M1AFS600-2FG256 vs M1AFS250-2FG256I Comparação

Comparação detalhada lado a lado de M1AFS600-2FG256 por Microchip Technology e M1AFS250-2FG256I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
M1AFS600-2FG256 M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 ✓ Ativo
Microchip Technology
M1AFS250-2FG256I M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip

M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip

M1AFS250-2FG256I ✓ Ativo

Comparação de especificações

Parâmetro M1AFS600-2FG256 M1AFS250-2FG256I
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $46,75 $0,00
Series M1AFS600 (Fusion) —
System Gates 600000 gates 250K
Logic Elements 110592 —
Embedded Processor ARM Cortex-M1 —
Number of I/Os 119 I/O —
Core Supply Voltage 1.5 V 1.5 V
Technology 130 nm flash-based —
Encapsulamento / Caixa 256-LBGA (FBGA-256) —
Estilo de montagem SMD/SMT —
Operating Temperature - Minimum 0 C —
Operating Temperature - Maximum +70 C —
Packaging Tray Tray
Analog Peripherals Configurable analog block (Fusion mixed-signal) —
On-chip Memory Large flash memory blocks —
Clock Management On-chip clock generation and management (PLL) —
Configuration Flash-based, live at power-up, no external config PROM required —
Status RoHS [DATA_NEEDED: RoHS status] RoHS Non-Compliant (contains lead; FGG variant is lead-free)
Maximum Operating Frequency [DATA_NEEDED: maximum fabric operating frequency] —
Family — Fusion (M1AFS, ARM Cortex-M1 support)
User I/O — 114
Embedded RAM Bits — 36864
Process Technology — 130 nm, 7-layer metal flash-based CMOS
System Performance — 350 MHz
Processor Core — ARM Cortex-M1 (hard IP)
Configuration Memory — Flash-based, nonvolatile
Power-Up Mode — Live at Power-Up (LAPU)
Analog Block — Configurable analog (voltage, current, temperature monitoring)
Encapsulamento — 256-ball FBGA (256-LBGA)
Speed Grade — -2
Temperature Range — Industrial (-40C to +85C)
Tipo de montagem — Surface Mount

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