M1AFS1500-FGG484K vs M1AFS1500-1FGG484I Comparação

Comparação detalhada lado a lado de M1AFS1500-FGG484K por Microchip Technology e M1AFS1500-1FGG484I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
M1AFS1500-FGG484K M1AFS1500-FGG484K - 1.5M Gate Fusion FPGA, 223 I/O | Microchip

M1AFS1500-FGG484K - 1.5M Gate Fusion FPGA, 223 I/O | Microchip

M1AFS1500-FGG484K ✓ Ativo
Microchip Technology
M1AFS1500-1FGG484I M1AFS1500-1FGG484I - 1.5M Gate Fusion Mixed-Signal FPGA | Microchip

M1AFS1500-1FGG484I - 1.5M Gate Fusion Mixed-Signal FPGA | Microchip

M1AFS1500-1FGG484I ✓ Ativo

Comparação de especificações

Parâmetro M1AFS1500-FGG484K M1AFS1500-1FGG484I
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $1,00 $0,00
Series Fusion —
Number of System Gates 1500000 —
Total RAM Bits 276480 —
Number of I/O 223 —
Tensão de alimentação 1.425 V to 1.575 V —
Core Technology 130 nm flash-based —
Embedded Processor ARM Cortex-M1 ARM Cortex-M1
Encapsulamento / Caixa 484-BGA (FBGA, 23x23 mm) —
Supplier Device Package 484-FPBGA (23x23) —
Tipo de montagem Surface Mount Surface Mount
Programming Type In-System Programmable (flash-based, non-volatile) —
Analog Blocks Yes (Fusion configurable analog) Configurable analog (ADC-based system monitoring)
Temperatura de operação [DATA_NEEDED: operating temperature range] —
Packaging Tray —
Product Status Active —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Moisture Sensitivity Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
Manufacturer — Microchip Technology (originally Microsemi Corporation)
Family — Fusion Mixed-Signal FPGA
System Gates — 1500000 gates
Logic Cells — 38400
User I/O — 223
Flash Fabric Bits — 276480 bits
Core Supply Voltage — 1.5 V
Process Technology — 130 nm flash-based
Speed Grade — -1
Encapsulamento — 484-ball Fine-Pitch BGA (FGG484), 1.00 mm pitch
Package Dimensions — 23 mm x 23 mm
Temperature Grade — Industrial (-40C to +100C, I suffix)
Clock Management — On-chip CCC clock conditioning and generation
Configuration Memory — On-chip flash (single-chip, instant-on)

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