M1AFS1500-1FGG484I - 1.5M Gate Fusion Mixed-Signal FPGA | Microchip
N.º da peça: M1AFS1500-1FGG484I ✓ Ativo| Qtd. | Preço unitário | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
M1AFS1500-1FGG484I Visão geral
A mixed-signal FPGA is a field-programmable gate array that combines digital programmable fabric with analog peripherals such as ADCs, monitors, and PLL-based clock management on the same chip. Unlike SRAM FPGAs, flash-based FPGAs store their configuration in on-chip flash memory, giving them inherent single-chip boot, instant-on behavior, and higher resistance to configuration upset - a key differentiator in the programmable logic hierarchy.
Key features of the M1AFS1500-1FGG484I include large embedded flash memory blocks for configuration and user data, comprehensive on-chip clock generation and management circuitry, the ARM Cortex-M1 processor for embedded control within the fabric, and 223 user I/Os supporting multiple standards. The Fusion fabric provides 38,400 logic cells (per Microchip USA product data for the M1AFS1500 series) with 276,480 bits of flash-based fabric capacity as listed by DigiKey.
Architecturally, the device monolithically integrates configurable analog peripherals (voltage/temperature monitoring via an on-board ADC), CCC clock conditioning circuits, and flash-based look-up-table logic. The M1 prefix denotes Fusion FPGAs that include the ARM Cortex-M1 processor, enabling single-chip embedded designs without an external MCU.
Typical applications include industrial automation control, military/aerospace embedded systems, power-supply supervision and board management, test instrumentation, and motor control - anywhere single-chip analog monitoring plus digital logic reduces BOM count.
Design consideration: flash-based Fusion parts are programmed in-system via JTAG or on-board flash; budget I/O banks and supply rails per the FGG484 footprint early, since migrating between speed grades stays drop-in but changing package (FG484 vs FGG484 ballout) requires PCB review.
This page synthesizes distributor data, same-package drop-in alternatives, and design guidance not found in the manufacturer datasheet.
Alternativas drop-in para M1AFS1500-1FGG484I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com M1AFS1500-1FGG484I (mesmo formato e footprint) — diferindo em Package, Family, System Gates, Process Technology, Clock Management.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
M1AFS1500-2FGG484I
✅ Drop-In✓ Em estoque
$201.11 / unidade
Ver ficha técnica →M1AFS1500-FGG484I
✅ Drop-In✓ Em estoque
$152.28 / unidade
Ver ficha técnica →M1AFS1500-1FGG484
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →M1AFS1500-1FGG484K
✅ Drop-In✓ Em estoque
$1560 / unidade
Ver ficha técnica →M1AFS1500-FGG484K
✅ Drop-In✓ Em estoque
$1 / unidade
Ver ficha técnica →M1AFS1500-1FG484I
✅ Drop-In✓ Em estoque
$402.06 / unidade
Ver ficha técnica →M1AFS1500-1FGG484I Classificações máximas e características elétricas
| Manufacturer | Microchip Technology (originally Microsemi Corporation) |
| Family | Fusion Mixed-Signal FPGA |
| System Gates | 1500000 gates |
| Logic Cells | 38400 |
| Embedded Processor | ARM Cortex-M1 |
| User I/O | 223 |
| Flash Fabric Bits | 276480 bits |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm flash-based |
| Speed Grade | -1 |
| Encapsulamento | 484-ball Fine-Pitch BGA (FGG484), 1.00 mm pitch |
| Package Dimensions | 23 mm x 23 mm |
| Temperature Grade | Industrial (-40C to +100C, I suffix) |
| Tipo de montagem | Surface Mount |
| Analog Blocks | Configurable analog (ADC-based system monitoring) |
| Clock Management | On-chip CCC clock conditioning and generation |
| Configuration Memory | On-chip flash (single-chip, instant-on) |
Guia de Configuração de Pinos do M1AFS1500-1FGG484I 23 mm x 23 mm
Configuração de pinos para M1AFS1500-1FGG484I (pacote 23 mm x 23 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para M1AFS1500-1FGG484I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
M1AFS1500-1FGG484I é adequado para 6 aplicaçãos: Industrial Automation and Motor Control, Board Management and Power Supervision, Military and Aerospace Embedded Systems, Test and Measurement Instrumentation, Secure and Single-Chip Embedded Control, IoT Gateways and Smart Sensor Hubs.
