M1AFS250-1FG256 vs M1AFS250-2FGG256I Comparaison
Comparaison détaillée côte à côte de M1AFS250-1FG256 par Microchip Technology et M1AFS250-2FGG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS250-1FG256 - 250K Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS250-1FG256 ✓ ActifMicrochip Technology
M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-2FGG256I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS250-1FG256 | M1AFS250-2FGG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $117,83 | $83,12 |
| Family | Fusion (M1 series, mixed-signal FPGA) | Actel Fusion (Mixed-Signal FPGA) |
| System Gates | 250000 gates | 250000 gates |
| Processor Core | ARM Cortex-M1 | — |
| User I/O | 114 | — |
| User Flash Memory | 36864 bits | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Technology | 130 nm flash-based | — |
| Maximum Performance | 1282.05 MHz (per FindIC spec summary) | — |
| Configuration | Flash-based, live at power-up | — |
| Security | 128-bit flash lock, AES decryption | 128-bit Flash lock, AES decryption |
| Boîtier | 256-LBGA (FG256) | 256-ball FBGA (FGG256) |
| Type de montage | Surface Mount | Surface Mount |
| Analog Blocks | Integrated configurable analog (Fusion) | — |
| Clock Management | Integrated clock generation and management circuitry | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial, I grade) |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant (FGG = Pb-free balls) |
| Registers (DFFs) | — | 36864 |
| User I/Os | — | 114 |
| Embedded Processor | — | ARM Cortex-M1 |
| Configuration Technology | — | Flash-based, nonvolatile |
| Process Technology | — | 130 nm, 7-layer metal CMOS |
| System Performance | — | Up to 350 MHz |
| Speed Grade | — | -2 |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |