M1AFS250-FG256I vs M1AFS250-FGG256 Comparação
Comparação detalhada lado a lado de M1AFS250-FG256I por Microchip Technology e M1AFS250-FGG256 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
M1AFS250-FGG256 - 250K-Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS250-FGG256 ✓ AtivoComparação de especificações
| Parâmetro | M1AFS250-FG256I | M1AFS250-FGG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $33,10 | $88,00 |
| Series | Fusion | — |
| Number of Gates | 250000 | — |
| Number of I/O | 114 | — |
| Total RAM Bits | 36864 | — |
| Number of Logic Elements | [DATA_NEEDED: Number of Logic Elements] | — |
| Tensão de alimentação | 1.425V ~ 1.575V | [DATA_NEEDED: core supply voltage] |
| Temperatura de operação | -40C ~ +100C (TJ) | [DATA_NEEDED: operating temperature range] |
| Encapsulamento / Caixa | 256-LBGA | — |
| Supplier Device Package | 256-FPBGA (17x17) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Product Status | Active | — |
| Manufacturer Lead Time | 16 weeks | — |
| Process Technology | 130nm, 7-layer metal, flash-based CMOS | — |
| System Performance | 350 MHz | — |
| Core | ARM Cortex-M1 | — |
| Speed Grade | [DATA_NEEDED: speed grade] | — |
| Status RoHS | RoHS Non-Compliant | RoHS Compliant |
| Lead Free Status | Contains Lead | Lead Free |
| Family | — | Fusion (M1 series, mixed-signal FPGA) |
| System Gates | — | 250,000 |
| Logic Cells | — | 6144 |
| User I/O | — | 114 |
| Embedded Processor | — | ARM Cortex-M1 (M1 variants) |
| Frequência máxima de clock | — | 350 MHz |
| Configuration Memory | — | Flash-based, live at power-up |
| Flash Memory Bits | — | 36864 |
| Technology | — | CMOS |
| Encapsulamento | — | 256-LBGA (FGG256), 1.0 mm ball pitch |
| Analog Peripherals | — | Configurable analog (voltage/temperature monitoring) |
| Clock Management | — | On-chip clock generation and management circuitry |