Industrial Automation and Motor Control
The M1AFS1500-1FGG484I fits industrial automation because its 1.5M-gate flash fabric implements multiple PWM channels, quadrature encoders, and fieldbus protocol engines while the embedded ARM Cortex-M1 runs the control loop firmware on one chip. The integrated analog subsystem monitors supply rails and die temperature via the on-chip ADC, supporting failsafe shutdown logic without an external supervisor IC. Placed at the heart of a drive or PLC I/O card, the flash-based fabric boots instantly from on-chip memory - no external configuration device to fail in electrically noisy factory environments. The 223 user I/Os at 1.5V-core with banked I/O standards interface directly to sensors, drivers, and communication transceivers, and the industrial -40C to +100C rating covers cabinet-mounted equipment.
Recomendado
Board Management and Power Supervision
Fusion's defining feature is monolithic analog monitoring, making the M1AFS1500-1FGG484I a natural board-management controller for servers, telecom shelves, and backplanes. The on-chip ADC and analog multiplexers digitize multiple supply rails and temperature sensors, while the Cortex-M1 executes management firmware (fault logging, sequencing, fan control) and the fabric implements fast hardware comparators and shutdown triggers. Flash-based configuration means the supervisor logic is active within milliseconds of power application - critical when it must sequence other rails. The 484-ball FGG484 provides ample 223 user I/Os for I2C/SMBus fan controllers, LED status, and hot-swap interfaces, consolidating functions that would otherwise need an MCU plus several supervisor ICs.
Recomendado
Military and Aerospace Embedded Systems
Flash-based Fusion devices are widely used in defense programs because on-chip flash configuration avoids the configuration-readback upset exposure of SRAM FPGAs and eliminates external boot flash, reducing parts count in convection-limited avionics. The M1AFS1500-1FGG484I's 1.5M gates host sensor interfaces, bus bridges (MIL-STD-1553 glue logic, custom serial links), and the ARM Cortex-M1 for command handling, while integrated analog monitors supply health. The industrial -40C to +100C rating covers many airborne and ground-platform environments; for radiation-critical orbits, Microchip's RTAX4000S family is the companion space-grade path. Instant-on behavior from flash also supports time-critical power-up requirements common in munitions and telemetry systems.
Recomendado
Test and Measurement Instrumentation
Bench and rack instruments benefit from the M1AFS1500-1FGG484I's combination of flexible digital fabric and on-chip analog monitoring. The fabric triggers, captures, and time-stamps high-speed digital events, while the Cortex-M1 handles SCPI command parsing over UART/USB-serial and the integrated ADC tracks internal supply and temperature for self-test reporting. At 1.5M gates, the fabric fits protocol engines (SPI, I2C, JTAG masters), pattern generators, and statistical counters concurrently - a typical logic-analyzer front end. The 484-ball package exposes 223 I/Os for channel cards, and flash configuration means the instrument is functional the instant mains power arrives, avoiding SRAM-FPGA boot delays that users perceive as slow startup.
Recomendado
Secure and Single-Chip Embedded Control
Because configuration lives in on-chip flash, the M1AFS1500-1FGG484I supports designs where a single-chip, no-external-boot-flash architecture simplifies security review and tamper surface. The Cortex-M1 runs application firmware while the fabric implements custom cryptographic accelerators, secure key-handling state machines, and lockout logic; the analog monitor can detect supply-glitch attacks on the rails it supervises. The 1.5V core on 130nm flash process offers stable, non-volatile operation, and the FPGA fabric can be partially reprogrammed in the field for firmware updates. Typical deployments include network appliance management, licensed-spectrum equipment control, and industrial gateways where cloning resistance and rapid power-up both matter.
