M1AFS250-1FG256 vs M1AFS250-2FGG256I Comparação
Comparação detalhada lado a lado de M1AFS250-1FG256 por Microchip Technology e M1AFS250-2FGG256I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
M1AFS250-1FG256 - 250K Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS250-1FG256 ✓ AtivoMicrochip Technology
M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-2FGG256I ✓ AtivoComparação de especificações
| Parâmetro | M1AFS250-1FG256 | M1AFS250-2FGG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $117,83 | $83,12 |
| Family | Fusion (M1 series, mixed-signal FPGA) | Actel Fusion (Mixed-Signal FPGA) |
| System Gates | 250000 gates | 250000 gates |
| Processor Core | ARM Cortex-M1 | — |
| User I/O | 114 | — |
| User Flash Memory | 36864 bits | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Technology | 130 nm flash-based | — |
| Maximum Performance | 1282.05 MHz (per FindIC spec summary) | — |
| Configuration | Flash-based, live at power-up | — |
| Security | 128-bit flash lock, AES decryption | 128-bit Flash lock, AES decryption |
| Encapsulamento | 256-LBGA (FG256) | 256-ball FBGA (FGG256) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Analog Blocks | Integrated configurable analog (Fusion) | — |
| Clock Management | Integrated clock generation and management circuitry | — |
| Temperatura de operação | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial, I grade) |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (FGG = Pb-free balls) |
| Registers (DFFs) | — | 36864 |
| User I/Os | — | 114 |
| Embedded Processor | — | ARM Cortex-M1 |
| Configuration Technology | — | Flash-based, nonvolatile |
| Process Technology | — | 130 nm, 7-layer metal CMOS |
| System Performance | — | Up to 350 MHz |
| Speed Grade | — | -2 |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |