features of the LFE5UM-45F-6BG554C include four or more 5 Gbps multi-protocol SERDES channels (PCIE Gen1/Gen2, SERDES, SGMII, XAUI-capable), a hardened PCIe Gen2 endpoint block, on-chip DSP slices for fixed- and floating-point arithmetic, distributed and block RAM, and support for 1 Gbit DDR3 / LPDDR2 / LPDDR3 external memory interfaces. The -6 speed grade, combined with the cabga-554 footprint, makes this device targeted at small-form-factor, cost-sensitive board designs where SERDES and PCIe are required.
The ECP5 architecture pairs LUT-based logic fabric with hardened IP blocks (SERDES, PCIe, DDR PHYs) to deliver high bandwidth at low power - typically under 1 W static plus dynamic for small designs. The 40 nm process combined with 1.1 V core keeps both leakage and dynamic dissipation low, which is critical for always-on connectivity edges such as small-cell front-haul, IoT gateways, and battery-powered imaging.
Typical applications include low-cost PCIe add-in cards, small-cell baseband and front-haul bridging, industrial machine vision pre-processing, USB 3.0 / DisplayPort Bridge bi-directional protocol conversion, and IoT edge gateways aggregating multiple sensor streams. The cabga-554 footprint supports board designs up to roughly 100 mm x 100 mm with comfortable routing margins for high-speed SERDES.
When designing with this part, ensure that the cabga-554 PCB footprint uses laser-drilled microvias with proper stack-up symmetry for the SERDES channels to meet the 5 Gbps return-loss mask; Lattice TN1268 (cabga-544/554 layout guide) should be followed for via-in-pad escape. JTAG programming via the standard IEEE 1149.1 boundary-scan interface allows the same bitstream to be programmed either at factory or in-field via TransFR (transparent field reconfiguration) without halting the device.
This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, including cabga-554 PCB escape guidance and same-family ECP5 device substitution analysis.
Alternativas drop-in para LFE5UM-45F-6BG554C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com LFE5UM-45F-6BG554C (mesmo formato e footprint) — diferindo em Embedded Block RAM, Family, Package, Process Node, SERDES Channels.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LFE5U-45F-6BG554C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LFE5UM-45F-8BG554C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LFE5UM-45F-7BG554C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LFE5UM-85F-6BG554C
✅ Drop-In✓ Em estoque
$13.1 / unidade
Ver ficha técnica →LFE5UM-25F-6BG554C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LFE5UM5G-45F-6BG554C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LFE5UM-45F-6BG554C Classificações máximas e características elétricas
| Family | LatticeECP5 |
| Logic Cells | 44,000 (nominal, LUT4-equivalent) |
| Logic Elements / LUTs | Approximately 45,000 LUT4 |
| Embedded Block RAM | 1,944 Kb |
| User I/O (this package) | 245 |
| SERDES Channels | 4 x multi-protocol SERDES (1.5 / 3.2 / 5 Gbps) |
| Hardened PCIe Gen2 | Yes (x1 endpoint) |
| Process Node | 40 nm CMOS |
| Core Voltage | 1.1 V |
| Speed Grade | -6 (commercial, lower timing margin than -7/-8) |
| Temperatura de operação | Commercial (0C to +85C, C suffix) |
| Encapsulamento | 554-pin cabga (chip-array BGA), 23 mm x 23 mm |
| Tipo de montagem | Surface Mount (BGA) |
| Nível MSL | 3 (per partstack data) |
| Peak Reflow Temperature | 260 C, 30 s max |
| Lead-Free / Termination Finish | Yes, Tin-Silver-Copper (e1 per JESD-609) |
| Configuration Interface | IEEE 1149.1 JTAG, SPI, Dual-boot / Multi-boot |
| TransFR Support | Yes (transparent field reconfiguration) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do LFE5UM-45F-6BG554C 554-pin cabga (chip-array bga), 23 mm x 23 mm
Configuração de pinos para LFE5UM-45F-6BG554C (pacote 554-pin cabga (chip-array bga), 23 mm x 23 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para LFE5UM-45F-6BG554C.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
LFE5UM-45F-6BG554C é adequado para 6 aplicaçãos: Low-Cost PCIe Gen2 Add-In Cards, Small-Cell / Front-Haul Bridging, Industrial Machine Vision Pre-Processing, USB 3.0 / DisplayPort Protocol Bridges, IoT Edge Gateways and Sensor Aggregators, LED Display / Video Wall Driving.
