M1AFS250-FGG256 - 250K-Gate Fusion Mixed-Signal FPGA | Microchip
N.º da peça: M1AFS250-FGG256 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $124.14 | $124,14 |
| 10 | $118 | $1.180,00 |
| 100 | $104.51 | $10.451,00 |
| 500 | $96 | $48.000,00 |
| 1.000 | $88 | $88.000,00 |
M1AFS250-FGG256 Visão geral
A mixed-signal FPGA is a programmable logic device that combines digital fabric with configurable analog blocks and flash memory on a single monolithic die. In the system hierarchy, the M1AFS250 belongs to the Fusion family -> flash-based FPGA -> programmable SoC class of semiconductors, sitting alongside Microchip's ProASIC3 and Igloo device families.
Key features include flash-based, live-at-power-up programmability that eliminates external configuration PROMs and provides instant-on behavior, configurable analog peripherals for voltage and temperature monitoring, comprehensive on-chip clock generation and management circuitry, and a maximum clock frequency of 350 MHz according to distributor data. The device is fabricated in CMOS technology and operates from a single supply architecture typical of the Fusion family.
The architecture integrates the ARM Cortex-M1 processor, large flash memory blocks, analog conditioning and monitoring circuitry, and the Versatile fabric of lookup-table-based logic, enabling single-chip designs that previously required separate MCU, FPGA, voltage-monitor, and nonvolatile memory components.
Typical applications include industrial automation and motor control, power-supply supervision and smart power management, portable and battery-operated instrumentation, and aerospace/defense subsystems where flash-based, single-chip integration and low profile reduce BOM cost and board area.
A key design consideration is power and thermal budgeting: the 256-ball BGA must dissipate heat through the PCB, so adequate via arrays and copper pour under the package are recommended. Verify I/O bank voltage assignments early, since mixed-signal pin planning constrains floorplanning.
This page synthesizes distributor pricing from five sources, drop-in alternatives within the Fusion family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para M1AFS250-FGG256 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com M1AFS250-FGG256 (mesmo formato e footprint) — diferindo em System Gates, Package, Configuration Memory, RoHS Status, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
M1AFS250-FGG256I
✅ Drop-In✓ Em estoque
$49.5 / unidade
Ver ficha técnica →M1AFS250-FGG256Y
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
M1AFS250-2FGG256I
✅ Drop-In✓ Em estoque
$83.12 / unidade
Ver ficha técnica →M1AFS250-2FGG256
✅ Drop-In✓ Em estoque
$83.12 / unidade
Ver ficha técnica →M1AFS250-1FGG256Y
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
M1AFS250-FGG256 Classificações máximas e características elétricas
| Family | Fusion (M1 series, mixed-signal FPGA) |
| System Gates | 250,000 |
| Logic Cells | 6144 |
| User I/O | 114 |
| Embedded Processor | ARM Cortex-M1 (M1 variants) |
| Frequência máxima de clock | 350 MHz |
| Configuration Memory | Flash-based, live at power-up |
| Flash Memory Bits | 36864 |
| Technology | CMOS |
| Encapsulamento | 256-LBGA (FGG256), 1.0 mm ball pitch |
| Tipo de montagem | Surface Mount |
| Status RoHS | RoHS Compliant |
| Lead Free Status | Lead Free |
| Analog Peripherals | Configurable analog (voltage/temperature monitoring) |
| Clock Management | On-chip clock generation and management circuitry |
Guia de Configuração de Pinos do M1AFS250-FGG256 256-lbga (fgg256), 1.0 mm ball pitch
Configuração de pinos para M1AFS250-FGG256 (pacote 256-lbga (fgg256), 1.0 mm ball pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para M1AFS250-FGG256.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
M1AFS250-FGG256 é adequado para 6 aplicaçãos: Industrial Automation and Motor Control, Smart Power Management and Supply Supervision, Portable and Battery-Powered Instrumentation, Aerospace and Defense Subsystems, Test and Measurement Equipment, Building Automation and IoT Gateways.