Recomendado
IoT Gateways and Smart Sensor Hubs
The M1AFS1500-1FGG484I serves as the hub in industrial IoT gateways: the Cortex-M1 runs the protocol stack and housekeeping firmware, the fabric implements multiple sensor interfaces (SPI, I2C, UART, custom RF-module links) concurrently with hardware timestamping, and the analog subsystem supervises local supply health. With 1.5M gates there is room for edge-preprocessing datapaths - filters, accumulators, thresholds - that offload the processor before data goes upstream. The flash fabric's instant-on and low configuration overhead suits gateways that must wake, sample, and report quickly on duty-cycled power. The 484-ball FGG484 footprint also allows migration to the smaller M1AFS600 in the same package when BOM cost must drop at scale.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para M1AFS1500-1FGG484I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | M1AFS1500-2FGG484I | M1AFS1500-FGG484I | M1AFS1500-1FGG484 | M1AFS1500-1FG484I |
|---|---|---|---|---|---|
| Package | 484-ball FGG484 BGA (1.00 mm pitch) | 484-ball FGG484 BGA - same | 484-ball FGG484 BGA - same | 484-ball FGG484 BGA - same | 484-ball FG484 BGA - same body, verify ballout |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1500000 gates | 1500000 gates | 1500000 gates | 1500000 gates | 1500000 gates |
| Speed Grade | -1 | -2 (faster) | Standard (faster) | -1 (same) | -1 (same) |
| User I/O | 223 | 223 | 223 | 223 | 223 |
| Temperature Range | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Principais diferenciais
- Single-chip flash configuration eliminates external boot device (vs SRAM FPGAs (Xilinx Artix-7 class))
- Integrated analog monitoring subsystem (vs M1AFS600-1FGG484I (digital-logic focus within same family))
- Embedded ARM Cortex-M1 processor on-chip (vs M1AFS1500-2FGG484I is faster but same features; vs non-M1 AFS parts)
Notas de projeto
The Fusion 484-ball device requires multiple supply rails (1.5 V core, 2.5 V aux, 3.3 V I/O - confirm exact rail list in the Fusion datasheet power section). Sequence the core rail before or together with I/O per the datasheet power-up specification, and decouple each VDD ball with at least one 0.1 uF ceramic placed within 2 mm of the ball via, plus bulk 10 uF per bank. Estimated: with 223 I/Os lightly loaded at 3.3 V, I/O dynamic current dominates - budget per-bank current using Microchip's Fusion power calculator (Silicon Architect) rather than the datasheet typical figures.
The 484-ball FGG484 BGA at 1.00 mm pitch requires dog-bone or via-in-pad fanout on a minimum 6-layer stack (signal-GND-signal-PWR-signal-signal recommended). Keep the analog monitor inputs (ADC channel pins) routed away from switching-regulator nodes and guard them with ground - the on-chip ADC is used for supply/temperature supervision, and coupled ripple corrupts readings. Place the JTAG programming header within 15 cm of the device with series resistors per Microchip's FlashPro programming guide for reliable in-system programming.
Two frequent mistakes on Fusion designs: (1) treating FGG484 and FG484 parts as interchangeable - the ballout differs between the G and non-G packages on some assigned balls, so always re-verify the ball map and run place-and-route against the correct device file before release; (2) assuming cross-brand FPGA migration is drop-in - it is not, since Fusion's flash configuration and analog blocks are proprietary. Also confirm industrial 'I' grade is required before specifying; commercial-grade variants save cost but are rated only to +85C.
Informações de conformidade
Compliance data not present in the provided verified web data. Consult the official Microchip product page or RoHS certificate for the M1AFS1500-1FGG484I before procurement.