Low-Cost PCIe Gen2 Add-In Cards
The LFE5UM-45F-6BG554C is ideally suited for low-cost PCIe Gen2 add-in cards because it integrates a hardened PCIe Gen2 x1 endpoint alongside four 5 Gbps SERDES channels in a single 554-pin cabga package. The hardened PCIe block implements the transaction layer, data link layer, and physical layer without consuming FPGA fabric, freeing the 44,000 LUT4 logic and 1,944 Kb of block RAM for user-defined acceleration, protocol bridging, or pre/post-processing. Designers place the device on a 100 mm x 100 mm board with the cabga-554 footprint; typical designs pair it with a DDR3/LPDDR3 memory for buffer space. Power dissipation stays well under 1.5 W even at full SERDES utilization, eliminating the need for a heatsink. Compared to a soft PCIe IP core approach, the hardened endpoint reduces latency by 50-100 ns and frees roughly 8K LUTs, an immediate cost-and-area win.
Recomendado
Small-Cell / Front-Haul Bridging
In small-cell base stations and CPRI / OBSAI front-haul links, the LFE5UM-45F-6BG554C acts as a low-power SERDES-based protocol bridge, mapping antenna data between Ethernet, CPRI, and baseband processors. The 40 nm process and 1.1 V core keep static power under 0.5 W, critical for thermally constrained outdoor radio units. The four multi-protocol SERDES channels at 5 Gbps comfortably support CPRI line rates up to 4.9 Gbps while leaving headroom for additional Ethernet connectivity. The 44K LUT4 logic fabric handles framer / deframer and Ethernet MAC / PCS functions without external ASSPs, and the cabga-554 footprint supports PCB layouts small enough to fit in a 100 mm x 80 mm radio card. Compared to ASSP-based bridges, this ECP5 approach reduces BOM count by 3-5 chips and adds design flexibility via in-field reconfiguration.
Recomendado
Industrial Machine Vision Pre-Processing
In industrial machine-vision cameras and frame grabbers, the LFE5UM-45F-6BG554C pre-processes high-speed image streams from MIPI CSI-2 or parallel LVDS sensors before forwarding compressed data over Ethernet or USB 3.0. The DSP slices and 245 user I/O on cabga-554 accept multiple sensor lanes at 1 Gbps each, and the SERDES channels output the processed stream at 5 Gbps to a host. With 1,944 Kb of block RAM and 44K LUT4 logic, designers can implement color-space conversion, lens-distortion correction, and JPEG / H.264 compression in a single chip. The commercial 0C to +85C operating range suits factory-floor deployments, and the cabga-554 footprint keeps PCB size under 50 mm x 50 mm. Compared to ASSP image signal processors, the FPGA enables post-deployment algorithm updates without hardware changes.
Recomendado
USB 3.0 / DisplayPort Protocol Bridges
The LFE5UM-45F-6BG554C is widely deployed in USB-to-DP, DP-to-HDMI, and USB Type-C alternate-mode protocol bridges because the four SERDES channels at 5 Gbps comfortably carry USB 3.0 SuperSpeed (5 Gbps) and DisplayPort 1.2 (RBR/HBR) traffic simultaneously. The 44K LUT4 fabric implements USB device / hub controllers, DP link training, and HDCP auxiliary channels without external ASSPs, and the cabga-554 footprint supports dongle-style products. Compared to ASSP bridges, the FPGA approach supports multiple protocol combinations (DP-in / HDMI-out, USB-in / DP-out, etc.) via firmware changes, and TransFR enables in-field firmware updates. Power dissipation is typically 1.0 to 1.5 W under full bidirectional traffic, fitting within dongle thermal envelopes.