Industrial Automation and Motor Control
The M1AFS250-FGG256 fits industrial automation nodes where programmable logic, system monitoring, and an embedded processor must coexist in one chip. Its 250,000 system gates and 6144 logic cells implement PWM generators, encoders, and state machines, while the ARM Cortex-M1 core handles protocol stacks such as CAN or Modbus. The configurable analog blocks monitor supply rails and motor temperature, replacing discrete supervisory ICs and saving board area on dense drives. Flash-based configuration makes the controller live at power-up with no external boot device, important for equipment that must respond within milliseconds of energization. The 114 user I/Os at 1.0 mm BGA pitch provide sufficient channels for sensor and actuator interfaces; designers should budget I/O bank voltages early since mixed-voltage assignments constrain routing.
Recomendado
Smart Power Management and Supply Supervision
Fusion's headline differentiator is integrated analog, making the M1AFS250-FGG256 well suited to smart power-management and power-supply supervision boards. The on-die configurable analog conditioning and monitoring circuitry tracks multiple voltage channels and on-chip temperature with programmable thresholds, closing control loops or flagging faults through the fabric without an external ADC or supervisor. The 36864-bit flash blocks store event logs and calibration data, while the Cortex-M1 executes housekeeping firmware. Because configuration is flash-based, monitoring begins essentially at power-up, eliminating the blind window of SRAM FPGAs that require configuration loading. The 256-ball BGA consolidates what would otherwise be an MCU, supervisor, ADC, and EEPROM cluster, reducing BOM count and improving mean time between failures in long-lived infrastructure power systems.
Recomendado
Portable and Battery-Powered Instrumentation
Handheld instruments benefit from the M1AFS250-FGG256's single-chip integration: logic glue, measurement sequencing, display interface, and firmware-controlled power gating all reside on one 1.0 mm-pitch BGA, minimizing board area and quiescent overhead compared with an MCU-plus-FPGA-plus-supervisor stack. The ARM Cortex-M1 sleeps while the fabric handles deterministic capture tasks, and the analog monitors watch battery voltage and die temperature with programmable alarms. Flash-based instant-on behavior lets the instrument be ready the instant the user presses power, an important usability trait. With 114 user I/Os there is room for keypads, LCD interfaces, and sensor front-ends. Designers should pay attention to the BGA's thermal path through the PCB, since portable enclosures limit airflow; adequate copper pour keeps junction temperature within the CMOS process envelope.
Recomendado
Aerospace and Defense Subsystems
Microsemi (now Microchip) FPGAs have a long heritage in aerospace programs, and the flash-based, single-chip M1AFS250 suits satellite payloads, avionics glue logic, and ground-support equipment where configuration-storage integrity matters. Flash cells retain configuration through radiation-induced SEU events affecting only registers, simplifying scrubbing architectures compared with SRAM FPGAs that lose their bitstream entirely. The integrated analog monitoring replaces external housekeeping circuitry, and the Cortex-M1 implements lightweight telemetry firmware. The 256-ball BGA's 1.0 mm pitch eases inspection for high-reliability assembly. Actel/Microchip also supplies space-grade relatives in the RTAX series available on XAIPART for radiation-critical missions. Verify program-specific screening flows (temperature grade, lot traceability) with the manufacturer, since commercial FGG256 parts differ in qualification level from dedicated aerospace orderable types.
Recomendado
Test and Measurement Equipment
Benchtop and modular instruments use the M1AFS250-FGG256 as a timing, interface, and housekeeping controller. The fabric's deterministic routing implements trigger engines, counters, and bus bridges, while the ARM Cortex-M1 manages SCPI command parsing and calibration routines. The 350 MHz maximum clock capability supports fast timing measurements, and on-chip clock generation and management circuitry simplifies distribution of a single reference to multiple clock domains, reducing jitter sources. Analog monitors watch internal rails and temperature, feeding self-test routines that lab instruments require. Flash configuration means the instrument is operational before an operator completes connection setup. With 114 I/Os, the device bridges front-panel peripherals, acquisition front-ends, and backplane interfaces in one monolithic CMOS die, cutting component count and improving long-term firmware maintainability.
Recomendado
Building Automation and IoT Gateways
Smart-building controllers and compact IoT gateways leverage the M1AFS250-FGG256 to merge connectivity bridging, sensor aggregation, and system health monitoring on one chip. The Cortex-M1 runs lightweight network firmware while the fabric implements custom peripherals such as multi-UART clusters, PWM dimming channels, and bit-banged proprietary sensor interfaces that fixed-function MCUs cannot match. Configurable analog inputs supervise the 24V field bus and enclosure temperature, raising alerts before failures propagate. The 36864-bit flash stores device configuration and fault logs locally, and flash-based boot means the controller resumes operation instantly after outages, which matters for always-on HVAC and lighting systems. Its single-chip 256-ball BGA footprint (about 17 mm square class) fits compact DIN-rail and ceiling-module form factors where multiple ICs would not.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para M1AFS250-FGG256 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | M1AFS250-FGG256I | M1AFS250-FGG256Y | M1AFS250-2FGG256I | M1AFS250-1FGG256Y |
|---|---|---|---|---|---|
| Package | 256-LBGA (FGG256), 1.0 mm pitch | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Cells | 6144 | 6144 | 6144 | 6144 | 6144 |
| User I/O | 114 | 114 | 114 | 114 | 114 |
| Speed Grade | Standard | Standard | Standard | -2 (faster) | -1 (slower) |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 |
| Configuration Type | Flash-based, live at power-up | Flash-based, live at power-up | Flash-based, live at power-up | Flash-based, live at power-up | Flash-based, live at power-up |
Principais diferenciais
- Integrated ARM Cortex-M1 hard processor (vs A3P600-1FG256I)
- Integrated analog monitoring replaces discrete supervisory ICs (vs M1AFS250-FGG256I (digital spec-identical))
- Flash-based, live-at-power-up configuration (vs SRAM FPGAs (e.g., Artix/Cyclone class))
Notas de projeto
The FGG256 is a 256-ball BGA with 1.0 mm ball pitch. Typical routing for this pitch class uses 4-6 signal layers with via-in-pad or dogbone fanout; verify your fabricator's minimum BGA pitch capability before layout. Provide a solid ground plane under the package and a dense via array connecting ground balls to the plane for both power integrity and thermal dissipation, since a BGA has no exposed heatsink pad - the PCB is the primary heat path.
The Fusion family uses multiple supply rails (core, I/O banks, analog). Estimate power with Microchip/Microsemi Libero SoC power tools after place-and-route, before finalizing regulators. Because configuration is flash-based and live at power-up, ensure rail sequencing reaches the appropriate levels before fabric operation; consult the Fusion family datasheet power-up section for allowed ramp rates and sequencing constraints rather than assuming SRAM-FPGA behavior.
Assign I/O standards and bank voltages in Libero SoC early: the 114 user I/Os are grouped into banks whose supply defines compatible standards, and mixed 3.3V/2.5V/1.8V assignments must not span banks incorrectly. Keep analog monitoring input traces short, guarded, and away from switching signals, since the on-die analog block accuracy depends on clean external routing. Series terminate fast single-ended outputs when trace lengths exceed roughly 1/6 of the signal rise-time electrical length.
Do not confuse FGG256 with FG256 package orderables: both are 256-ball parts but with different pitch/naming (Findchips lists M1AFS250-FG256I and M1AFS250-FGG256I as distinct parts), and the footprints are not interchangeable. Also confirm speed-grade selection in your Libero SoC project matches the ordered MPN suffix; a timing-closed design on a -2 part may fail timing on a -1 part.
Informações de conformidade
RoHS Compliant and Lead Free per DigChip datasheet specification record. REACH, halogen-free, and conflict-minerals status not stated in provided data - request certificates from Microchip.