Recomendado
IoT Edge Gateways and Sensor Aggregators
In IoT edge gateways aggregating sensor data from BLE, LoRa, Wi-Fi, and Ethernet interfaces, the LFE5UM-45F-6BG554C serves as the data-plane aggregation and pre-processing node. The 245 user I/O on cabga-554 accept multiple SPI, I2C, UART, and parallel sensor buses, and the SERDES channels connect to upstream GbE / SGMII links. The 44K LUT4 fabric implements edge-AI inference (small CNNs, decision-tree classifiers), MQTT / CoAP message formation, and security protocol termination (TLS, DTLS). The 1.1 V core at 40 nm keeps typical power around 0.8 to 1.2 W even at full aggregation load, suitable for fanless gateway enclosures. Compared to ASSP-based gateway SoCs, the FPGA approach supports in-field addition of new sensor protocols via bitstream updates.
Recomendado
LED Display / Video Wall Driving
The LFE5UM-45F-6BG554C is increasingly used in LED display controllers and video-wall processors where multiple HDMI / DP / SDI input streams must be aggregated, color-corrected, and re-output to large LED panels. The four 5 Gbps SERDES channels handle uncompressed HDMI 1.4 / DP 1.1 inputs, and the 245 user I/O drive dozens of LED panel data lanes at low voltage differential signaling (LVDS). With 1,944 Kb of block RAM, multiple input frames can be buffered for color-space conversion and gamma correction, and the 44K LUT4 logic implements scaling, de-interlacing, and bezel compensation in real time. The cabga-554 footprint supports both controller cards and integrated panel-driver boards. Compared to ASSP video processors, the FPGA approach enables custom color profiles and HDR remapping without firmware locks.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LFE5UM-45F-6BG554C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LFE5U-45F-6BG554C | LFE5UM-45F-8BG554C | LFE5UM-45F-7BG554C | LFE5UM-85F-6BG554C | LFE5UM-25F-6BG554C | LFE5UM5G-45F-6BG554C |
|---|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 554-pin cabga (23 x 23 mm) | 554-pin cabga (23 x 23 mm) - same | 554-pin cabga (23 x 23 mm) - same | 554-pin cabga (23 x 23 mm) - same | 554-pin cabga (23 x 23 mm) - same | 554-pin cabga (23 x 23 mm) - same | 554-pin cabga (23 x 23 mm) - same |
| Logic Cells (LUT4) | 44,000 | 44,000 | 44,000 | 44,000 | 85,000 | 25,000 | 44,000 |
| SERDES Channels | 4 x 1.5/3.2/5 Gbps | None (SERDES-less variant) | 4 x 1.5/3.2/5 Gbps | 4 x 1.5/3.2/5 Gbps | 4 x 1.5/3.2/5 Gbps | 4 x 1.5/3.2/5 Gbps | 4 x up to 5 Gbps (5G variant) |
| PCIe Gen2 Endpoint | Yes (hardened x1) | No (SERDES-less variant) | Yes (hardened x1) | Yes (hardened x1) | Yes (hardened x1) | Yes (hardened x1) | Yes (hardened x1) |
| Block RAM | 1,944 Kb | 1,944 Kb | 1,944 Kb | 1,944 Kb | 3,888 Kb | 1,080 Kb | 1,944 Kb |
| Speed Grade | -6 (commercial, slowest) | -6 | -8 (fastest) | -7 | -6 | -6 | -6 |
| User I/O (cabga-554) | 245 | 245 | 245 | 245 | 245 | 245 | 245 |
| Operating Temperature | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial |
Principais diferenciais
- Hardened PCIe Gen2 endpoint eliminates soft-IP logic overhead (vs LFE5U-45F-6BG554C)
- cabga-554 provides maximum ECP5 user I/O and SERDES pin-out (vs Smaller ECP5 packages (BG256, BG484))
- LatticeECP5 family delivers best-in-class low static power (vs LFE5UM-85F-6BG554C)
Notas de projeto
The cabga-554 BGA at 23 mm x 23 mm requires a high-density PCB stack-up with laser-drilled microvias for the inner-row ball escape. Lattice technical note TN1268 (cabga-544/554 layout guide) recommends a 1-2-1 or 2-4-2 stack-up with 0.4 mm pitch escape. Use via-in-pad (VIP) for the inner rows to maintain signal integrity on the four 5 Gbps SERDES channels. The thermal pad array in the centre of the cabga must have a continuous thermal plane on the top layer with at least 8 thermal vias connecting to inner ground planes; thermal dissipation is largely through the PCB, not through convection, so a 4-layer board with 1 oz copper is the minimum practical stack-up for reliable operation above 1 W total power.
For 5 Gbps SERDES operation, the cabga-554 BGA escape must use length-matched differential pairs with 100 ohm differential impedance. Skew within a pair must be held under 1 ps (approximately 150 um length matching at FR-4 dielectric constant). Series AC-coupling capacitors of 100 nF are required on each SERDES TX / RX pair - place them within 5 mm of the BGA ball. Reference the Lattice ECP5 SERDES reference design for pre-emphasis and equalization settings. Always simulate the SERDES channel with a 3D EM tool (e.g., ANSYS HFSS or Cadence Clarity) before fabrication; return-loss masks must be met at the BGA ball, not at the connector.
Estimated: At full SERDES utilization (4 x 5 Gbps) plus 70% LUT utilization, the LFE5UM-45F-6BG554C dissipates approximately 1.2 to 1.5 W. With a 4-layer JEDEC-standard thermal test board, theta-JA is approximately 18 to 22 C/W for the cabga-554. This yields a 22 to 33 C junction temperature rise above ambient for a 1.5 W design, well within the 0C to +85C commercial operating range and the 125C absolute maximum. No heatsink is required for typical commercial designs, but the inner thermal balls must be soldered to the thermal pad array and through-via'd to inner copper planes. For industrial applications above 70C ambient, consider a small top-side copper spreader or thermal pad to the enclosure.
Do not confuse the LFE5UM-45F-6BG554C (SERDES variant) with the LFE5U-45F-6BG554C (SERDES-less variant). Both share the same cabga-554 ball map and footprint, and the U variant will power up and pass basic configuration on a UM board, but it will fail any design that uses the SERDES pins. Always verify the device ID readback (via JTAG IDCODE) before programming in production. Also note that the -6 speed grade is the slowest of the ECP5 family; if your design fails timing at -6, move to -7 or -8 (drop-in compatible, faster timing closure) before reducing design complexity. Finally, ensure the JTAG TCK signal has a clean 0 to 3.3 V swing - Lattice ECP5 does not tolerate 1.8 V JTAG in all configurations.
Power-rail decoupling for the cabga-554 ECP5 should follow Lattice reference design patterns: 100 nF X7R ceramic decoupling at every power pin within 1 mm, with bulk 10 uF X5R per supply rail. The 1.1 V VCC core rail must have a low-impedance plane on layer 2, not a routed power trace. For PCIe applications, the 100 MHz PCIe reference clock must have a clean source with 50 ppm stability; use a dedicated clock generator IC rather than deriving from a SERDES recovered clock. The configuration mode pins (CNIT, CFG_SEL, etc.) must be tied to valid logic states at power-up via 10 kohm pull-ups / pull-downs to select SPI vs JTAG vs Slave Parallel mode.
Informações de conformidade
RoHS compliance and lead-free Tin-Silver-Copper (e1) finish per JESD-609 confirmed by partstack datasheet. Commercial operating temperature range (C suffix). AEC-Q100 not applicable - ECP5 family is not automotive qualified; consult Lattice for automotive-grade ECP5-5G variants if needed.
